Abstract: An interferometric modulating device is provided with a spacing layer positioned between the fixed reflector and the electrode. The spacing layer prevents shorting between the movable reflector and the electrode and provides a filtering cavity to improve color saturation.
Abstract: Embodiments of the present invention relate to interferometric display devices comprising an interferometric modulator and a solar cell and methods of making thereof. In some embodiments, the solar cell is configured to provide energy to the interferometric modulator. The solar cell and the interferometric modulator may be formed above the same substrate. A layer of the solar cell may be shared with a layer of the interferometric modulator.
Abstract: Power efficient power supply regulator circuits are disclosed. The circuits are configured to modify their overhead current according to current load. This is particularly advantageous for use in display devices with widely varying current loads. Such displays include bi-stable displays, such as interferometric modulation displays, LCD displays, and DMD displays.
Abstract: Various embodiments disclosed herein comprise a display device comprising a plurality of spatial light modulators and an illumination apparatus. The illumination apparatus comprising a light bar that guides light along a length thereof and turning microstructure disposed on top or bottom of the light bar. The turning microstructure directs the light out a side of the light bar. The illumination apparatus further comprises a light guide panel disposed with respect to the side of the light bar such that the light from the light bar is coupled to the light guide panel. The light guide panel is configured to direct the light coupled therein out of the light guide panel. The plurality of light modulators disposed with respect to the light guide panel to receive the light directed out of the light guide panel.
Type:
Application
Filed:
September 28, 2007
Publication date:
September 17, 2009
Applicant:
QUALCOMM MEMS TECHNOLOGIES, INC.
Inventors:
Marek Mienko, Gang Xu, Russell Wayne Gruhlke, Ion Bita
Abstract: Stiffeners in are provided in a flexible printed circuit to prevent damages to leads and traces of the flexible circuit caused by bending, folding and other stresses.
Abstract: A plurality of reflective spatial light modulator arrays combined together to form a larger display. Each array can include a plurality of light modulating elements disposed on a substrate. Dead space may exist between active areas and/or at a perimeter of the light modulating elements. A plurality of optical elements each having an input aperture and an output aperture can be used to reduce the effect of the dead space. The input apertures are disposed distally and the output apertures are disposed proximally respectively to the light modulating elements such that light received propagates exits the output apertures to the light modulating elements. The input apertures are larger than the output apertures thereby reducing the amount of dead space between active areas of light modulating elements seen be a viewer.
Abstract: A transmissive micromechanical device includes a substrate, an optical stack over the substrate and a moveable membrane over the optical stack. The moveable membrane may include a partially reflective mirror and be configured to move from a first position to a second position. When the movable membrane is in the first position the transmissive micromechanical device is configured to pass light of a predetermined color and when the movable membrane is in the second position, the micromechanical device is configured to block substantially all of light incident on the substrate.
Type:
Application
Filed:
February 10, 2009
Publication date:
September 10, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Surya Ganti, Kasra Khazeni, Jeff Sampsell
Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.
Type:
Application
Filed:
May 8, 2009
Publication date:
September 3, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc
Inventors:
Wen-Jian Lin, Brian Arbuckle, Brian Gally, Philip Floyd, Lauren Palmateer
Abstract: An interference modulator (Imod) incorporates anti-reflection coatings and/or micro-fabricated supplemental lighting sources. An efficient drive scheme is provided for matrix addressed arrays of IMods or other micromechanical devices. An improved color scheme provides greater flexibility. Electronic hardware can be field reconfigured to accommodate different display formats and/or application functions. An IMod's electromechanical behavior can be decoupled from its optical behavior. An improved actuation means is provided, some one of which may be hidden from view. An IMod or IMod array is fabricated and used in conjunction with a MEMS switch or switch array. An IMod can be used for optical switching and modulation. Some IMods incorporate 2-D and 3-D photonic structures. A variety of applications for the modulation of light are discussed. A MEMS manufacturing and packaging approach is provided based on a continuous web fed process.
Abstract: Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links.
Abstract: Methods and systems for electrical sensing, measurement and characterization of display elements are described. An embodiment includes integrating the electrical sensing, measurement and characterization with the display drive scheme. This embodiment allows for measurement of DC or operational hysteresis voltages and/or response times of interferometric modulator MEMS devices, for example, to be fully integrated with the display driver IC and/or the display drive scheme. Another embodiment allows these measurements to be performed and used without resulting in display artifacts visible to a human user. Another embodiment allows the measurement circuitry to be integrated with the display driver IC and/or the display drive scheme re-using several existing circuitry components and features, thus allowing for integration of the measurement method and its use relatively easily.
