Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: A method of fabricating a micro structure includes depositing amorphous silicon over a substrate having an electric circuit at a temperature below 550° C. to form a first structure portion, wherein at least part of the first structure portion is configured to receive an electrical signal from the electric circuit.

Abstract: Optical elements for efficiently diffusing or shaping light have substrates with saddle shaped structures on their surfaces which provide substantially uniform light along a predefined angular range. Each saddle shaped structure defines an aperture of a lens, where the outer boundary of such aperture, when viewed normal to surface, may be of one of more different shapes, such as square or rectangular, circular, hexagonal, oval, or other geometric or arbitrary shape which may represent a full saddle shape or a subset region thereof. A plurality of saddle shaped structures may be arranged periodically or randomly along the surface. An optical element with a saddle shaped structure is referred to as a saddle lens, and optical elements with different shaped saddle shaped structures provide different types of saddle lenses.

Abstract: A method utilizing spatially selective laser doping for irradiating predetermined portions of a substrate of a semiconductor material is disclosed. Dopants are deposited onto the surface of a substrate. A pulsed, visible beam is directed to and preferentially absorbed by the substrate only in those regions requiring doping. Spatial modes of the incoherent beam are overlapped and averaged, providing uniform irradiation requiring fewer laser shots. The beam is then focused to the predetermined locations of the substrate for implantation or activation of the dopants. The method provides for scanning and focusing of the beam across the substrate surface, and irradiation of multiple locations using a plurality of beams. The spatial selectivity, combined with visible laser wavelengths, provides greater efficiency in doping only desired substrate regions, while reducing the amount of irradiation required.

Abstract: A wafer containing a plurality of electro-optical devices, each device being enclosed in chamber that has a translucent cover. An X-Y matrix of pairs of interconnections on the wafer are connected to the circuitry of the electro-optical devices for addressing the electro-optical devices. The pairs of interconnections extend outside of the chambers enclosing the devices to testing areas on the periphery of the wafer. Testing is done by signals applied through the interconnections while simultaneously exposing the devices to light through the translucent covers.

Abstract: Formation of stretchable photovoltaic devices and carriers is described. In some examples, a formation method includes: forming a stretchable carrier including a stretchable part having a given length, the given length being operable to change in response to a force being applied to the stretchable carrier; depositing a photovoltaic cell over a surface of the stretchable carrier; and interconnecting the photovoltaic cell to output terminals.

Abstract: A stretchable photovoltaic device, a stretchable photovoltaic module and a carrier for facilitating formation of a stretchable photovoltaic device and/or module are provided. The stretchable photovoltaic device includes a stretchable part, at least one photovoltaic cell and a surface over which that at least one photovoltaic cell is disposed. The stretchable part has a given length that is operable to change in response to a force being applied to the device. The given length may, for example, elongate when the force causes the device to elongate. Alternative and/or additionally, the given length may compress when the force causes the device to compress.

Abstract: The invention describes the method and apparatus for enhanced efficiency in a laterally-coupled distributed feedback (LC-DFB) laser. In a device featuring the effective ridge design, lateral confinement of the guided optical modes is provided by a surface etched grating, which also serves as a DFB element of the laser. Coupling and quantum efficiency of such a LC-DFB laser both improve with an increase of the lateral mode order. In accordance with this invention, a dramatic enhancement of the laser efficiency is achievable by designing it to operate in one of the higher order modes, notably the first order mode, while all the other lateral modes, including the zero order mode, are suppressed through gain-loss discrimination.

Abstract: Lighting systems comprising a spectrum former upstream from a reflective pixelated spatial light modulator (reflective SLM), the SLM reflecting substantially all of the light in the spectrum into at least two different light paths, that do not reflect back to the light source or the spectrum former. At least one of the light paths acts as a projection light path and transmits desired light out of the lighting system. The lighting systems provide virtually any desired color(s) and intensity(s) of light, and avoid overheating problems by deflecting unwanted light and other electromagnetic radiation out of the system or to a heat management system. The systems can be part of another system, a luminaire, or any other suitable light source. The systems can provide virtually any desired light, from the light seen at the break of morning to specialized light for treating cancer or psoriasis, and may change color and intensity at speeds that are perceptually instantaneous.

