Abstract: The reliability of data is significantly increased without considerably increasing costs by performing minor data corrections within an information storage device and performing major error corrections in an information processing device. When a request to transfer user data for reading is issued from an information processing device, a control circuit transfers the user data and management data to an error detection circuit, which checks the user data for errors. If the user data contains no error, the control circuit notifies the information processing device that the user data can be transferred, and transfers it to the information processing device. If the user data contains errors, an X count error position and correction data calculation circuit uses the user data and the management data to calculate correction locations and correction data, and judges whether the correction locations are correctable.

Abstract: An image sensor such as the conventional CMOS image sensor, in which automatic controls including so-called automatic iris control and white balance adjustment for adjusting the sensor sensitivity, namely the charge accumulation time in each pixel, according to the brightness of the image sensing ambience are performed, involves the problem that, when the frame rate of the image sensor is slowed to save power consumption, the operation of the automatic control systems will also become slower and the image quality deteriorates. In the invented image sensor system using a CMOS image sensor, while a CMOS image sensor is operated at the full frame rate all the time, a circuit for processing image signals from the CMOS image sensor is operated at a speed close to that of full frame processing only when the power supply is turned on or when the image sensing ambience varies and switched to a lower frame processing speed when automatic controls, including iris control, have become stabilized.

Abstract: A sense amplifier capable of performing high-speed data sense operation with lower power consumption using a minuscule signal from a memory cell even in a case where a memory array voltage is reduced. A plurality of drive switches for over-driving are distributively arranged in a sense amplifier area, and a plurality of drive switches for restore operation are concentratively disposed at one end of a row of the sense amplifiers. A potential for over-driving is supplied using a meshed power line circuit. Through the use of the drive switches for over-driving, initial sense operation can be performed on data line pairs with a voltage having an amplitude larger than a data-line amplitude, allowing implementation of high-speed sense operation. The distributed arrangement of the drive switched for over-driving makes it possible to dispersively supply current in sense operation, thereby reducing a difference in sense voltage with respect to far and near positions of the sense amplifiers.

Abstract: As external connection terminals for an emitter electrode (12) of an IGBT chip, a first emitter terminal (151) for electrically connecting a light emitter in a strobe light control circuit to the emitter electrode (12) and a second emitter terminal (152) for connecting a drive circuit for driving an IGBT device to the emitter electrode (12) are provided. The first emitter terminal (151) and the second emitter terminal (152) are individually connected to the emitter terminal (12) by wire bonding.

Abstract: For a nonvolatile memory permitting electrical writing and erasing of information to be stored, such as a flash memory, the load on the system developer is to be reduced, and it is to be made possible to avoid, even if such important data for the system as management and address translation information are damaged, an abnormal state in which the system becomes unable to operate.

Abstract: A drive control device of a DC brushless multi-phase motor performs the speed control of the motor in place microprocessor, the burden on the microprocessor is relieved. The drive control device detects a zero crossing point of the back electromotive force in the non-energizing phase to perform the energizing switching to the coils by the PLL control, and includes a current detection circuit that detects currents flowing through the coils to perform the speed control of the motor based on the detected currents. The drive control device also, compares outputs from speed error detection circuit with outputs from the current detection circuit to determine the currents to be made to flow through the coils, and thereby controls the current output circuit.

Abstract: A CBCM circuit is capable of separately measuring each component of a measuring target capacitance. A node (N1) is electrically connected to a terminal (P2) between the drains of PMOS and NMOS transistors (MP2, MN2). As a target capacitance forming part, a coupling capacitance (Cc) is formed between the node (N1) and a node (N2). The node (N2) is connected to a pad (58) through the terminal (P2) and an NMOS transistor (MN3), and a node (N3) is connected to a terminal (P3) between the drains of PMOS and NMOS transistors (MP1, MN1). A reference capacitance (Cref) is formed at the node (N3) as a dummy capacitance. Currents (Ir, It) supplied from a power source to the nodes (N3, N1) are measured with current meters (61, 62), respectively and a current (Im) induced from the node (N2) and flowing to a ground level is measured with a current meter (63).

