Patents Assigned to Precision, Inc.
  • Patent number: 6476552
    Abstract: The difference of luminance between a front surface side and a rear surface side as viewed from the front surface side is reduced in a multi-layered EL lamp. An EL lamp includes a first laminate formed by serially laminating a first transparent electrode, a first luminescent layer and a first insulating layer, a second laminate formed by serially laminating a second transparent electrode, a second luminescent layer and a second insulating layer on the first laminate, and a rear electrode formed on the second laminate, wherein a dielectric constant between the first and second transparent electrodes is set to a value smaller than a dielectric constant between the second transparent electrode and the rear electrode.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: November 5, 2002
    Assignee: Seiko Precision, Inc
    Inventor: Koji Yoneda
  • Patent number: 6473217
    Abstract: The space required in the vicinity of a shutter aperture can be reduced to achieve an overall reduction in size of a device by providing a diaphragm mechanism for covering the shutter aperture formed of a plurality of members cooperating with each other to cover the shutter aperture. By cooperation of a small-diaphragm plate having a diaphragm aperture formed therethrough smaller in diameter than the shutter aperture and an auxiliary plate, for example, a space reduction is facilitated. The small-diaphragm plate is pivotably mounted adjacent one side of the shutter aperture. The auxiliary plate has a shape that cooperates with the convex-arcuate portion to cover the shutter aperture. When the small-diaphragm plate and the auxiliary plate are driven by the diaphragm actuating member and moved to a first position covering the shutter aperture, the two plate cooperate to fully cover the shutter aperture.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: October 29, 2002
    Assignee: Seiko Precision Inc.
    Inventor: Seiichi Imano
  • Patent number: 6472816
    Abstract: The quality of an electroluminescent module is improved, and the production costs for it are reduced. In an electroluminescent module comprising a circuit board 1 and an electroluminescent element 2 as bonded to each other, the bonding electrode parts 3a, 3b via which the two 1 and 2 are bonded, are positioned in the facing opposite sides of the electroluminescent element 2, and the two are electrically connected and physically bonded via those parts 3a, 3b to thereby reduce the bonding space. Flexible, insulating resin layers 10a, 10b are provided between the transparent electrode layer 4a and the conductive layer 11 at the connecting electrode part 3a as electrically connected with the transparent electrode layer 4a and between the transparent electrode layer 4a and the back electrode layer 7 at the connecting electrode part 3b as electrically connected with the back electrode layer 7, respectively.
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: October 29, 2002
    Assignee: Seiko Precision, Inc
    Inventors: Hidetsugu Ikeda, Yoshikatsu Dobuchi
  • Publication number: 20020141082
    Abstract: A retention system for securing a stage mirror to the wafer stage of a semiconductor manufacturing device includes at least one first bracket and at least one second bracket. The retention system rigidly secures the stage mirror to the wafer stage during movement of the wafer stage to reduce positional measurement errors. The at least one first bracket has a substantially planar first contact surface for engaging the reflective surface of the mirror. The first contact surface is a finished aluminum surface, which does not scratch the mirror surface. The at least one first bracket is formed with a gusset providing increased stiffness in the direction of movement of the wafer stage. The at least one second bracket includes an actuator for moving a substantially planar second contact surface into engagement with a rear surface of the mirror. In one embodiment, the actuator is a threaded fastener and the second contact surface is a finished polyimide resin tip.
    Type: Application
    Filed: March 27, 2001
    Publication date: October 3, 2002
    Applicant: Nikon Precision Inc.
    Inventor: Scott A. Hagy
  • Patent number: 6451696
    Abstract: A method for reclaiming a wafer substrate material having a metallic film and a dielectric film includes a step for removing the entire metallic film and a part of the dielectric film with a chemical etching agent so as not to substantially dissolve the wafer substrate material itself, a step for removing the residual dielectric layer and the degenerated zone beneath the surface of the substrate by chemical-mechanical polishing, and a step for polishing at least one surface of the substrate.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: September 17, 2002
    Assignees: Kabushiki Kaisha Kobe Seiko Sho, Kobe Precision Inc.