Abstract: A MEMS device and fabrication method are disclosed. A bottom substrate having an insulating layer sandwiched between an upper layer and a lower layer may be bonded to a device layer. One or more portions of the upper layer may be selectively removed to form one or more device cavities. Conductive vias may be formed through the lower layer at locations that underlie the one or more device cavities and electrically isolated from the lower layer. Devices may be formed from the device layer. Each device overlies a corresponding device cavity. Each device may be connected to the rest of the device layer by one or more corresponding hinges formed from the device layer. One or more electrical contacts may be formed on a back side of the lower layer. Each contact is electrically connected to a corresponding conductive via.

Abstract: The inventive optical sensor consists of an LED semiconductor material and elements (herein after the LED components) surrounded by a transparent encapsulant that allows much of the light produced by the LED components to pass while a certain small percentage of the light is internally reflected. The percentage of light internally reflected, depends upon whether at least a front face of the encapsulant is immersed in liquid or in air. The optical liquid sensor also consists of a strategically placed photo sensor that detects the intensity of light that is internally reflected by at least the front face of the encapsulant surrounding the LED. The photo sensor is able to detect the change in intensity of light being internally reflected by at least the front face of the encapsulated LED when the front face, for example, emerges from immersion in a liquid.

Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.

Abstract: An encapsulated device includes a micro device on a substrate, a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device, and a desiccant material on the cover and in the chamber. An anti-stiction material is absorbed in the desiccant material.

Abstract: A micro-bolometer type infrared (IR) sensing device is provided. The IR sensing device includes an absorbed heat discharging part; a sensing structure part formed as bean structure, spaced apart from the absorbed heat discharging part, supported at least at one end on the absorbed heat discharging part, and discharging heat absorbed in the sensing structure part by being elastically deformed and thus touching the absorbed heat discharging part. The sensing structure part includes: a sensing part with variation in secondary attribute (for example, in electrical resistance property) according to heat; and a light-absorbing part formed into one unit with the sensing part in a manner to surround the sensing part as seen in section view, and converting energy of incident photons into heat. The sensing structure part discharges heat absorbed therein by being elastically deformed and thus touching the absorbed heat discharge part spaced apart downward from the sensing structure part.

Abstract: Switching optical signals containing a plurality of spectral channels characterized by a predetermined channel spacing is described. A selected beam deflector array may be selected from among a plurality of available beam deflector arrays configured to accommodate spectral channels of different channel spacings. The selected beam deflector array is configured to accommodate spectral channels of the predetermined channel spacing. The spectral channels are selectively optically coupled to the selected beam deflector array, which selectively optically couples the spectral channels between one or more input ports and one or more output ports.

Abstract: High speed printed circuit boards (PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, prepregs, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simple high speed PCB using the conventional material and conventional PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent reliability. According to this present invention, high speed PCB with the interconnect system contains whole portion or portion of interconnects for high speed chips interconnects and that have have the dielectric system with opened trench or slot to reduce the microwave loss.

Abstract: A photovoltaic device is provided which includes a plurality of junction layers. Each junction layer includes a plurality of photovoltaic cells electrically connected to one another. At least one of the junction layers is at least in part optically transmissive. The junction layers are arranged in a stack on top of each other.

Abstract: There is described an opto-electronic Integrated Circuit Board (ICB) comprising an ICB substrate; a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector; a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.

Abstract: An electronic device includes a circuit protection unit providing over-current protection to a main circuit and including a series connection of first and second current limiting circuits, and a normally-open branch circuit coupled in parallel to the first current limiting circuit and operable to conduct when a voltage across the first current limiting circuit reaches a first predetermined threshold voltage not greater than an endure voltage of the first current limiting circuit. Prior to conduction of the branch circuit, the first current limiting circuit maintains a current flowing therethrough at a first limit value when a current flowing through the main circuit reaches the first limit value. Upon conduction of the branch circuit, the second current limiting circuit maintains a current flowing therethrough at a second limit value greater than the first limit value when the current flowing through the main circuit reaches the second limit value.

Abstract: A semiconductor laser diode having increased efficiency and therefore increased power output. The laser diode includes a body of a semiconductor material having therein a waveguide region which is not intentionally doped so as to have a doping level of no greater than about 5×1016/cm3. Within the waveguide region is means, such as at least one quantum well region, for generating an optical mode of photons. Clad regions of opposite conductivity type are on opposite sides of the waveguide region. The thickness of the waveguide region, a thickness of at least 500 nanometers, and the composition of the waveguide and the clad regions are such so as to provide confinement of the optical mode in the waveguide region to the extent that the optical mode generating does not overlap into the clad regions from the waveguide region more than about 5%.