Abstract: Liquid crystal waveguides for dynamically controlling the refraction of light. Generally, liquid crystal materials may be disposed within a waveguide in a cladding proximate or adjacent to a core layer of the waveguide. In one example, portions of the liquid crystal material can be induced to form refractive or lens shapes in the cladding that interact with a portion (e.g. evanescent) of light in the waveguide so as to permit electronic control of the refraction/bending, focusing, or defocusing of light as it travels through the waveguide. In one example, a waveguide may be formed using one or more patterned or shaped electrodes that induce formation of such refractive or lens shapes of liquid crystal material, or alternatively, an alignment layer may have one or more regions that define such refractive or lens shapes to induce formation of refractive or lens shapes of the liquid crystal material.

Abstract: An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

Abstract: An image sensor for detecting a wide spectrum includes a plurality of infrared ray receiving layers which individually receive infrared rays having different wavelengths for each pixel, the plurality of infrared ray receiving layers stacked to each other. The image sensor, which is an integrated image sensor where at least two micro bolometers are stacked, acquires spectrum information about visible rays and near-infrared rays as well as two or more infrared rays applied on an object, without mechanical/thermal/optical distortion, and provides the spectrum information to a silicon-based semiconductor such as a photodiode, thereby improving photoelectric conversion efficiency.

Abstract: A tunable laser for providing a laser beam with a selectable wavelength. In one example, the tunable laser includes a gain medium for generating the laser beam; a waveguide for processing the laser beam, the waveguide having liquid crystal material or other electro-optic material disposed therein; an optical path length control element disposed within said waveguide for controlling an effective optical path length of the laser cavity; and a wavelength selective element for controlling the wavelength of the laser beam. The tunable laser may be designed without any moving mechanical parts if desired.

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables.

Abstract: A high speed electrical interconnection system is provided. The interconnection system comprises one or more electrical signal lines, or differential pairs of signal lines, and an inhomogeneous dielectric system. The dielectric system further comprises a homogeneous dielectric layer interposed between the electrical signal lines, and electrical conducting planes including a periodic array etched in the conducting material of the conducting plane. The inhomogeneous dielectric system exhibits a lower dielectric constant as compared to the dielectric constant of the homogeneous dielectric layer, resulting in lower microwave loss, reduced signal propagation delay, reduced signal skew, and increased signal bandwidth. The interconnection system may be implemented for connecting one or more high speed electron elements on-chip, off-chip, chip-chip connection on multilayer printed circuit boards, high speed die-package, high speed connectors, and high speed electric cables.

Abstract: A portable water filtration system filters water as it flows through an inlet of a conventional storage container and removes impurities before they enter the container. The filtration system is implemented within a cap that can attach to a variety of standard water storage containers, such as Nalgene™-type water bottles. When attached to the storage container, the cap seals around the container inlet and prevents the outer surface of the container inlet from contacting the water. To that end, two watertight seals are formed to isolate the outer surface of the inlet from any fluid communication, e.g., during a water-filling process. Because the outer surface of the inlet does not contact the unfiltered water, no contaminants can adhere to the inlet's surface and threaten a drinker's health if he/she drinks directly from the storage container after the cap is removed.

Abstract: A micro mirror device includes a first hinge supported by a substrate, a mirror plate tiltable around the first hinge and having a first set of arms facing the substrate, and a second set of arms on the substrate. The first set of arms and the second set of arms can be interdigitated when the mirror plate is tilted. The micro mirror device includes a first lateral guard on the substrate (or the mirror plate). The first lateral guard can limit movement of the mirror plate to a position in a first direction substantially parallel to an upper surface of the substrate to prevent the first set of arms from contacting the second set of arms when the arms are in the interdigitated position.

Abstract: The present invention relates to a photodiode of an image sensor using a three-dimensional multi-layer substrate, and more particularly, to a method of implementing a buried type photodiode and a structure thereof, and a trench contact method for connecting a photodiode in a multi-layer substrate and a transistor for signal detection.

Abstract: A packaged die includes a substrate having an upper surface and a micro device on the upper surface and an encapsulation cover comprising one or more grooves on its lower surface. The lower surface of the encapsulation cover and the upper surface of the substrate are bonded together to form a plurality of air-tight closed-loop interfaces and encapsulate the micro device.

