Abstract: An apparatus includes first and second VI sensors, an optical sensor, and an arcing detector. The first VI sensor is disposed in a power filter or on a power supply line connected to a heater disposed in a lower electrode of a process chamber in which a plasma process is performed. The first VI sensor senses a harmonic generated from a first power supply supplying power to the lower electrode and outputs a first signal. The optical sensor senses an intensity of light generated from the process chamber and outputs a second signal. The second VI sensor is disposed on a power supply line connected to an upper electrode and senses a harmonic generated from a second power supply supplying power to the upper electrode and outputs a third signal. The arcing detector determines whether arcing occurs based on one or more of the first, second, and third signals.

Abstract: Provided are a method and device for speech recognition. The speech recognition method includes: receiving a speech signal generated by an utterance of a user; identifying a named entity from the received speech signal; determining a speech signal portion, which corresponds to the identified named entity, from the received speech signal; generating a first acoustic embedding vector corresponding to the speech signal portion, based on an acoustic embedding model; determining a second acoustic embedding vector that is one of a plurality of acoustic embedding vectors corresponding to a plurality of named entities included in an acoustic embedding database (DB), based on distances between the plurality of acoustic embedding vectors and the first acoustic embedding vector; determining a corrected named entity corresponding to the second acoustic embedding vector; and providing a result of speech recognition with respect to the speech signal, based on the corrected named entity.

Abstract: To predict characteristics of a semiconductor device, basic training data corresponding to a combination of input data and simulation result data are generated using a technology computer aided design (TCAD) simulator. The TCAD simulator generates the simulation result data by performing a simulation based on the input data of the TCAD simulator such that the simulation result data indicates characteristics of semiconductor devices corresponding to the input data of the TCAD simulator. A deep learning model is trained based on the basic training data such that the deep learning model is configured to output prediction data indicating the characteristics of the semiconductor devices. Target prediction data is generated based on the deep learning model and input data corresponding to the target semiconductor product such that the target prediction data indicates the characteristics of the semiconductor device included in the target semiconductor product.

Abstract: Provided are an electronic device and a method of manufacturing the same. The electronic device includes a ferroelectric crystallization layer between a substrate and a gate electrode and a crystallization prevention layer between the substrate and the ferroelectric crystallization layer. The ferroelectric crystallization layer is at least partially crystallized and includes a dielectric material having ferroelectricity or anti-ferroelectricity. Also, the crystallization prevention layer prevents crystallization in the ferroelectric crystallization layer from being spread toward the substrate.

Abstract: Provided is a display device and a method for controlling same. The display device of the present disclosure may include a display, a communication interface, a motor configured to rotate the display, and a processor configured to control the display to display an image content on the display disposed in a first orientation, display a user interface (UI) for rotating the image content and the display, receive a signal, from an external device through the communication interface while the UI is displayed, for rotating at least one of the image content or the display, and based on the received signal, rotate the image content displayed on the display or control the motor to rotate the display to a second orientation.

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

Abstract: A semiconductor package includes a package substrate including a first substrate channel pad and a second substrate channel pad, a chip stack including a plurality of semiconductor chips stacked on the package substrate to be offset in a first direction, wherein first semiconductor chips located on odd layers from among the plurality of semiconductor chips and second semiconductor chips located on even layers from among the plurality of semiconductor chips are offset in a second direction perpendicular to the first direction, each of the first semiconductor chips includes a first chip channel pad, and each of the second semiconductor chips includes a second chip channel pad, first inter-chip connection wires configured to electrically connect the first chip channel pads of the first semiconductor chips to one another, second inter-chip connection wires configured to electrically connect the second chip channel pads of the second semiconductor chips to one another.

Abstract: A semiconductor device includes a semiconductor substrate including a chip region and an edge region around the chip region, a lower insulating layer on the semiconductor substrate, a chip pad on the lower insulating layer on the chip region, an upper insulating layer provided on the lower insulating layer to cover the chip pad, the upper and different insulating layers including different materials, and a redistribution chip pad on the chip region and connected to the chip pad. The upper insulating layer includes a first portion on the chip region having a first thickness, a second portion on the edge region having a second thickness, and a third portion on the edge region, the third portion extending from the second portion, spaced from the first portion, and having a decreasing thickness away from the second portion. The second thickness is smaller than the first thickness.

Abstract: Disclosed is an electronic device that receives a packet of a content image including a plurality of frames from an external device, transmits a signal indicating whether a packet is received, including a request for a bit rate of an image in a transmitted signal, receives a packet with a changed bit rate of the image based on the request, and displays the image on the display based on the received packet.

