Patents Assigned to Samsung Led Co., Ltd.
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Publication number: 20120001209Abstract: A light emitting diode module for a line light source includes a circuit board having a wire pattern formed thereon and a plurality of LED chips directly mounted and disposed in a longitudinal direction on the circuit board and electrically connected to the wire pattern. The module also includes a reflecting wall installed on the circuit board to surround the plurality of LED chips, reflecting light from the LED chips. The module further includes a heat sink plate underlying the circuit board to radiate heat generated from the LED chip.Type: ApplicationFiled: September 16, 2011Publication date: January 5, 2012Applicant: Samsung LED Co., Ltd.Inventor: Il Ku KIM
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Publication number: 20110315957Abstract: There is provided a light emitting device of a simpler structure, capable of ensuring a broad light emitting area and a high light emitting efficiency, while manufactured in a simplified and economically efficient process. The light emitting device including: a semiconductor layer; an active layer formed on the semiconductor layer, the active layer comprising at least one of a quantum well structure, a quantum dot and a quantum line; an insulating layer formed on the active layer; and a metal layer formed on the insulating layer.Type: ApplicationFiled: September 2, 2011Publication date: December 29, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Won Ha MOON, Chang Hwan CHOI, Dong Woohn KIM, Hyun Jun KIM
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Patent number: 8084778Abstract: There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.Type: GrantFiled: October 1, 2009Date of Patent: December 27, 2011Assignee: Samsung LED Co., Ltd.Inventors: Ho Sun Paek, Hak Hwan Kim, Young Jin Lee, Hyung Kun Kim, Suk Ho Jung
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Publication number: 20110309915Abstract: Disclosed is a controller for controlling an illumination device participating in a wireless network by setting a scene of illumination according to a configurable schedule. The controller for controlling an illumination device includes: a control unit controlling an illumination scene of an illumination device selected from among a plurality of illumination devices existing in a pre-set network according to a pre-set schedule table; a frame generation unit generating a frame for controlling the illumination scene of the corresponding illumination device under the control of the control unit; and a communication unit transmitting the frame generated by the frame generation unit to the selected illumination device under the control of the controller.Type: ApplicationFiled: June 22, 2011Publication date: December 22, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Ho Chan CHO, Sang Kyeong YUN, Chang Seob KIM
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Publication number: 20110312109Abstract: An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.Type: ApplicationFiled: August 29, 2011Publication date: December 22, 2011Applicant: Samsung LED Co., Ltd.Inventors: Young Ki LEE, Seog Moon CHOI, Sang Hyun SHIN
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Method of forming fine patterns and manufacturing semiconductor light emitting device using the same
Patent number: 8080480Abstract: A method of forming a fine pattern begins with providing a c-plane hexagonal semiconductor crystal. A mask having a predetermined pattern is formed on the semiconductor crystal. The semiconductor crystal is dry-etched by using the mask to form a first fine pattern on the semiconductor crystal. The semiconductor crystal including the first fine pattern is wet-etched to expand the first fine pattern in a horizontal direction to form a second fine pattern. The second fine pattern obtained in the wet-etching the semiconductor crystal has a bottom surface and a sidewall that have unique crystal planes, respectively. The present fine-pattern forming process can be advantageously applied to a semiconductor light emitting device, particularly, to a phonic crystal structure required to have fine patterns or a structure using a surface plasmon resonance principle.Type: GrantFiled: September 26, 2008Date of Patent: December 20, 2011Assignee: Samsung LED Co., Ltd.Inventors: Jong Ho Lee, Moo Youn Park, Soo Ryong Hwang, Il Hyung Jung, Gwan Su Lee, Jin Ha Kim -
Patent number: 8077137Abstract: An LCD driving system using at least one of each of red, green and blue LED arrays composed of red LEDs, green LEDs, and blue LEDs connected in series, respectively. An SMPS includes an AC-DC converter for converting an externally inputted AC voltage to a DC voltage, and red, green and blue LED DC-DC converters for converting the DC voltage to a predetermined magnitude of DC voltage for driving the red, green and blue LED arrays. A light source includes a substrate with the red, green and blue LED arranged thereon, and each of red, green and blue LED constant current controllers for controlling the current running through the red, green and blue LED arrays so as to maintain predetermined outputs of the LEDs. A bridge board electrically connects the red, green and blue LED DC-DC converters with the red, green and blue LED constant current controllers, respectively.Type: GrantFiled: May 30, 2007Date of Patent: December 13, 2011Assignee: Samsung LED Co., Ltd.Inventor: Sang Yun Lee