Abstract: A semiconductor integrated circuit device provided with a first circuit block BLK1, a second circuit block DRV1 and a conversion circuit MIO1 for connecting the first circuit block to the second circuit block. The first circuit block includes a first mode for applying a supply voltage and a second mode for shutting off the supply voltage. The conversion circuit is provided with a function for maintaining the potential of an input node of the second circuit block at an operation potential, thereby suppressing a penetrating current flow when the first circuit block is in the second mode. The conversion circuit (MIO1 to MIO4) are commonly used for connecting circuit blocks.

Abstract: An overall motion detecting device (1) includes a search region variable-shaped motion detector (2) and an overall motion information generator (3). The overall motion information generator (3) controls a surveillance camera (5) which is an external image capturing system and supplies control information of the surveillance camera (5) (such as moving direction, angular speed and focal length) to the search region variable-shaped motion detector (2) as overall motion information (S3). The search region variable-shaped motion detector (2) calculates a motion vector (mv) while renewing, by picture, a search region having a search shape determined by the overall motion information (S3) and a region area suitable for its operational capability.

Abstract: An overall motion detecting device (1) includes a search region variable-shaped motion detector (2) and an overall motion information generator (3). The overall motion information generator (3) controls a surveillance camera (5) which is an external image capturing system and supplies control information of the surveillance camera (5) (such as moving direction, angular speed and focal length) to the search region variable-shaped motion detector (2) as overall motion information (S3). The search region variable-shaped motion detector (2) calculates a motion vector (mv) while renewing, by picture, a search region having a search shape determined by the overall motion information (S3) and a region area suitable for its operational capability.

Abstract: A raw material of a cover layer as a material for forming a fine pattern is applied as to cover a resist pattern. Then, a component in the cover layer permeates into the resist pattern. Thereby, a mixed layer having a lower softening point than that of the resist pattern is formed. Then, a heat treatment is performed at a temperature lower than the softening point of the resist pattern and higher than that of the mixed layer. Thereby, the mixed layer is softened and a width of the mixed layer becomes large. As a result, a space of the resist pattern is narrowed. Therefore, a fine pattern is formed having a smaller size than the size limit due to the exposure wavelength.

Abstract: A gate insulating film (13) and a gate electrode (14) of non-single crystalline silicon for forming an nMOS transistor are provided on a silicon substrate (10). Using the gate electrode (14) as a mask, n-type dopants having a relatively large mass number (70 or more) such as As ions or Sb ions are implanted, to form a source/drain region of the nMOS transistor, whereby the gate electrode (14) is amorphized. Subsequently, a silicon oxide film (40) is provided to cover the gate electrode (14), at a temperature which is less than the one at which recrystallization of the gate electrode (14) occurs. Thereafter, thermal processing is performed at a temperature of about 1000° C., whereby high compressive residual stress is exerted on the gate electrode (14), and high tensile stress is applied to a channel region under the gate electrode (14). As a result, carrier mobility of the nMOS transistor is enhanced.

Abstract: A memory device according to the present invention includes a memory cell array including a plurality of memory cells arranged therein, the memory cell array being divided into a plurality of regions each selectable independently of the others as an object for data writing, and further includes a plurality of current supply sections provided correspondingly to the plurality of regions, respectively. Each of the plurality of current supply sections, when a corresponding region of the plurality of regions is selected as an object for data writing, is activated to supply a data write current to the corresponding region and each of the plurality of regions includes a plurality of write select lines provided correspondingly to predetermined units of the plurality of memory cells. The plurality of write select lines are selectively supplied with the data write current from a corresponding one of the plurality of current supply sections.

