Abstract: A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.

Abstract: Methods for manufacturing and using an optical or optoelectronic device are disclosed. The optical or optoelectronic device and related methods may be useful as an optical or optoelectronic transceiver or for the processing of optical signals. The optical or optoelectronic device generally comprises a light-transmitting medium configured to transmit a first light beam; a light-receiving unit configured to receive and process a focused, reflected light beam; a first mirror or beam splitter configured to reflect at least a first portion of the transmitted light beam away from the light-receiving unit; a lens configured to focus the reflected light beam; and a second mirror configured to reflect the focused, reflected light beam towards the light-receiving unit.

Abstract: A communications system made up of a number of multi-channel optical node (MCON) platforms uses free space optical communications terminals that have the ability to track, detect, measure, and respond to the acceleration or movement of the platform. Instead of using mirrors or traditional beam steering techniques, the platform uses a series of telecentric lens systems to re-align the focal plane such that beams are maintained in original pointing directions. A network of control systems is used to detect and measure movement of the platform, to re-align the platform after such movement, and to maintain connection with a number of other MCON platforms.

Abstract: A thin-film flip-chip light emitting diode (LED) having a roughened surface and a method for manufacturing the same are provided. First, a substrate having a patterned structure on a surface of the substrate is provided, and the surface is roughened. A first semiconductor layer is then formed on the surface; a light emitting structure layer is then formed on the first semiconductor layer; a second semiconductor layer is then formed on the light emitting structure layer. The first and second semiconductor layers possess opposite electrical characteristics. A first contact electrode and a second contact electrode are then formed on the first semiconductor layer and the second semiconductor layer, respectively. Finally, a sub-mount is formed on the first and second contact electrodes, and the substrate is removed to form the thin-film flip-chip LED having the roughened surface. Here, the light emitting efficiency of the thin-film flip-chip LED is improved.

Abstract: Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Abstract: This invention provides ultra-low noise lasers with exceptional performance through the use of ultra-low loss microresonator based filters/reflectors including multiple (?3) microresonator rings with different ring radii. The ultra-low loss microresonators provide a long effective laser cavity length enabling very narrow linewidth laser operation, with multiple (?3) microresonators providing extremely high selectivity of the lasing mode over a very wide wavelength range; supporting single wavelength and widely tunable wavelength laser operation. The highly selective and also low loss filter/reflector supports high output power operation of the lasers.

Abstract: A method and apparatus are described including a laser with a plurality of internal or external actuators for affecting an optical frequency of light output by the laser, wherein the plurality of actuators have a corresponding plurality of different frequency response bands for changing optical properties of the laser and a corresponding plurality of actuation ranges of optical frequencies affected. Also included is an optical detector, and a plurality of optical paths configured to direct light output by the laser onto the detector. A laser controller is configured to provide a plurality of inputs to the plurality of actuators based on a detector signal output from the optical detector and the corresponding frequency response bands and actuation ranges.

Abstract: A photonic integrated circuit (PIC) is grown by epitaxy on a substrate. The PIC includes at least one active element, at least one passive element, and a dielectric waveguide. The at least one active and passive elements are formed over the substrate and are in optical contact with each other. The dielectric waveguide is formed over the substrate, and is in optical contact with the at least one active and passive elements. The at least one active and passive elements each are formed using a III-V compound semiconductor material.

Abstract: An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB.

Abstract: A light emitting diode (LED) package includes at least one light emitting unit having a first electrode and a second electrode, a first molding compound covering a part of the light emitting unit to expose the first electrode and the second electrode, and a first light transmissive plate disposed on the first molding compound opposite the light emitting unit. A side surface of the first molding compound and a side surface of the first light transmissive plate are coplanar or have even adjoined edges.

Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.

Abstract: A LED package structure including a carrier substrate, a flip-chip LED and a molding compound is provided. The carrier substrate includes a main body and a patterned conductive layer embedded in the main body. The main body is composed of polymer material. The main body has a cavity, and a bottom surface of the cavity is aligned with an upper surface of the patterned conductive layer. A difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C. The flip-chip LED is disposed inside the cavity and electrically connected to the patterned conductive layer. The molding compound is disposed inside the cavity and encapsulates the flip-chip LED. A vertical distance between a top surface of the molding compound and the bottom surface of the cavity is smaller than or equal to a depth of the cavity.

Abstract: The invention describes an integrated photonics platform comprising a plurality of at least three vertically-stacked waveguides which enables light transfer from one waveguide of the photonic structure into another waveguide by means of controlled tunneling method. The light transfer involves at least three waveguides wherein light power flows from initial waveguide into the final waveguide whilst tunneling through the intermediate ones. As an exemplary realization of the controlled tunneling waveguide integration, the invention describes a photonic integrated structure consisting of laser guide as upper waveguide, passive guide as middle waveguide, and modulator guide as lower waveguides. Controlled tunneling is enabled by the overlapped lateral tapers formed on the same or different vertical waveguide levels. In the further embodiments, the controlled tunneling platform is modified to implement wavelength-(de)multiplexing, polarization-splitting and beam-splitting functions.

Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.

Abstract: The present invention is directed to a stimulus monitoring process. The process includes exposing an RFID device to an environment. The RFID has characteristics that alter based on exposure to the environment, which in turn alter a response signal emanating from the RFID device in response to an interrogation signal.

Abstract: The present invention is directed to a stimulus monitoring system. The system includes an RFID device, item, interrogation device, and reception device. The RFID device includes a brace affixed to an inductor or capacitor. The brace is constructed from a material structurally responsive to a predetermined stimulus, such that stimulus-responsive structural alterations to the brace structurally alters the inductor, capacitor, or other RFID subcomponent of the RFID circuit capable of generating a current alteration, which in turn alters the signal frequency of the RFID.

Abstract: A laser material processing system which includes a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser emitted from one core of an optical fiber, where the broad band laser is applied to a subject material to produce removal of the subject material and/or color change of the subject material.

Abstract: Disclosed herein is a monolithically integrated coherent receiver chip which has a geometric arrangement of the on-chip components that significantly improves the performance and the manufacturability of a coherent receiver module for Dual Polarization Quadrature Phase Shift Keyed (DP-QPSK) applications and other optical coherent detection systems. The coherent receiver chip comprises two optical hybrids, three optical inputs and eight electrical outputs with the two optical hybrids oriented perpendicular to the optical inputs and the electrical outputs which are widely spaced and arranged in a co-linear fashion that simplifies module design and assembly. The proposed geometric arrangement also replaces any optical waveguide crossings with vertical electrical-optical crossings and includes electrical transmissions which are used to minimize channel skew. The proposed configuration also has the additional benefit of improved thermal management by separating the module's trans-impedance amplifiers.

Abstract: A laser diode assembly contains a plurality of laser diode chips packaged closely in a row. Each laser diode chip is bonded on both P-side and N-side to first and second sub-mounts. The sub-mounts are then attached to a cooling carrier, with both bonding surfaces perpendicular to the top surface of the carrier. The direction of laser radiation is parallel to the carrier top surface, and the distance between the top of the active area of the laser diode chip and the carrier is preferably in a range of half a pitch between individual laser sources packaged in a row or preferably in a range of 0.2 mm to 1 mm to allow efficient cooling for high power operation. The sub-mounts may be electrically conductive, or they may be of insulating material at least partially covered with a conducting layer. A laser diode chip is bonded uniquely to a set of sub-mounts or may share a sub-mount with another laser diode chip.