    Inventors: Yoshihiro Hara, Tetsuo Suzuki, Satoru Takada, Hidetoshi Inoue
  • Patent number: 6449031
    Abstract: A method for forming a critical dimension test mark, and the use of the mark to characterize and monitor imaging performance is provided. Methods in accordance with the present invention encompass an exposure of an essentially standard critical dimension bar at each of two overlapping orientations that are rotated about an axis with respect to each other. The overlapped portion forming a critical dimension test mark that is useful for enabling low cost, rapid determination of sub-micron critical dimensions for characterizing exposure tool imaging performance and in-process performance monitoring using optical measurement systems.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: September 10, 2002
    Assignees: Nikon Corporation, Nikon Precision, Inc.
    Inventors: Ilya Grodnensky, Kyoichi Suwa, Kazuo Ushida, Eric R. Johnson
  • Patent number: 6435068
    Abstract: A mechanism for cutting an elongated material, such as insulated wire or fiber optic cabling. The cutting mechanism includes a stationary blade housing that includes a recessed blade receptacle. The blade receptacle receives an insert blade that is biased outward by a bias element. A cutting blade having a pair of guide legs is movable relative to the stationary blade housing and insert blade such that a cutting edge of the cutting blade interacts with a cutting edge of the insert blade to sever the elongated material. The cutting blade is received within a blade guideway formed between the blade housing and an attached guide block. The blade guideway guides the movement of the cutting blade between its retracted position and its extended position. As the cutting blade moves to the extended position, the guide legs of the cutting blade contact an outer face surface of the insert blade such that the insert blade and the cutting blade retain the desired orientation.
    Type: Grant
    Filed: September 17, 1999
    Date of Patent: August 20, 2002
    Assignee: Lakes Precision Inc.
    Inventor: Thomas A. Stuckart
  • Patent number: 6425698
    Abstract: A camera shutter has a set of opening shutter blades and a set of closing shutter blades. A shutter driver mechanism alternately displaces the opening and closing shutter blades to a first position wherein the blades are fanned-out and cover a shutter opening and a second position wherein the blades are retracted and do not cover the shutter opening. The shutter driver mechanism has an engaging pawl having a lower protrusion that pushes an upper protrusion on the top surface of an arm that supports the shutter blades when they are in the first position to thereby urge the shutter blades into intimate contact with each other. Prior to the start of an exposure, the lower protrusion stops pushing the upper protrusion so that the shutter blades can move freely during an exposure operation.
    Type: Grant
    Filed: April 2, 2001
    Date of Patent: July 30, 2002
    Assignee: Seiko Precision Inc.
    Inventor: Tadashi Nakagawa
  • Patent number: 6420886
    Abstract: A membrane probe card is provided. The membrane probe card includes a pressure mechanism having an upper-housing and a support block. The support block has a spring system for providing a distance of travel to the support block. A printed circuit board is coupled to the pressure mechanism for providing electrical connection to a test apparatus. A membrane assembly is coupled to the pads on a wafer for providing electric connection to the printed circuit board. The membrane assembly is a replaceable and modularized component for application to integrated circuits with various layouts and dimensions.
    Type: Grant
    Filed: April 20, 2000
    Date of Patent: July 16, 2002
    Assignee: Urex Precision, Inc.
    Inventors: Han-Shin Ho, Wei-Hai Lai, Chien-Shuan Kuo, Deng-Tswen Shieh, Wen-Cheng Hsu, Wea-Fun Fan, Hann-Tsong Wang, Yuh-Feng Chen
  • Patent number: 6413407
    Abstract: An ECM apparatus includes a fluted cathode tool for being driven through a tubular workpiece for electrochemically forming internal flutes therein. The cathode tool is sealed at one end for isolating electrolyte over the flutes thereof to seal against flow of the electrolyte past the tool and into the finished fluted bore.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: July 2, 2002
    Assignee: Lehr Precision, Inc.
