Patents Assigned to Samsung Led Co., Ltd.
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Patent number: 7899103Abstract: Provided is a side light emitting type semiconductor laser diode in which a dielectric layer is formed on an active layer. The side light emitting type semiconductor laser diode includes an n-clad layer, an n-light guide layer, an active layer and a p-light guide layer sequentially formed on a substrate, and a dielectric layer with a ridge structure formed on the p-light guide layer.Type: GrantFiled: October 11, 2006Date of Patent: March 1, 2011Assignee: Samsung LED Co., Ltd.Inventors: Han-youl Ryu, Kyoung-ho Ha
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Publication number: 20110043100Abstract: The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.Type: ApplicationFiled: October 28, 2010Publication date: February 24, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Hai Sung LEE, Jong Myeon Lee, Ho Sung Choo, Myung Whun Chang, Youn Gon Park
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Patent number: 7893443Abstract: Disclosed herein is a nitride-based semiconductor light-emitting device. The nitride-based semiconductor light-emitting device comprises an n-type clad layer made of n-type Alx1Iny1Ga(1-x1-y1)N (where 0?x1?1, 0?y1?1, and 0?x1+y1?1), a multiple quantum well-structured active layer made of undoped InAGa1-AN (where 0<A<1) formed on the n-type clad layer, and a p-type clad layer formed on the active layer wherein the p-type clad layer includes at least a first layer made of p-type Iny2Ga1-y2N (where 0?y2<1) formed on the active layer and a second layer made of p-type Alx3Iny3Ga(1-x3-y3)N (where 0<x3?1, 0?y3?1, and 0<x3+y3?1) formed on the first layer.Type: GrantFiled: April 26, 2006Date of Patent: February 22, 2011Assignee: Samsung LED Co,; Ltd.Inventors: Je Won Kim, Jeong Tak Oh, Dong Joon Kim, Sun Woon Kim, Jin Sub Park, Kyu Han Lee
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Patent number: 7894017Abstract: There are provided a plane light source and an LCD backlight unit having the same.Type: GrantFiled: August 27, 2008Date of Patent: February 22, 2011Assignee: Samsung LED Co., Ltd.Inventors: Seong Yeon Han, Hun Joo Hahm, Hyung Suk Kim, Young June Jeong, Young Sam Park, Chul Hee Yoo
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Patent number: 7893447Abstract: A nitride-based semiconductor LED includes a substrate; an n-type nitride semiconductor layer formed on the substrate; an active layer and a p-type nitride semiconductor layer that are sequentially formed on a predetermined region of the n-type nitride semiconductor layer; a transparent electrode formed on the p-type nitride semiconductor layer; a p-electrode pad formed on the transparent electrode, the p-electrode pad being spaced from the outer edge line of the p-type nitride semiconductor layer by 50 to 200 ?m; and an n-electrode pad formed on the n-type nitride semiconductor layer.Type: GrantFiled: May 27, 2008Date of Patent: February 22, 2011Assignee: Samsung LED Co., Ltd.Inventors: Hyuk Min Lee, Hyun Kyung Kim, Dong Joon Kim, Hyoun Soo Shin
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Publication number: 20110037086Abstract: Disclosed herein is a nitride-based semiconductor light-emitting device. The nitride-based semiconductor light-emitting device comprises an n-type clad layer made of n-type Alx1Iny1Ga(1-x1-y1)N (where 0?x1?1, 0?y1?1, and 0?x1+y1?1), a multiple quantum well-structured active layer made of undoped InAGa1-AN (where 0<A<1) formed on the n-type clad layer, and a p-type clad layer formed on the active layer wherein the p-type clad layer includes at least a first layer made of p-type Iny2Ga1-y2N (where 0?y2<1) formed on the active layer and a second layer made of p-type Alx3Iny3Ga(1-x3-y3)N (where 0<x3?1, 0?y3?1, and 0<x3+y3?1) formed on the first layer.Type: ApplicationFiled: October 25, 2010Publication date: February 17, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Je Won KIM, Jeong Tak Oh, Dong Joon Kim, Sun Woon Kim, Jin Sub Park, Kyu Han Lee
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Patent number: 7887225Abstract: In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.Type: GrantFiled: July 5, 2007Date of Patent: February 15, 2011Assignee: Samsung LED Co., Ltd.Inventors: Won Joon Lee, In Tae Yeo, Hun Joo Hahm, Young Sam Park, Kyung Taeg Han, Ho Sik Ahn, Chang Ho Song
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Patent number: 7888670Abstract: There is provided a nitride semiconductor light emitting device including: an n-type semiconductor region; an active layer formed on the n-type semiconductor region; a p-type semiconductor region formed on the active layer; an n-electrode disposed in contact with the n-type semiconductor region; a p-electrode formed on the p-type semiconductor region; and at least one intermediate layer formed in at least one of the n-type semiconductor region and the p-type semiconductor region, the intermediate layer disposed above the n-electrode, wherein the intermediate layer is formed of a multi-layer structure where at least three layers with different band gaps from one another are deposited, wherein the multi-layer structure includes one of an AlGaN layer/GaN layer/InGaN layer stack and an InGaN layer/GaN layer/AlGaN layer stack.Type: GrantFiled: April 14, 2008Date of Patent: February 15, 2011Assignee: Samsung LED Co., Ltd.Inventors: Sang Heon Han, Sang Won Kang, Jeong Tak Oh, Seung Beom Seo, Dong Joon Kim, Hyun Wook Shim