Abstract: A method and device for moving optical beams including a conduit and an attached, independently movable structure that moves the conduit with up to 6 degrees of freedom both controlled and restricted as required. This structure may include a conductor positioned by an electromagnetic field generator. A cam or flexible capacitor plate or combination of such could also form the independently moveable structures. A control provides a current through the conductor, thereby providing a force on the conductor to move the conduit. A position sensor detects the position of the conduit and provides feedback to the control to aid in accurate and rapid movement.

Abstract: A method is provided for producing a thin-film device such as a photovoltaic device. The method begins by forming at least one semiconductor device on a first substrate. At least one secondary substrate having a plurality of indentations is attached to the at least one semiconductor device. The at least one semiconductor device is separated from the at least one first substrate.

Abstract: The apparatus and methods herein provide light sources and spectral measurement systems that can improve the quality of images and the ability of users to distinguish desired features when making spectroscopy measurements by providing methods and apparatus that can improve the dynamic range of data from spectral measurement systems.

Abstract: A phosphate glass 1-?m fiber ASE source provides high power and broadband emission that covers wavelengths on the short side of Yb-doped silica. A single-mode fiber formed from phosphate glass is doped with highly elevated concentrations of Yb dopants 0.5-30 wt. % and typically 2-10 wt. %, far higher than either silica or germano-silicate. The high concentration of Yb dopant absorbs the pump in a short length, typically 10-150 cm instead of tens of meters, to provide high saturated output power and a shifted emission spectrum. The excess power allows the fiber ASE source to be configured to provide the output powers, emission bandwidth and stability desired by many applications. Furthermore, the ASE can be configured to emit a nearly Gaussian spectral profile without sacrificing power or bandwidth.

Abstract: Methods of preparing front and back facets of a diode laser include controlling an atmosphere within a first chamber, such that an oxygen content and a water vapor content are controlled to within predetermined levels and cleaving the diode laser from a wafer within the controlled atmosphere of the first chamber to form a native oxide layer hating a predetermined thickness on the front and back facets of the diode laser. After cleavage, the diode laser is transported from the first chamber to a second chamber within a controlled atmosphere, the native oxide layer on the front and back facets of the diode laser is partially removed, an amorphous surface layer is formed on the front and back facets of the diode laser, and the front and back facets of the diode laser are passivated.

Abstract: A wearable or portable intermittently operable hydration system includes a purification module that contains one or more solid state UV devices that are positioned in the path of hydrating fluid, or water, flow through the hydration system to a mouthpiece or other orifice. The purification module provides a path for the fluid past one or more solid state UV devices, such as UV LEDs, that produce UV radiation in a germicidal range. When the fluid is flowing past the UV LEDs, the LEDs are turned on to provide sufficient UV radiation to purify the water. The UV LEDs are instant on devices with essentially no ramp-up required, and a sensor or other signaling means in to the flow path controls the turning on of the UV LEDs whenever the user initiates the fluid flow. The fluid flow path may run from a bladder in a backpack worn by the user, a sports bottle worn by or carried by the user or may be through a water filtration system that a user operates via a pump.

Abstract: Methods and devices for coupling the output light energy of one or more stacked laser emitter bar arrays using a beam interleaver and beam combiner to achieve high brightness and coupling efficiency. Some embodiments may include wavelength control devices and methods such as VIGs and the like.

Abstract: A high contrast spatial light modulator for display and printing is fabricated by coupling a high active reflection area fill-ratio and non-diffractive micro-mirror array with a high electrostatic efficiency and low surface adhesion control substrate.

Abstract: The invention is a method of producing an array, or multiple arrays of quantum dots. Single dots, as well as two or three-dimensional groupings may be created. The invention involves the transfer of quantum dots from a receptor site on a substrate where they are originally created to a separate substrate or layer, with a repetition of the process and a variation in the original pattern to create different structures.

Abstract: Multilayer high speed flex printed circuit boards (FLEX-PCBs) are disclosed including a dielectrics systems with the back-side trenches, adhesives, signal lines and ground planes, wherein the signal line and ground plane lane are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simply constructed multiplayer high speed FLEX-PCB using the conventional material and conventional FLEX-PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent connection reliability. As the effective dielectric constant is reduced, the signal width is required to make wider or the dielectric thickness is required to make thinner keeping fixed characteristics impedance.