Abstract: Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate, forming a sacrificial layer over at least a portion of the substrate, forming a reflective layer over at least a portion of the sacrificial layer, and forming one or more flexure controllers over the substrate, the flexure controllers configured so as to operably support the reflective layer and to form cavities, upon removal of the sacrificial layer, of a depth measurably different than the thickness of the sacrificial layer, wherein the depth is measured perpendicular to the substrate.
Abstract: A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.
Type:
Grant
Filed:
September 29, 2006
Date of Patent:
August 25, 2009
Assignee:
Qualcomm Mems Technologies, Inc.
Inventors:
Alan G. Lewis, Manish Kothari, John Batey, Teruo Sasagawa, Ming-Hau Tung, Gregory D. U'Ren, Stephen Zee
Abstract: A power generating black mask comprising an anti-reflection layer deposited over a substrate, a first electrode layer deposited over the anti-reflection layer, a semi-conductor layer deposited over the first electrode layer and a second electrode layer deposited over the semi-conductor layer.
Abstract: Methods and systems for electrical sensing, measurement and characterization of display elements are described. An embodiment includes integrating the electrical sensing, measurement and characterization with the display drive scheme. This embodiment allows for measurement of DC or operational hysteresis voltages and/or response times of interferometric modulator MEMS devices, for example, to be fully integrated with the display driver IC and/or the display drive scheme. Another embodiment allows these measurements to be performed and used without resulting in display artifacts visible to a human user. Another embodiment allows the measurement circuitry to be integrated with the display driver IC and/or the display drive scheme reusing several existing circuitry components and features, thus allowing for integration of the measurement method.
Abstract: Displays, and methods of displaying images with the displays, which have quantized display characteristics for each of the pixels are disclosed. The displays and methods relate to both spatially and temporally dithering images so that the effective resolution of the display is higher than the result of the native spatial and intensity resolutions of the display, defined by pixel size, pitch, and number of quantization levels of each of the pixels.
Type:
Application
Filed:
May 15, 2008
Publication date:
August 13, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Louis Silverstein, Alan Lewis, Jennifer Lee Gille
Abstract: A method of tuning interferometric modulator display driving is disclosed. In one embodiment, the method comprising applying at least one voltage to an interferometric modulator display element, and while applying the voltage, adjusting a release and an actuation response time for the interferometric modulator. In another embodiment, the release and actuation response time are adjusted by adjusting the bias voltage applied to the device. Determining how to adjust the bias voltage may be done by measuring the current response of the device.
Abstract: An integrated illumination apparatus includes a light injection portion having a first end for receiving light from a light source. The light injection portion includes material that supports propagation of said light along the length of the light injection portion. Turning microstructure is disposed on a first side of the light injection. The turning microstructure is configured to turn at least a substantial portion of light incident on the first side and to direct the portion of the light out a second opposite side of the light injection portion. A slit is disposed along the length of the light injection portion. The slit forms an optical interface on the second opposite side of the light injection portion that provides total internal reflection for light propagating along the length of the light injection portion to be guided therein. The optical interface further transmits light turned by said turning microstructure.
Type:
Application
Filed:
December 23, 2008
Publication date:
August 13, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Mark Mienko, Gang Xu, Ion Bita, Lai Wang, Russell W. Gruhlke
Abstract: Various embodiments of the present invention relate to enhancing the brightness of displays that employ illumination systems. In some embodiments, the illumination systems include light guides, diffractive microstructure, and light-turning features. The diffractive microstructure may be configured to receive ambient light at a first angle and produce diffracted light at a second angle greater than the first angle and greater than the critical angle for of light guide. The light is thereby guided within the light guide. The light-turning features may be configured to turn the light guided within the light guide out of a light guide and onto, for example, a spatial light modulator at near normal incidence.
Type:
Application
Filed:
February 11, 2009
Publication date:
August 13, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Ion Bita, Gang Xu, Marek Mienko, Lai Wang, Russell W. Gruhlke
Abstract: In various embodiments described herein, a device comprising a light collector optically coupled to a photocell is described. The device further comprises a light turning film or layer comprising volume or surface diffractive features or holograms. Light incident on the light collector is turned by volume or surface diffractive features or holograms that are reflective or transmissive and guided through the light collector by multiple total internal reflections. The guided light is directed towards a photocell. In various embodiments, the light collector is thin (e.g., less than 1 millimeter) and comprises, for example, a thin film. The light collector may be formed of a flexible material.
Type:
Application
Filed:
February 11, 2009
Publication date:
August 13, 2009
Applicant:
QUALCOMM MEMS Technologies, Inc.
Inventors:
Ion Bita, Russell Wayne Gruhlke, Gang Xu, Marc Maurice Mignard