Abstract: A shading area having a transmissivity in the range of 0 to 2% is formed at the center of a clear defect in a wiring pattern of a half tone mask. Semitransparent areas having a transmissivity in the range of 10 to 25% are formed, adjacently to shading area, in areas extending from the inside of the edge of an imaginary pattern having no defect to the outside of the edge. In this way, in the correction of the defect in the half tone mask, the working accuracy tolerable margin of the correction portion of the defect can be made large.

Abstract: An internal voltage generating circuit generates and supplies a boosted voltage higher than an internal power supply voltage, as an operating power supply voltage, to a sense amplifier in a read circuit for reading data of a memory cell. A bit line precharge current supplied via an internal data line is produced from the internal power supply voltage. It is possible to provide a nonvolatile semiconductor memory device, which can perform a precise sense operation and an accurate reading of data even under a low power supply voltage condition.

Abstract: A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

Abstract: In order to provide a semiconductor device having a field effect transistor with a low power consumption and a high speed by use of the combination of Si and an element such as Ge, C or the like of the same group as Si, a strain is applied by a strain applying semiconductor layer 2 to a channel forming layer I having a channel of the field effect transistor formed therein so that the mobility of carriers in the channel is made larger than the mobility of carriers in that material of the channel forming layer which is unstrained.

Abstract: In a multiprocessor, one of two local memories can be accessed at a high speed by one of the two processors and also accessed by the other processor. In a multiprocessor, first and second local memories are coupled to first and second processors via first and second local buses. First and second bus bridges are coupled to a system bus and the first and second local buses. First and second bus interface units are coupled to the system bus and the first and second local memories. A high-speed access is made from the first processor to the first local memory via the first local bus. The first local memory is also accessed from the first processor via the first local bus, the first bus bridge, the system bus, and the first and third ports of the second bus interface unit and from the second processor via the second local bus, the second bus bridge, the system bus, and the second and third ports of the first bus interface unit.

Abstract: In a power semiconductor device, a joint between the power semiconductor element and frame plated with Ni is composed of a laminated structure comprising, from the power semiconductor element side, an intermetallic compound layer having a melting point of 260° C. or higher, a Cu layer, a metal layer having a melting point of 260° C. or higher, a Cu layer and an intermetallic layer having a melting point of 260° C. or higher. The structure of the joint buffers the stress generated by the secondary mounting and temperature cycle at the bond for the semiconductor element and the frame having a large difference in thermal expansion coefficient from each other.

Abstract: In a clock generating circuit, while a PLL (Phase-Locked Loop) circuit and a modulator are employed, when a frequency dividing ratio of a feedback-purpose frequency divider in the PLL circuit is changed in accordance with modulation data produced based upon a modulation profile of the modulator to perform a frequency modulation so as to spread a spectrum, a turning point of the modulation profile is moved so as to disperse a degree of frequency, so that the spread spectrum is re-spread. Also, a clock generating circuit is constituted by a PLL circuit and a modulator, a multiple modulation profile generating circuit is provided in the modulator, and a turning point of a modulation profile is moved so as to disperse a degree of frequency, so that a spread spectrum is re-spread.

Abstract: A semiconductor device with improved reliability is provided. The semiconductor device in a QFN package configuration has a semiconductor chip mounted on a tab, leads which are alternately arranged around the tab and electrically connected to the electrodes of the semiconductor chip via bonding wires, and an encapsulating resin portion for encapsulating therein the semiconductor chip and the bonding wires. The lower exposed surfaces of the leads are exposed at the outer peripheral portion of the back surface of the encapsulating resin portion to form external terminals. The lower exposed surfaces of the leads are exposed at the portion of the back surface of the encapsulating resin portion which is located inwardly of the lower exposed surface of the leads to also form external terminals.

Abstract: A non-volatile storage device (1) has non-volatile memory units (FARY0 to FARY3), buffer units (BMRY0 to BMRY3) and a control unit (CNT), and the control unit can control a first access processing between an outside and the buffer unit and a second access processing between the non-volatile memory unit and the buffer unit upon receipt of directives from the outside separately from each other. The control unit can independently carry out an access control over the non-volatile memory unit and the buffer unit in accordance with the directives sent from the outside, respectively. Therefore, it is possible to set up next write data to the buffer unit simultaneously with the erase operation of the non-volatile memory unit or to output once read storage information to the buffer unit at a high speed as in a cache memory operation in accordance with the directive sent from the outside.

Abstract: The present invention enhances the reliability of a semiconductor device. The semiconductor device includes a package substrate having a dry resist film which covers some conductive portions out of a plurality of conductive portions formed on a main surface and a back surface and is formed of a film, a semiconductor chip which is mounted over the package substrate, conductive wires which electrically connect the semiconductor chip with the package substrate, a die-bonding film which is arranged between the main surface of the package substrate and the semiconductor chip, a plurality of solder bumps which are formed on the back surface of the package substrate, and a sealing body which is made of resin.