Abstract: A suction motor capable of having reduced axial length is disclosed. The suction motor according to the present invention comprises: a rotary shaft; an impeller fixed to one end of the rotary shaft; a bearing assembly provided at one side of the impeller and rotatably supporting the rotary shaft; a permanent magnet provided on the rotary shaft at one side of the bearing assembly; a weight balancer provided on the other end of the rotary shaft at one side of the permanent magnet; and a stator assembly provided at the circumference of the permanent magnet, wherein the weight balancer is formed such that when the rotary shaft rotates, the impeller, the permanent magnet and the weight balancer achieve rotational balance around the bearing assembly.

Abstract: An interconnect structure for reducing a contact resistance, an electronic device including the same, and a method of manufacturing the interconnect structure are provided. The interconnect structure includes a semiconductor layer including a first region having a doping concentration greater than a doping concentration of a peripheral region of the semiconductor layer, a metal layer facing the semiconductor layer, a graphene layer between the semiconductor layer and the metal layer, and a conductive metal oxide layer between the graphene layer and the semiconductor and covering the first region.

Abstract: A method of fabricating a semiconductor package includes providing a semiconductor chip, forming a redistribution substrate, and fabricating a package including the semiconductor chip disposed on the redistribution substrate. The forming of the redistribution substrate may include forming a first insulating layer on a substrate, the first insulating layer having a first opening formed therein, forming an integrally formed first redistribution pattern in the first opening and on the first insulating layer, forming a second insulating layer on the first insulating layer to cover the first redistribution pattern, and performing a planarization process on the second insulating layer to expose the first redistribution pattern.

Abstract: A neural processing system includes a first frontend module, a second frontend module, a first backend module, and a second backend module. The first frontend module executes a feature extraction operation using a first feature map and a first weight, and outputs a first operation result and a second operation result. The second frontend module executes the feature extraction operation using a second feature map and a second weight, and outputs a third operation result and a fourth operation result. The first backend module receives an input of the first operation result provided from the first frontend module and the fourth operation result provided from the second frontend module via a second bridge to sum up the first operation result and the fourth operation result.

Abstract: A fluid supply apparatus includes a container supply holder configured to supply a container to a cap separator using a loading box, the container including a detachable nozzle cap, and configured to store a process fluid, a cap separator configured to receive the container from the loading box and separate the nozzle cap from a container body of the container using a cap clamper and a rotation actuator, the cap clamper configured to clamp and hold the nozzle cap, and the rotation actuator configured to rotate the container body, a fluid supplier configured to supply the process fluid contained in the container body through a fluid supply line, and a controller configured to control the container supply holder, the cap separator, and the fluid supplier.

Abstract: A method and an electronic device for providing information associated with work and personal life are provided. An electronic device according to various embodiments may include a user interface, a processor electrically connected to the user interface, and a memory electrically connected to the processor. The memory stores instructions which when executed by the processor cause the processor to determine a first zone and a second zone different from the first zone, based on location information and time information of the electronic device, obtain a first time during which the electronic device is located in the first zone and a second time during which the electronic device is located in the second zone, and display information associated with the first time and the second time on the user interface.

Abstract: A semiconductor device including a first structure including a first conductive pattern, the first conductive pattern exposed on an upper portion of the first structure, a mold layer covering the first conductive pattern, a second structure on the mold layer, and a through via penetrating the second structure and the mold layer, the through via electrically connected to the first conductive pattern, the through via including a first via segment in the second structure and a second via segment in the mold layer, the second via segment connected to the first via segment, an upper portion of the second via segment having a first width and a middle portion of the second via segment having a second width greater than the first width may be provided.

Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Embodiments herein provide a method for HPLMN-based traffic control in a wireless communication network when a UE 300 is registered on different PLMNs.

Abstract: An output driver includes a pre driver including pre driving circuits, each including first and second pre pumps, and a main driver including main driving circuits, each including first and second main pumps. Each of the first and second pre pumps includes a first driving capacitor, and each of the first and second main pumps includes a second driving capacitor. During a first half cycle of a clock signal, the first pre pump and the first main pump perform a precharge operation, and the second pre pump and the second main pump perform a first driving operation, and during a second half cycle of the clock signal, the first pre pump and the first main pump perform the first driving operation, and the second pre pump and the second main pump perform the precharge operation. Capacitances of the first and second driving capacitors are different.

Abstract: A method for enhancing receiving signal power at a receiver is provided. The method includes estimating a channel gain by transmitting a pilot signal to the receiver through each antenna from a plurality of antennas of a transmitter and an IRS, determining an antenna selection metric based on the channel gain in transmitting the pilot signal to the receiver through each antenna of the transmitter and the IRS, identifying an antenna from the plurality of antennas that causes to provide the largest antenna selection metric, determining a reflection coefficient for each reflector of the IRS based on the identified antenna, configuring the reflectors of the IRS with the reflection coefficient, and transmitting the signal to the receiver through the identified antenna and the configured reflectors.