    Inventors: Norbert Anthony Bruns, Edward Charles Bruns, Thomas Howard Chamberlain
  • Patent number: 6414477
    Abstract: A method for quantitatively determining probe card errors relying on merging data sets from a probe card analysis machine and a scrub mark analysis machine. Minimizing error values related to the data sets provides an indication of probe card/probe machine combination tolerance.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: July 2, 2002
    Assignee: Applied Precision, Inc.
    Inventor: John Strom
  • Patent number: 6406923
    Abstract: A process capable of reclaiming used semiconductor wafers with a reduced metallic contamination level on wafer surfaces. The process comprises the steps of removing one or more surface layers of the substrate by chemical etching; scraping off one surface of the substrate in small amount by mechanical machining; removing a damage layer, which has occurred due to the mechanical machining, by chemical etching; and polishing the other surface of the substrate into a mirror finish.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: June 18, 2002
    Assignees: Kobe Precision Inc., Kabushiki Kaisha Kobe Seiko Sho
    Inventors: Hidetoshi Inoue, Satoru Takada, Yoshihiro Hara
  • Patent number: 6402502
    Abstract: The apparatus is a hub bushing, called a gate insert, for an optical disc mold in which a thermally conductive but soft metal base structure is coated with a thin film physical vapor deposition or chemical vapor deposition coating which furnishes an extremely hard coating to protect the surfaces from wear. The base structure material of the gate insert is copper, aluminum, or a copper or aluminum based alloy, and typical materials used for the physical vapor deposition or chemical vapor deposition coating are titanium nitride, titanium carbide, or titanium carbonitride. Since the coating is only a few micrometers thick it has virtually no affect on the excellent thermal conductivity of the base structure, and the high thermal conductivity of the gate insert prevents quality degradation in the optical discs produced by the mold because the mold surfaces are prevented from having too great a difference in temperatures.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: June 11, 2002
    Assignee: Richter Precision, Inc.
    Inventors: Michael J. Selems, J. Hans Richter, Jeffrey C. Peinhardt, Yury Madoksky
  • Patent number: 6398325
    Abstract: A computer enclosure (10) includes a chassis (20), a hood (40), a handle (54), and a latch (60) attaching the hood to the chassis. A support bracket (30) is secured in the chassis, and defines a plurality of slots (38). The hood defines a recess (44) and two apertures (48). The handle is slidably received in the recess, and has two hollow cylinders (58) extending through the apertures. The latch defines two through holes (64) for extension of two screws (66) therethrough to engage with the cylinders, thus securing the handle to the latch. The latch has a plurality of hooks (62) corresponding to the slots of the support bracket. When the latch is in a first position, the hooks are engaged at the slots. When the latch is moved to a second position, the hooks are released from the slots, whereupon the hood is easily removed from the chassis.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: June 4, 2002
    Assignee: Hon Hai Precision Inc. Co., Ltd.
    Inventors: Yun Lung Chen, Kuo Chih Lin, Jung Chi Chen
  • Patent number: 6394668
    Abstract: A shutter for a camera has a sector driven by a movable board having plural spiral-shaped coil patterns concentrically arranged thereon for generating a repulsive or attractive magnetic field with respect to fixed permanent magnets or coils confronting the movable board. A desired generated magnetic force can be obtained by setting the number and winding direction of the coils and combining coils in a desired manner. A drive circuit is connected to the coils for controlling the supply of electricity thereto such that repulsive magnetic forces are generated while opening the shutter and attractive magnetic forces are generated while closing the shutter.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: May 28, 2002
    Assignee: Seiko Precision Inc.
