Patents Assigned to Semitool, Inc.
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Patent number: 7354649Abstract: The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece.Type: GrantFiled: August 20, 2004Date of Patent: April 8, 2008Assignee: Semitool, Inc.Inventors: Kert L. Dolechek, Raymon F. Thompson
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Patent number: 7351315Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having a plurality of electrodes and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrodes. The chamber further includes a barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The barrier can be a porous, permeable barrier or a nonporous, semipermeable barrier.Type: GrantFiled: December 5, 2003Date of Patent: April 1, 2008Assignee: Semitool, Inc.Inventors: John Klocke, Kyle M Hanson
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Patent number: 7351314Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.Type: GrantFiled: December 5, 2003Date of Patent: April 1, 2008Assignee: Semitool, Inc.Inventors: John Klocke, Kyle M Hanson
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Publication number: 20080067072Abstract: Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.Type: ApplicationFiled: August 17, 2007Publication date: March 20, 2008Applicant: SEMITOOL, INC.Inventors: Bioh Kim, Marvin Bernt, Greg Wilson, Paul McHugh
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Patent number: 7337663Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a processing fluid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a processing fluid in the bowl. A process head holds a workpiece. A process head lifter lowers the head holding the workpiece into the processing fluid in the bowl. Sonic energy is provided to the workpiece through the processing fluid, optionally while the processing head spins the workpiece. The processing fluid may include de-ionized water and an etchant.Type: GrantFiled: March 11, 2005Date of Patent: March 4, 2008Assignee: Semitool, Inc.Inventors: Paul Z. Wirth, Dana R. Scranton, Brian Aegerter
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Patent number: 7334826Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments.Type: GrantFiled: July 11, 2002Date of Patent: February 26, 2008Assignee: Semitool, Inc.Inventors: Daniel J. Woodruff, Randy A. Harris, James J. Erickson, Douglas W. Carr
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Publication number: 20080041727Abstract: Electric potential, current density, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation.Type: ApplicationFiled: August 18, 2006Publication date: February 21, 2008Applicant: Semitool, Inc.Inventors: Bioh Kim, Marvin Bernt, Greg Wilson, Paul R. McHugh
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Patent number: 7332066Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.Type: GrantFiled: February 7, 2005Date of Patent: February 19, 2008Assignee: Semitool, Inc.Inventors: Linlin Chen, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas L. Ritzdorf
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Publication number: 20080011450Abstract: Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater.Type: ApplicationFiled: July 12, 2007Publication date: January 17, 2008Applicant: Semitool, Inc.Inventors: Kyle Hanson, Robert Batz, Rajesh Baskaran, Nolan Zimmerman, Zhongmin Hu, Gregory Wilson, Paul McHugh
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Publication number: 20080011609Abstract: A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.Type: ApplicationFiled: July 12, 2007Publication date: January 17, 2008Applicant: Semitool, Inc.Inventors: Paul McHugh, Gregory Wilson, Kyle Hanson
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Patent number: 7313462Abstract: An integrated tool and automatic calibration systems that enable wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the down time associated with repairing or maintaining processing chambers and/or lift-rotate units so that the tools can maintain a high throughput. Several aspects of these tools are particularly useful for applications that have stringent performance requirements because components are more likely to require maintenance more frequently, and reducing the down time associated with maintaining such components will significantly enhance the integrated tool.Type: GrantFiled: June 3, 2004Date of Patent: December 25, 2007Assignee: Semitool, Inc.Inventors: Daniel J. Woodruff, David P. Mattson, James J. Erickson, Matthew C. Egloff
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Patent number: 7305999Abstract: A centrifugal spray processor for processing semiconductor wafers uses larger numbers of spray nozzles. Each spray nozzle delivers a reduced volume of liquid, to reduce consumption of liquid process chemicals. The nozzles operate at a higher back pressure. The increased number of nozzles, offset nozzle patterns and groupings of nozzles, lower nozzle flow rates, and higher nozzle back pressures, provide improved processing results. The improved spray system may be provided as a retrofit kit.Type: GrantFiled: July 19, 2002Date of Patent: December 11, 2007Assignee: Semitool, Inc.Inventors: Trevor Henke, Craig Meuchel, Marvin Bernt
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Patent number: 7300562Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.Type: GrantFiled: September 22, 2003Date of Patent: November 27, 2007Assignee: Semitool, Inc.Inventors: Zhongmin Hu, Thomas L. Ritzdorf, Lyndon W. Graham
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Publication number: 20070261964Abstract: Reactors, systems and methods for electroplating and/or electro-etching microfeature workpieces. Reactors in accordance with the invention have a first chamber configured to direct a first processing solution to a processing zone, a second chamber configured to contain a second processing solution different than the first processing solution, and an ion exchange membrane between the first chamber and the second chamber. The reactors also include (a) a support member in the first chamber that contacts the ion exchange membrane across the surface of the membrane, and (b) a counter electrode in the second chamber. The ion exchange membrane enables a low conductivity catholyte to be used in the first chamber and an inert counter electrode in the second chamber.Type: ApplicationFiled: May 10, 2006Publication date: November 15, 2007Applicant: Semitool, Inc.Inventors: Gregory Wilson, Paul McHugh, Kyle Hanson, Rajesh Baskaran
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Patent number: 7294244Abstract: An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed.Type: GrantFiled: February 14, 2003Date of Patent: November 13, 2007Assignee: Semitool, Inc.Inventors: Thomas H. Oberlitner, Kyle M. Hanson
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Patent number: 7294243Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the workpiece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.Type: GrantFiled: December 5, 2002Date of Patent: November 13, 2007Assignee: Semitool, Inc.Inventors: Nolan Zimmerman, Gregory J. Wilson, Steve L. Eudy
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Patent number: 7288172Abstract: A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink.Type: GrantFiled: December 23, 2003Date of Patent: October 30, 2007Assignee: Semitool, Inc.Inventors: John M. Pedersen, James J. Erickson
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Patent number: 7288489Abstract: The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece.Type: GrantFiled: August 20, 2004Date of Patent: October 30, 2007Assignee: Semitool, Inc.Inventors: Kert L. Dolechek, Raymon F. Thompson
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Patent number: 7288179Abstract: A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink.Type: GrantFiled: December 23, 2003Date of Patent: October 30, 2007Assignee: Semitool, Inc.Inventors: John M. Pedersen, James J. Erickson
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Patent number: 7281741Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.Type: GrantFiled: July 11, 2002Date of Patent: October 16, 2007Assignee: Semitool, Inc.Inventors: Daniel J. Woodruff, Thomas H. Oberlitner, Randy A. Harris, James J. Erickson, Douglas W. Carr