Abstract: When electrical properties of semiconductor chips of a semiconductor wafer are inspected by bringing plural contact terminals disposed on the principal surface of a probe sheet of a probe cassette constituting a semiconductor inspection apparatus into contact with plural electrodes of the plural semiconductor chips on the principal surface of the semiconductor wafer which is disposed so as to face the principal surface of the probe sheet, the air pressure of the space formed between the facing surfaces of the principal surface of the probe sheet and the principal surface of the semiconductor wafer is reduced so as to suck the semiconductor wafer toward the side of the principal surface of the probe sheet and deform mainly the semiconductor wafer, thereby pressing the plural electrodes of the plural semiconductor chips of the semiconductor wafer against the plural facing contact terminals of the principal surface of the probe sheet.

Abstract: An address region of an internal bus wherein a burst access can be utilized in an external bus is set in an address table. A DMA control unit determines whether or not a burst access can be utilized in the external bus by comparing an address in an access to the internal bus with an address region set in the address table. Then, the DMA control unit carries out a direct memory access transfer by utilizing a burst access when it is determined that the burst access can be utilized in the external bus. Accordingly, the DMA control unit can carry out a DMA transfer by using a burst access without the intervention of a FIFO memory and it becomes possible to carry out a high speed DMA transfer.

Abstract: In a semiconductor integrated circuit device equipped with a flash memory and an EEPROM which are nonvolatile memories, the invention provides a technique that makes it possible to restrict an EEPROM capacity to a minimum necessary amount and reduce a chip area. Data of a minimal size required for one application program and rewritten frequently is stored in the EEPROM, and the EEPROM is configured to have a capacity of about that minimal size. Data of the same size that are respectively handled by other applications and rewritten frequently are stored in the flash memory. With respect to an application that is actually used, its data stored in the flash memory is transferred to the EEPROM and used. Data transfer between the flash memory and the EEPROM is performed if necessary. Consequently, the EEPROM capacity can be reduced and chip area reduction can be achieved.

Abstract: To calibrate the VGA of a read head, test signals from a DAC are input to the VGA and the output of the VGA is observed, with the gain of the VGA being adjusted as appropriate. So that the DAC need not be made with tight tolerances, a DC signal can be fed into the DAC prior to VGA calibration, and an auxiliary ADC is used to receive the output of the DAC and to determine, for a given DC input, what the signal produced by the DAC actually is. In this way, during subsequent VGA calibration the test signal from the DAC is known not by virtue of the DAC having a tight manufacturing tolerance but by virtue of the actual measurements of its outputs for given register inputs.

Abstract: A manufacturing method is for providing an excellent wire bonding property in the manufacturing of a semiconductor device using an organic resin wiring substrate. In the manufacturing of the semiconductor device, a thermosonic wire bonding apparatus is used when the electrodes of a semiconductor element fixed to the principal surface of a substrate are connected to lines on the substrate with wires.

Abstract: Providing a high frequency power amplifier circuit and a radio communication system which can control output power by a power voltage, produce sufficient output power in high regions of demanded output power and improve power efficiency in low regions of demanded output power. In a high frequency power amplifier circuit (RF power module) which comprises two or more cascaded FETs for amplification and controls output power by controlling power voltages of the FETs for amplification to gate terminals of which bias voltages of a predetermined level are applied, different transistors for power voltage control are provided for a last-stage FET for amplification and preceding-stage FETs for amplification. The transistors for power voltage control generate and apply the power voltage so that the preceding-stage FETs for amplification saturate when a demanded output level is relatively low.

Abstract: In a differential output circuit, a second amplifier has a positive terminal connected to a second fixed potential and a negative terminal to a fifth switch at a first terminal. First and second switches are connected at a point connected to the fifth switch at a second terminal and to a first load. Third and fourth switches are connected at a point connected to the fifth switch at a third terminal and to a second load. The second terminal is connected to the first terminal when the second and third switches turn on. The third terminal is connected to the first terminal when the first and fourth switches turn on.