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Patent number: 7888689Abstract: Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.Type: GrantFiled: May 14, 2007Date of Patent: February 15, 2011Assignee: Samsung LED Co., Ltd.Inventors: Hyung-kun Kim, Yu-sik Kim
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Publication number: 20110033965Abstract: A vertical nitride-based semiconductor LED comprises a structure support layer; a p-electrode formed on the structure support layer; a p-type nitride semiconductor layer formed on the p-electrode; an active layer formed on the p-type nitride semiconductor layer; an n-type nitride semiconductor layer formed on the active layer; an n-electrode formed on a portion of the n-type nitride semiconductor layer; and a buffer layer formed on a region of the n-type nitride semiconductor layer on which the n-electrode is not formed, the buffer layer having irregularities formed thereon. The surface of the n-type nitride semiconductor layer coming in contact with the n-electrode is flat.Type: ApplicationFiled: October 21, 2010Publication date: February 10, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Sang Ho YOON, Su Yeol LEE, Doo Go BAIK, Seok Beom CHOI, Tae Sung JANG, Jong Gun WOO
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Publication number: 20110031521Abstract: The invention provides a high quality composite phosphor powder which ensures diversity in emission spectrum, color reproduction index, color temperature and color, a light emitting device using the same and a method for manufacturing the composite phosphor powder. The composite phosphor powder comprises composite particles. Each of the composite particles includes at least two types of phosphor particles and a light transmitting binder. The phosphor particles have different emission spectrums. In addition, the light transmitting binder is formed between the phosphor particles and binds them together.Type: ApplicationFiled: October 21, 2010Publication date: February 10, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Chulsoo YOON, Joon Ho Yoon, Chang Hoon Kwak, Yun Seup Chung
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Patent number: 7884377Abstract: A light emitting device including: at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed there between, the light emitting stack having first and second surfaces and side surfaces interposed between the first and second surfaces; first and second contacts formed on the first and second surface of the light emitting stack, respectively; a first insulating layer formed on the second surface and the side surfaces of the light emitting stack; a conductive layer connected to the second contact and extended along one of the side surfaces of the light emitting stack to have an extension portion adjacent to the first surface; and a substrate structure formed to surround the side surfaces and the second surface of the light emitting stack.Type: GrantFiled: March 17, 2010Date of Patent: February 8, 2011Assignee: Samsung LED Co., Ltd.Inventors: Grigory Onushkin, Jin Hyun Lee, Myong Soo Cho, Pun Jae Choi
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Publication number: 20110026241Abstract: Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.Type: ApplicationFiled: October 8, 2010Publication date: February 3, 2011Applicant: SAMSUNG LED CO., LTDInventors: Dae Yeon KIM, Young June JEONG, Hun Joo HAHM, Jae Hong SHIN, Chang Ho SHIN
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Patent number: 7880176Abstract: Provided are a top-emitting nitride-based light emitting device having an n-type clad layer, an active layer and a p-type clad layer sequentially stacked thereon, comprising an interface modification layer formed on the p-type clad layer and a transparent conductive thin film layer made up of a transparent conductive material formed on the interface modification layer; and a process for preparing the same. In accordance with the top-emitting nitride-based light emitting device of the present invention and a process for preparing the same, there are provided advantages such as improved ohmic contact with the p-type clad layer, leading to increased wire bonding efficiency and yield upon packaging the light emitting device, capability to improve luminous efficiency and life span of the device due to low specific contact resistance and excellent current-voltage properties.Type: GrantFiled: July 22, 2005Date of Patent: February 1, 2011Assignee: Samsung LED Co., Ltd.Inventors: Tae-Yeon Seong, June-O Song, Kyoung-Kook Kim, Woong-Ki Hong
