Abstract: A method and apparatus for sensing a fingerprint has an array of sensors, each sensor having a sensing surface for receiving the pressure of a finger and having an ITO layer that has an intrinsic variable resistance characteristic that varies because of the varying ridges and valleys of a finger. The intrinsic variable resistance characteristic is converted to a variable voltage for a given pixel based on the pressure applied by the finger, and the fingerprint is determined based on the variable voltage readings for each pixel.

Abstract: A device and method for LADAR ranging using relatively long laser pulse widths and slower system clock speeds is provided. The center points of the sent and received laser signal such as Gaussian laser pulses are identified by time sampling the sent and received laser signal waveforms at predetermined time positions. The signal energy within each time sample of the respective sent and received laser signals defines a clock “bin”. The received laser signal generates an output from a photodetector cell on a focal plane array that is converted into voltage. The signal energy is integrated using a capacitor array for each of the clock bins and is representative of the signal energy in each time sample. The output of the capacitor array is collected in buffer and digitized. Signal processing means extracts the center of the transmitted and received pulses and the time-of-flight calculated as the time between the transmitted and returned centers of the laser signal pulses.

Abstract: The invention is a frequency modulated (FM) inertial sensing device and method which, in one embodiment, comprises an accelerometer having a proof mass coupled to a nano-resonator element. The nano-resonator element is oscillated at a first predetermined frequency, which may be a first resonant frequency, and is altered to oscillate at a second frequency, which may be a second resonant frequency, in response to a resultant force produced by the acceleration of the proof mass. The degree of change in nano-resonator element output frequency is sensed and processed using suitable processing circuitry as a change in acceleration.

Abstract: Apparatuses, methods and systems of sensor sampling of a field are disclosed. One apparatus includes a magnetometer that includes a sensor responsive to an applied field. Embodiments of the sensor include an active device and oscillator circuitry, wherein the sensor generates an output signal having a frequency that is dependent on the applied field. The magnetometer further includes a bias reset controller for resetting a bias of the active device and a sampler for sampling the output signal. Further, a reset-rate of the resetting of the bias of the active device is high enough to influence 1/f noise generated by the active device.

Abstract: Apparatuses, methods and systems of a magnetic sensor self-characterizing its magnetic properties are disclosed. One embodiment of the magnetic sensor apparatus includes a magnetic sensor and a current source for applying a current to the magnetic sensor. The magnetic sensor apparatus further includes control circuitry configured to control the current source, and characterize a magnetic property of the magnetic sensor based on the applied current. One method of a magnetic sensor self-characterizing its magnetic properties includes applying, by the magnetic sensor, an electrical signal, and characterizing a magnetic property of the magnetic sensor based on the applied electrical signal.

Abstract: Methods, apparatuses and systems of providing control of display content on a display with a device are disclosed. One method includes establishing a fixed reference on the display. A user input is received indicating that the device is at a user selected position corresponding to the fixed reference and capturing a position of the device in order to establish a corresponding reference position. The display content on the display is determined based on measured displacement of the device relative to the established reference position.

Abstract: A multilayer electronic imaging module and sensor system incorporating a micro-lens layer for imaging and collimating a received image from a field of regard, a photocathode layer for detecting photons from the micro-lens layer and generating an electron output, a micro-channel plate layer for receiving the output electrons emitted from the photocathode in response to the photon input and amplifying same and stacked readout circuitry for processing the electron output of the micro-channel plate. The sensor system of the invention may he provided in the form of a Cassegrain telescope assembly and includes electromagnetic imaging and scanning means and beam-splitting means for directed predetermined ranges of the received image to one or more photo-detector elements which may be in the form of the micro-channel imaging module of the invention.

Abstract: A solid state spectrometer unit cell or plurality of cells for sensing different wavelengths of electromagnetic radiation at different depths within the substrate of the device. Variable bias voltages on one or more p-n junctions in the device are used so that the depth of the depletion regions are selectively varied. By varying the depletion region thickness of the p-n junctions in the device, the wavelengths absorbed by the semiconductor device and resultant electron-hole pairs collected by the p-n junctions are varied. In one embodiment, the outputs of each of two unit cell p-n junctions are sensed and the difference calculated and output to suitable circuitry for display as representative of a particular range or frequency of the electromagnetic spectrum.