Abstract: A first stage of a pipeline A/D converter is configured to output a sub analog signal at a level within a predetermined output voltage range even if a level of an input analog signal exceeds a predetermined input voltage range. Therefore, as compared with an example where a limiter circuit is provided on an input side of each stage, a pipeline A/D converter occupying a small area, consuming low power, and having small errors can be provided.

Abstract: A semiconductor device having improved performance and improvement manufacturing yield is provided. After a semiconductor integrated circuit including a phase change memory and a nonvolatile memory other than a phase change memory is formed in a semiconductor substrate, an inspection step such as a probe inspection is performed. In accordance with the result of the inspection, data is stored in the nonvolatile memory other than a phase change memory. At this stage, the data is not stored in the phase change memory. Then, the semiconductor substrate is cut by dicing or the like into separate pieces corresponding to individual semiconductor chips. Each of the separate pieces of semiconductor chips is packaged.

Abstract: In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of the semiconductor chip is inspected, the thermosetting resin is baked at a temperature higher than the resin sealing temperature in said resin sealing step.

Abstract: A method of communicating information in a communication network with a plurality of hierarchically addressed nodes includes receiving communication packets identifying 1-hop neighbor node addresses, a number of on-tree neighbors of neighbor nodes transmitting the received packets, and forwarding node addresses of forwarding nodes from which information in the received packets are to be rebroadcast. Further, the method includes identifying each 1-hop neighbor node which should be a forwarding node based on stored addresses and numbers of on-tree neighbors, and producing and transmitting a rebroadcast packet including addresses of forwarding nodes. A communication network system, a communication node in a communication network, and a computer program product include similar features. Communication packets embodied in an electromagnetic wave includes an address, a number of on-tree neighbors of neighbor nodes, and forwarding nodes from which the packets are to be rebroadcast.

Abstract: A voltage impressed across the drain and source is reduced by further connecting in series one or two or more transistors between a couple of transistors in an output circuit including an output stage formed by connecting in series a couple of output transistors between a couple of power source voltage terminals and outputting the signal supplied to a gate signal generating circuit of a liquid crystal panel. Simultaneously, potential setting switch elements are also provided to prepare an intermediate potential of a couple of power source voltages and impress the intermediate potential to a base material of output transistors of the OFF state while the output transistors are turned OFF. Thereby, a liquid crystal display driving semiconductor integrated circuit may be realized.

Abstract: A cleaning sheet (29) is formed with a trough-hole (29a) at a portion corresponding to a cavity of a mold along with a slit (29b) or a flow cavity cut (29c) at every corner at an outer periphery of the through-hole (29a) and is placed between a first mold half and a second mold half of the mold to clean the inside of the mold, thereby improving the cleaning effect of the mold.

Abstract: A semiconductor device capable of accessing to the memory with a high speed, and including a memory with a large capacity. The semiconductor device includes a plurality of memory banks (Bank) 1 to 3 where the write cycle time is twice as long as the read cycle and each provided with the separate write and read ports, and two cache data banks CD0 and CD1, in which, for example, in the case that an external write instruction with continuous cycles is issued in cycle #2, the data of Bank 2 stored in CD1, Row 2 cannot be written back since Bank 2 is busy with the cycle #1, the data of Bank 0 stored in CD 0, Row 2 can be written back instead.

Abstract: A plurality of conductive layers and a plurality of wiring layers connecting a supporting substrate having SOI structure and uppermost wire are formed along a peripheral part of a semiconductor chip together with the uppermost wire, to thereby surround a transistor forming region in which a transistor is to be formed.

Abstract: A level shift element adjusting a voltage level at the time of selection of a word line according to fluctuations in threshold voltage of a memory cell transistor is arranged for each word line. This level shift element lowers a driver power supply voltage, and transmits the level-shifted voltage onto a selected word line. The level shift element can be replaced with a pull-down element for pulling down the word line voltage according to the threshold voltage level of the memory cell transistor. In either case, the selected word line voltage level can be adjusted according to the fluctuations in threshold voltage of the memory cell transistor without using another power supply system. Thus, the power supply circuitry is not complicated, and it is possible to achieve a semiconductor memory device that can stably read and write data even with a low power supply voltage.

Abstract: Logic LSI includes first power domains PD1 to PD4, thick-film power switches SW1 to SW4, and power switch controllers PSWC1 to PSWC4. The thick-film power switches are formed by thick-film power transistors manufactured in a process common to external input/output circuits I/O. The first power domains include second power domains SPD11 to SPD42 including logic blocks, control circuit blocks SCB1 to SCB4, and thin-film power switches SWN11 to SWN42 that are connected to the thick-film power switches via virtual ground lines VSSM1 to VSSM4, and formed by thin-film power transistors manufactured in a process common to the logic blocks. In this way, power switches having different thickness of gate insulating films from one another are vertically stacked so as to be in a hierarchical structure, and each power switch is individually controlled by a power switch controller and a control circuit block correspondingly to each mode.