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Patent number: 7875476Abstract: An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.Type: GrantFiled: November 4, 2009Date of Patent: January 25, 2011Assignee: Samsung Led Co., Ltd.Inventors: Seon Goo Lee, Hun Joo Hahm, Jung Kyu Park, Kyung Taeg Han, Seong Yeon Han, Dae Yeon Kim, Young Sam Park
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Patent number: 7874715Abstract: A light emitting diode backlight (LED) unit includes: a substrate having a plurality of divided areas; a plurality of LEDs disposed on the substrate; and an LED driver supplying a drive power to the plurality of LEDs disposed in at least two of the plurality of divided areas, wherein at least a part of the plurality of LEDs disposed in one of the plurality of divided areas is electrically connected to each other.Type: GrantFiled: May 8, 2007Date of Patent: January 25, 2011Assignee: Samsung LED Co., Ltd.Inventors: Chang Hoon Baek, Sang Yun Lee
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Publication number: 20110012533Abstract: Disclosed herein is a color LED driver, which is capable of being implemented by a compact structure without a feedback structure and accompanying a small size and low cost, by directly connecting a negative temperature coefficient (NTC) thermistor to a driving current path of a color LED applied to an LCD backlight to compensate a characteristic variation of the LED due to a variation in a temperature.Type: ApplicationFiled: September 27, 2010Publication date: January 20, 2011Applicant: SAMSUNG LED CO., LTD.Inventor: Dong Woo LEE
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Patent number: 7872271Abstract: Provided are a flip-chip nitride-based light emitting device having an n-type clad layer, an active layer and a p-type clad layer sequentially stacked thereon, comprising a reflective layer formed on the p-type clad layer and at least one transparent conductive thin film layer made up of transparent conductive materials capable of inhibiting diffusion of materials constituting the reflective layer, interposed between the p-type clad layer and reflective layer; and a process for preparing the same. In accordance with the flip-chip nitride-based light emitting device of the present invention and a process for preparing the same, there are provided advantages such as improved ohmic contact properties with the p-type clad layer, leading to increased wire bonding efficiency and yield upon packaging the light emitting device, capability to improve luminous efficiency and life span of the device due to low specific contact resistance and excellent current-voltage properties.Type: GrantFiled: July 12, 2005Date of Patent: January 18, 2011Assignee: Samsung Led Co., Ltd.Inventors: Tae-Yeon Seong, June-O Song, Kyoung-Kook Kim, Woong-Ki Hong
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Patent number: 7872276Abstract: A method of manufacturing a vertical GaN-based LED comprises forming a light emission structure in which an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer are sequentially laminated on a substrate; etching the light emission structure such that the light emission structure is divided into units of LED; forming a p-electrode on each of the divided light emission structures; filling a non-conductive material between the divided light emission structures; forming a metal seed layer on the resulting structure; forming a first plated layer on the metal seed layer excluding a region between the light emission structures; forming a second plated layer on the metal seed layer between the first plated layers; separating the substrate from the light emission structures; removing the non-conductive material between the light emission structures exposed by separating the substrate; forming an n-electrode on the n-type GaN-based semiconductor layer; and removing portionsType: GrantFiled: May 1, 2007Date of Patent: January 18, 2011Assignee: Samsung LED Co., Ltd.Inventors: Su Yeol Lee, Bang Won Oh, Doo Go Baik, Tae Sung Jang, Jong Gun Woo, Seok Beom Choi, Sang Ho Yoon, Dong Woo Kim, In Tae Yeo
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Patent number: 7872266Abstract: A high-efficiency semiconductor light emitting diode and a method for manufacturing the same are provided. The semiconductor LED has high internal quantum efficiency and can reduce the bad effect caused by the crystal defect. In the semiconductor light emitting diode, a conductive substrate has a three-dimensional top surface, and a light-emitting stack structure has a three-dimensional structure and includes an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer, which are sequentially formed on the conductive substrate. A p-electrode is formed on the p-type nitride semiconductor layer, and an n-electrode is formed on a bottom surface of the conductive substrate.Type: GrantFiled: November 9, 2006Date of Patent: January 18, 2011Assignee: Samsung LED Co., Ltd.Inventors: Pun Jae Choi, Sang Yeob Song, Suk Youn Hong