    Inventor: Yoichi Nakano
  • Patent number: 6390691
    Abstract: A focal-plane shutter for a camera has a base plate having a shutter opening and which is connectable to a body of the camera having a rear cover which can be opened and closed during a film replacement operation. The focal-plane shutter has an opening sector group having sectors for undergoing opening movement in an operational state to open the shutter opening during a shutter release operation, and a closing sector group having sectors for undergoing closing movement in an operational state to close the shutter opening during the shutter release operation. A control device controls the opening sector group and the closing sector group to open and close the shutter opening, respectively. A holding device holds the closing sector group at a nonoperational position during an opening state of the rear cover of the camera and releases the hold of the closing sector group in the nonoperational position during a closing state of the rear cover of the camera.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: May 21, 2002
    Assignee: Seiko Precision Inc.
    Inventor: Tadashi Nakagawa
  • Patent number: 6383005
    Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises the following components. (1) A base unit, consisting of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) An interposer, comprising flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) An adapter unit, capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: May 7, 2002
    Assignee: Urex Precision, Inc.
    Inventors: Han-Shin Ho, Wei-Hai Lai, Chien-Shuan Kuo, Deng-Tswen Shieh, Ming-Hsien Wang, Chin-Ting Whung
  • Patent number: 6384415
    Abstract: A method of evaluating the quality of a silicon wafer is characterized by analyzing a silicon wafer by an infrared absorption spectrum, and then evaluating the quality of the silicon crystal based on an absorbance ratio represented by the following formula (1): {(Absorbance &agr;1 at an arbitrary wavenumber between 1055 and 1080 cm−1)−(Absorbance &agr;BL of base line)}/{(Absorbance &agr;2 at an arbitrary wavenumber between 1100 and 1120 cm−1)−(Absorbance &agr;BL of base line)}  (1) wherein absorbances &agr;1 and &agr;2 represent absorbances of the measured silicon wafer, and base line absorbance &agr;BL represents the absorbance of a base line of the measured silicon wafer, which is drawn from 1030 to 1170 cm−1. By using the quality evaluating method of the present invention, internal crystal defects of silicon can be precisely detected in a non-destructive manner.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: May 7, 2002
    Assignees: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe Precision Inc.
    Inventors: Tetsuo Suzuki, Kunio Otsuka
  • Patent number: 6382848
    Abstract: A shutter for a camera having a small size is driven by coil patterns formed in a spiral shape on at least one of a fixed printed board and a movable printed board. On faces of a shutter base plate and a sector ring opposed to each other, a cam mechanism for making the sector ring progress and regress in an optical axis direction is provided. The cam mechanism comprises end face cams arranged in a concentric shape and cam followers corresponding thereto to facilitate pivoting of the sector ring in closing the shutter by moving the cam followers along downwardly inclined faces of the cams.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: May 7, 2002
    Assignee: Seiko Precision Inc.
    Inventor: Yoichi Nakano
  • Patent number: 6384913
    Abstract: A laser transmitter is provided including a specialized compensator assembly damping mechanism. In accordance with one embodiment of the present invention, a compensator assembly position detector is arranged to detect a position X1 of the compensator assembly with respect to the X-axis, and a position Y1 of the compensator assembly with respect to the Y-axis. The compensator assembly damping mechanism includes an X-axis magnetic damping mechanism, a Y-axis magnetic damping mechanism, and a rotational damping mechanism. The active feedback circuit is arranged to (i) drive the X-axis magnetic damping mechanism so as to increase a damping force generated by the X-axis magnetic damping mechanism as a rate of change of the signal indicative of the position x1 increases, and (ii) drive the Y-axis magnetic damping mechanism so as to increase a damping force generated by the Y-axis magnetic damping mechanism as a rate of change of the signal indicative of the position y1 increases.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: May 7, 2002
    Assignee: Spectra Precision, Inc.
    Inventors: Frank Beard Douglas, James Nelson Hayes