Abstract: A method for using a depletion region in a solid state spectrometer unit cell or plurality of cells for sensing different wavelengths of electromagnetic radiation at different depths within the substrate of the device. Variable bias voltages on one or more p-n junctions in the device are used so that the depth of the depletion regions are selectively varied. By varying the depletion region thickness of the p-n junctions in the device, the wavelengths absorbed by the semiconductor device and resultant electron-hole pairs collected by the p-n junctions are varied. In one embodiment, the outputs of each of two unit cell p-n junctions are sensed and the difference calculated and output to suitable circuitry for display as representative of a particular range or frequency of the electromagnetic spectrum.

Abstract: A multilayer electronic imaging module and sensor system incorporating a micro-lens layer for imaging and collimating a received image from a field of regard, a photocathode layer for detecting photons from the micro-lens layer and generating an electron output, a micro-channel plate layer for receiving the output electrons emitted from the photocathode in response to the photon input and amplifying same and stacked readout circuitry for processing the electron output of the micro-channel plate. The sensor system of the invention may be provided in the form of a Cassegrain telescope assembly and includes electromagnetic imaging and scanning means and beam-splitting means for directed predetermined ranges of the received image to one or more photo-detector elements which may be in the form of the micro-channel imaging module of the invention.

Abstract: The apparatus and method of the present invention provide an improved low cost and easy to manufacture vacuum-proof shatter-resistant enveloping component, having superior temperature stability, as well as high temperature and mechanical reliability, that is readily usable with any electronic/thermoelectric device that utilizes enveloped vacuum in the operation thereof. In accordance with various embodiments of the present invention, rather than being made from a single layer glass or a ceramic material, the novel vacuum enveloping component comprises a hollow housing fabricated from a thermo-stable metal alloy, and provided with an inner insulating layer composed of a non-conductive material.

Abstract: A targeting sight having viewing optics, a focal plane array and an alignment frame having an aperture that defines a target area that is mounted proximal the muzzle of a weapon. Electronic processing means is provided to define a crosshair in the viewing optics. The alignment frame is illuminated with a beam and the reflected portion of the beam is received by the focal plane array and is processed to position the crosshair with respect to the aperture.

Abstract: A method for defining an electrically conductive metalized structure, which may comprise an electrode or trace, on the surface of a three-dimensional element. The three-dimensional element may comprise a glass microsphere or shell resonator. A laser direct write grayscale photolithographic process is used in conjunction with electrically conductive metal deposition processes to define one or more electrically conductive metal structures on the surfaces of the three dimensional element.

Abstract: An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts.

Abstract: A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity.

Abstract: A process and product made from the process is disclosed to minimize solder collapse during solder reflow. Predetermined bond pads on a layer or component have a solder paste such as Sn63 solder paste with a first lower reflow temperature applied and a spacer element such as an SAC solder ball or stud bump having a predetermined geometry with a second higher reflow temperature applied. The SAC solder balls or stud bumps act as spacing elements but do not interact with the solder paste such that the solder paste may be reflowed while precisely maintaining the space between the layers.

Abstract: A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer.

Abstract: A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.

Abstract: A conformal, multilayer micro-channel structure having a wear-resistant interior micro-channel surface coating of an ALD deposited conformal alumina (Al2O3) ceramic of about 1000 ? in thickness and a titanium nitride (TiN) of about 300 ? to about 1000 ? in thickness. The Al2O3/TiN multilayer structure is resistant to erosion and to electro-chemical corrosion as is found in prior art micro-channel coolers and structures.

Abstract: A LIDAR sensor element and system for wide field-of-view applications such as autonomous UAS landing site selection is disclosed. The sensor element and system have an imaging source such as a SWIR laser for imaging a field of regard or target with a beam having a predefined wavelength. The beam is scanned over the field of regard or target with a beam steering device such as Risley prism. The reflected beam is captured by the system by receiving optics which may comprise a Risley prism for receiving and imaging the reflected beam upon a photodetector array such as a focal plane array. The focal plane array may be bonded to and a part of a three-dimensional stack of integrated circuits, a plurality of which may comprise one or more read out integrated circuits.