Abstract: A semiconductor memory device includes a plurality of N and P channel MOS transistors. The plurality of MOS transistors are formed on an SOI (Silicon On Insulator) substrate. Each MOS transistor includes a source region, a drain region, and a body region located between the source region and the drain region. The body region of at least one N channel MOS transistor is electrically fixed. The body region of at least one P channel MOS transistor is rendered floating.

Abstract: The data for being processed are transmitted by utilizing a daisy chain constitution using a plurality of semiconductor integrated circuit devices each having an input terminal for receiving an input signal containing any one of an instruction, a data, a position where the data exists or a timing signal, and an output terminal for producing a signal formed in an internal circuit in response to the input signal or fed through the input terminal, wherein among the plurality of semiconductor integrated circuit devices, the output terminal of the semiconductor integrated circuit device in the preceding stage and the corresponding input terminal of the semiconductor integrated circuit device of the next stage are connected together.

Abstract: The present invention provides a sense circuit for DRAM memory cell to cover the events that a sense time becomes remarkably longer when a power source voltage is lowered, a sense time under the low voltage condition becomes shorter when temperature rises and a sense time changes to a large extent for fluctuation of processes. The present invention provides the following typical effects. A switch means is provided between the bit line BL and local bit line LBL connected to the memory cells for isolation and coupling of these bit lines. The bit line BL is precharged to the voltage of VDL/2, while the local bit line LBL is precharged to the voltage of VDL. The VDL is the maximum amplitude voltage of the bit line BL. A sense amplifier SA comprises a first circuit including a differential MOS pair having the gate connected to the bit line BL and a second circuit connected to the local bit line LBL for full amplitude amplification and for holding the data.

Abstract: A memory cell of a memory array stores two bits. A memory array sense amplifier provides two bits in a verify operation. Two bits in a page buffer stores a write target value for the corresponding memory cell. Each bit in a mask buffer stores a value defining processing to be effected on the corresponding memory cell. A write driver applies a write pulse when the bit in the mask buffer corresponding to the selected memory cell is “0”. A verify circuit compares the two bits provided from the memory array sense amplifier with the corresponding two bits in the page buffer, and changes the corresponding bit in the mask buffer from “0” to “1” when the result of the comparison represents matching.

Abstract: In a semiconductor device particularly including a phase change material, the reliability of the read-out operation is improved. In a read-out operation of a phase change memory, a bit line to be read out is precharged in advance with a sufficiently low voltage that can prevent the destructive read operation. In this state, after a word line is activated and a period in which the voltage is sufficiently discharged via a storage element which is in a low resistance state elapses (first read out), charge sharing is performed between the bit line and a read bit line of a sense amplifier which is precharged to a high voltage, and a read-out operation is performed again (second read out). Consequently, the read-out signal amount can be increased while suppressing the read current.

Abstract: A data transfer control apparatus has a plurality of bus slaves connected to a bus master via a bus interface unit for RAM connected to the bus master via a master bus, and a transfer bus which connects the first bus slave and plural second bus slaves in the plurality of bus slaves. When an instruction to execute data transfer via the transfer bus is given by a transfer instruction signal, data transfer between one second bus slave selected from the plural second bus slaves and the first bus slave via the transfer bus is carried out in response to a control signal contained in a control signal bus on a slave bus for RAM.

Abstract: A communication semiconductor integrated circuit device is capable of transmission in two or more different modulation modes and outputting transmission signals with less distortion. The communication semiconductor integrated circuit device comprises a gain variable amplification circuit which amplifies I-signals and Q-signals; and a mixer circuit which synthesizes the amplified I-signals and Q-signals and local oscillation signals to carry out modulation and frequency conversion. The communication semiconductor integrated circuit device is capable of transmission in two or more different modulation methods, for example, in GSM mode and EDGE mode. A low-pass filter of second or higher order is placed between the gain variable amplification circuit and the mixer circuit.

Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.

Abstract: Disclosed is a non-volatile semiconductor memory device that uses a inversion layer provided on a semiconductor substrate as a data line. The memory device can reduce variation of characteristics among memory cells and can reduce bit cost. A plurality of assist gates are formed in the upper part of a p-type well through a gate oxide film. In the upper part of an interlayer insulator that covers those assist gates are formed word lines that are used as control electrodes. The width of those word lines is, for example, 0.1 ?m, and each word line is separated from its adjacent word lines by a side wall spacer that is a silicon oxide film having a thickness of about 20 nm.

Abstract: An MTJ memory cell is independently provided with a write word line and a read word line used for data write and data read. By separately arranging read word lines every two regions formed by dividing a memory array in the column direction, it is possible to reduce signal propagation delays of the read word lines and accelerate the data read operation. Activation of each read word line is controlled by a write word line in accordance with a row selection result in a hierarchical manner. A word-line-current control circuit forms and cuts off the current path of a write word line correspondingly to data write and data read.

Abstract: A semiconductor device includes: multiple kinds of interlayer insulating films formed on a semiconductor substrate and having different elastic moduli, respectively; a metal pad arranged on said multiple kinds of interlayer insulating films; the interlayer insulating film of a low elastic modulus having the lowest elastic modulus and having an opening located under the metal pad, the interlayer insulating film of a not-low elastic modulus having the elastic modulus larger than the elastic modulus of the interlayer insulating film of the low elastic modulus, being layered in contact with the interlayer insulating film of the low elastic modulus, and continuously extending over the opening and a region surrounding the opening and a metal interconnection layer arranged under the metal pad, filling the opening in the interlayer insulating film of the low elastic modulus, and being in contact with the interlayer insulating film of the not-low elastic modulus.