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Patent number: 8076692Abstract: The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.Type: GrantFiled: October 21, 2008Date of Patent: December 13, 2011Assignee: Samsung LED Co., Ltd.Inventors: Hyung Kun Kim, Ho Sun Paek, Suk Ho Jung, Hak Hwan Kim, Young Jin Lee
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Publication number: 20110298379Abstract: There is provided a system of controlling product display lighting capable of controlling brightness levels and/or colors of illuminating light suitable for corresponding products according to characteristics of products, such as kinds or colors of products. The system of controlling product display lighting may include an information input unit acquiring information on products; a coordinator determining brightness levels and colors of illuminating light provided to the products according to the information on the products; a light source driver generating light source driving signals for outputting the determined brightness levels and colors of illuminating light in the coordinator; and a light source unit outputting illumination light having the brightness levels and colors of illuminating light determined in the coordinator by the light source driving signals.Type: ApplicationFiled: June 6, 2011Publication date: December 8, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Jin Sun JUNG, Sang Kyeong YUN, Haeng Seok YANG
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Publication number: 20110297992Abstract: There is provided a semiconductor light emitting device that minimizes reflection or absorption of emitted light, maximizes luminous efficiency with the maximum light emitting area, enables uniform current spreading with a small area electrode, and enables mass production with high reliability and high quality. A semiconductor light emitting device according to an aspect of the invention includes first and second conductivity type semiconductor layers, an active layer formed therebetween, first electrode layer, and a second electrode part electrically connecting the semiconductor layers. The second electrode part includes an electrode pad unit, an electrode extending unit, and an electrode connecting unit connecting the electrode pad unit and electrode extending unit.Type: ApplicationFiled: August 19, 2011Publication date: December 8, 2011Applicant: Samsung LED Co., Ltd.Inventors: Pun Jae CHOI, Ki Yeol Park, Sang Bum LEE, Seon Young MYOUNG, Myong Soo CHO
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Publication number: 20110298382Abstract: There is provided an LED driving circuit including: at least one ladder network circuit including: (n+1) number of first branches connected in parallel with one another by n number of first middle junction points between a first junction point and a second junction point, where n denotes an integer satisfying n?2, (n+1) number of second branches connected in parallel with one another by n number of second middle junction points between the first junction point and the second junction point, the (n+1) number of second branches connected in parallel with the first branches; and n number of middle branches connecting the first and second middle junction points of an identical m sequence to each other, respectively, wherein each of the first and second, and middle branches comprises at least one LED device.Type: ApplicationFiled: August 12, 2011Publication date: December 8, 2011Applicant: Samsung LED Co., Ltd.Inventors: Young Jin LEE, Byoung Own Min, Gil Han Park, Grigory Onushkin
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Publication number: 20110300652Abstract: There is provided a nitride semiconductor light emitting device and a manufacturing method of the same. The nitride semiconductor light emitting device including: a substrate for growing a nitride single crystal, the substrate having electrical conductivity; a p-type nitride semiconductor layer formed on the substrate; an active layer formed on the p-type nitride semiconductor layer, the active layer including a plurality of quantum barrier layers and a plurality of quantum well layers deposited alternately on each other; an n-type nitride semiconductor layer formed on the active layer; a p-electrode formed on a bottom of the substrate; and an n-electrode formed on a top of the n-type nitride semiconductor layer.Type: ApplicationFiled: August 16, 2011Publication date: December 8, 2011Applicant: Samsung LED Co., Ltd.Inventors: Seong Eun Park, Bang Won OH, Gil Han Park, Min Ho Kim, Rak Jun Choi, Young Min Park, Hee Seok Park
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Patent number: 8071994Abstract: The present invention provides a semiconductor light-emitting device. The light-emitting device comprises a first conductive clad layer, an active layer, and a second conductive clad layer sequentially formed on a substrate. In the light-emitting device, the substrate has one or more side patterns formed on an upper surface thereof while being joined to one or more edges of the upper surface. The side patterns consist of protrusions or depressions so as to scatter or diffract light to an upper portion or a lower portion of the light-emitting device.Type: GrantFiled: November 23, 2009Date of Patent: December 6, 2011Assignee: Samsung LED Co., Ltd.Inventors: Sun Woon Kim, Hyun Kyung Kim, Je Won Kim, In Seok Choi, Kyu Han Lee, Jeong Tak Oh