Abstract: When to a memory cell array 21 a read/write operation is performed of the 7-bit data in which parity bits of 3 bits are added to data of 4 bits, an error correction is carried out in concern to each of the 7-bit data. The memory cell array is divided into memory units 31 to 37 each of which has four bits which are arranged along a direction of a word line. On writing the 7-bit data in the memory cell array, bits of the 7-bit data that are different from one another are written as written bit data along the direction of the word line in the memory units 31 to 37, respectively. In the 7-bit data, the written bit data has an interval of four bits. Error correcting circuits performs an error correction of the 7-bit data in each of the 7-bit data.

Abstract: In a split gate type nonvolatile memory cell in which a MOS transistor for a nonvolatile memory using a charge storing film and a MOS transistor for selecting it are adjacently formed, the charge storing characteristic is improved and the resistance of the gate electrode is reduced. In order to prevent the thickness reduction at the corner portion of the charge storing film and improve the charge storing characteristic, a taper is formed on the sidewall of the select gate electrode. Also, in order to stably perform a silicide process for reducing the resistance of the self-aligned gate electrode, the sidewall of the select gate electrode is recessed. Alternatively, a discontinuity is formed between the upper portion of the self-aligned gate electrode and the upper portion of the select gate electrode.

Abstract: Any damage inflicted on test pads, inter-layer insulating films, semiconductor elements or wiring at the time of electrical inspection of semiconductor integrated circuit devices is to be reduced. Reinforcements having a substantially equal linear expansion ratio (coefficient of thermal expansion) relative to a wafer to be inspected are formed over an upper face of a thin film probe, grooves are cut in the reinforcements above the probes, a first elastomer which is softer than a second elastomer is so arranged as to fill the grooves and overflow the grooves by a prescribed quantity, a glass epoxy substrate, which is a multi-layered wiring board, is fitted over the second elastomer, and pads provided over an upper face of the glass epoxy substrate and bonding pads which are part of wirings belonging to the thin film probe are electrically connected by wires.

Abstract: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.

Abstract: In order to improve the discharging speed of potential from a match line, a semiconductor device includes a capacitor, a memory transistor having a source/drain region connected to a storage node of the capacitor, a search transistor having a gate electrode connected to the storage node, and a stacked contact connecting a match line and the source/drain region of the search transistor. The storage node has a configuration in which a sidewall of the storage node facing the match line partially recedes away from the stacked contact such that a portion of the sidewall in front of the stacked contact in plan view along the direction of the match line is located farther away from the stacked contact than the remaining portion of the sidewall.

Abstract: According to a method of erasing data in a non-volatile semiconductor memory device, block-round type overerase verify is performed. Specifically, overerase verify and write back are performed sequentially from a first address to a last address. That is, even when a write back pulse is applied after a certain address is selected and verify is performed, address increment from one address to another is performed, regardless of whether verify has been performed or not. Therefore, it is not that the same address is cumulatively rewritten, but write back to a memory cell corresponding to a defective address is sequentially and gradually performed. Accordingly, as write to a memory cell in an overerased state can evenly be performed, influence by off-leakage is suppressed, and a memory cell having threshold voltage distribution with less variation can be implemented.

Abstract: A semiconductor processing device is provided which includes a nonvolatile memory unit, a voltage generating unit, and a first terminal. The voltage generating unit generates a first voltage generated from an operation voltage provided from outside of the semiconductor processing device and provides the first voltage to the nonvolatile memory unit for storing data therein. The first terminal provides the first voltage generated by the voltage generating unit to outside of the semiconductor processing device. This first voltage provided to outside of the semiconductor processing device via the first terminal permits checking a voltage level of the first voltage and correcting this voltage level.

Abstract: A semiconductor device includes an interlayer insulation film, an underlying line provided in the interlayer insulation film, a liner film overlying the interlayer insulation film, an interlayer insulation film overlying the liner film. The underlying line has a lower hole and the liner film and the interlayer insulation film have an upper hole communicating with the lower hole, and the lower hole is larger in diameter than the upper hole. The semiconductor device further includes a conductive film provided at an internal wall surface of the lower hole, a barrier metal provided along an internal wall surface of the upper hole, and a Cu film filling the upper and lower holes. The conductive film contains a substance identical to a substance of the barrier metal. A highly reliable semiconductor device can thus be obtained.

Abstract: A semiconductor device includes an interlayer insulation film, an underlying line provided in the interlayer insulation film, a liner film overlying the interlayer insulation film, an interlayer insulation film overlying the liner film. The underlying line has a lower hole and the liner film and the interlayer insulation film have an upper hole communicating with the lower hole, and the lower hole is larger in diameter than the upper hole. The semiconductor device further includes a conductive film provided at an internal wall surface of the lower hole, a barrier metal provided along an internal wall surface of the upper hole, and a Cu film filling the upper and lower holes. The conductive film contains a substance identical to a substance of the barrier metal. A highly reliable semiconductor device can thus be obtained.