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Publication number: 20110292302Abstract: A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units including a light emitting element emitting light when electricity is applied thereto; and an optical sheet disposed above the light source units and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0° and greater than 0°.Type: ApplicationFiled: May 2, 2011Publication date: December 1, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Jung Kyu PARK, Young Sam PARK, Sung A. CHOI, Jeong Eun LIM, Jin Mo KIM, Man Ki HONG, Tae Heon HAN, Churl Wung SHIN, Young Taek KIM, Dae Woon HONG, Young Geun JUN, Jung Kyu KOOK
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Publication number: 20110292683Abstract: There is provided a backlight unit. The backlight unit includes a light guiding plate, a light source module including a substrate provided with a circuit wiring and a plurality of light emitting diode (LED) blocks each including one or more LED mounted on the substrate to be positioned vertically with respect to the substrate, the one or more LED being disposed to face a side surface of the light guiding plate, a bottom chassis including a base and a sidewall upwardly extending from a circumference of the base, and accommodating the light source module and the light guiding plate in such a manner that the one or more LED is disposed to be adjacent to the sidewall, and a driving unit controlling a current signal applied to each of the plurality of LED blocks to thereby control brightness for each LED block.Type: ApplicationFiled: May 31, 2011Publication date: December 1, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Sun CHOI, Geun Young KIM, Jung Hun LEE, Jong Jin PARK
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Publication number: 20110291143Abstract: A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.Type: ApplicationFiled: December 30, 2009Publication date: December 1, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Jin Ha Kim, Masami Nei, Seok Min Hwang, Chung Bae Jeon
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Patent number: 8068661Abstract: Disclosed are a light emitting diode (LED) inspection apparatus, which can determine whether an LED has a defect such as leakage current, without making physical contact with the LED being inspected, and an LED inspection method thereof. The LED inspection apparatus includes an ultraviolet emission unit emitting UV light to an LED, an image generation unit generating an image of the LED to which the UV light is emitted, and a control unit obtaining color or intensity information of the LED from the image of the LED and determining, based on the color information, whether the LED is defective.Type: GrantFiled: November 21, 2008Date of Patent: November 29, 2011Assignee: Samsung LED Co., Ltd.Inventors: Grigory Onushkin, Joong Kon Son, Jong Hoon Lim, Sang Su Hong
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Patent number: 8063407Abstract: There is provided a light emitting device that can minimize reflection or absorption of emitted light, maximize luminous efficiency with the maximum light emitting area, enable uniform current spreading with a small area electrode, and enable mass production at low cost with high reliability and high quality. A light emitting device according to an aspect of the invention includes a light emitting lamination including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a conductive substrate at one surface thereof. Here, the light emitting device includes a barrier unit separating the light emitting lamination into a plurality of light emitting regions, a first electrode structure, and a second electrode structure. The first electrode structure includes a bonding unit, contact holes, and a wiring unit connecting the bonding unit to the contact holes.Type: GrantFiled: April 8, 2010Date of Patent: November 22, 2011Assignee: Samsung LED Co., Ltd.Inventors: Pun Jae Choi, Jin Hyun Lee, Si Hyuk Lee, Seon Young Myoung, Ki Yeol Park
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Patent number: 8064217Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.Type: GrantFiled: September 5, 2007Date of Patent: November 22, 2011Assignees: Samsung Electro-Mechanics Co., Ltd., Samsung LED Co., Ltd.Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Byung-Moon Kim, Han-Seo Cho
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Publication number: 20110279091Abstract: The present invention provides a wireless device and method for reducing standby power. The method for reducing standby power of the wireless device includes the steps of: charging a charging battery with power supplied from an AC commercial power source in a normal mode of the wireless device, blocking the power of the AC commercial power source and converting an operation state of the wireless device so that the wireless device is in a standby mode when an operation-off signal used for turning off a predetermined device is transmitted from an outside. In this case, the wireless device receives the power with which the charging battery has been charged. In a standby mode, the wires device is periodically converted to be in a normal mode to transmit an operation state inquiry signal to the outside, so that it is possible to normally control the predetermined device.Type: ApplicationFiled: May 17, 2011Publication date: November 17, 2011Applicant: SAMSUNG LED CO., LTD.Inventors: Paul JUNG, Chang Soo YANG, Jung Hwan PARK