Abstract: An opposing first plate and second plate are slideably disposed with respect to each other using self-aligning plate registration means. Circuit board registration means and component registration means are provided for the initial X-Y alignment and registration of the circuit board and socket contact elements with one or more electrically conductive leads of an electronic component such as a focal plane array (FPA). A non-contact portion is provided on the first plate to eliminate plate contact with the first component surface which may comprise the lens of an FPA. The first and second plates are urged together such that an even, controlled and substantially planar compressive force is applied, permitting the efficient insertion of the electrically conductive leads into the socket contacts.

Abstract: A method for providing a known good integrated circuit die having enhanced planarity from a prepackaged integrated circuit die having a surface warpage such as in a ball grid array (BGA) package is provided. A partially-depackaged integrated circuit package is affixed to a substrate with a spacer element there between such that the active surface of the die within the partially depackaged integrated circuit die is “bowed” slightly upwardly to define a convex surface. The exposed encapsulant on the now-convex surface of the mounted, partially-depackaged integrated circuit package is then lapped or ground away to a predetermined depth so that an integrated circuit die is provided having an enhanced planarity and surface uniformity.

Abstract: A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer.

Abstract: A process and product made from the process is disclosed to minimize solder collapse during solder reflow. Predetermined bond pads on a layer or component have a solder paste such as Sn63 solder paste with a first lower reflow temperature applied and a spacer element such as an SAC solder ball or stud bump having a predetermined geometry with a second higher reflow temperature applied. The SAC solder balls or stud bumps act as spacing elements but do not interact with the solder paste such that the solder paste may be reflowed while precisely maintaining the space between the layers.

Abstract: A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.

Abstract: A conformal, multilayer micro-channel structure having a wear-resistant interior micro-channel surface coating of an ALD deposited conformal alumina (Al2O3) ceramic of about 1000 ? in thickness and a titanium nitride (TiN) of about 300 ? to about 1000 ? in thickness. The Al2O3/TiN multilayer structure is resistant to erosion and to electro-chemical corrosion as is found in prior art micro-channel coolers and structures.

Abstract: A LIDAR sensor element and system for wide field-of-view applications such as autonomous UAS landing site selection is disclosed. The sensor element and system have an imaging source such as a SWIR laser for imaging a field of regard or target with a beam having a predefined wavelength. The beam is scanned over the field of regard or target with a beam steering device such as Risley prism. The reflected beam is captured by the system by receiving optics which may comprise a Risley prism for receiving and imaging the reflected beam upon a photodetector array such as a focal plane array. The focal plane array may be bonded to and a part of a three-dimensional stack of integrated circuits, a plurality of which may comprise one or more read out integrated circuits.

Abstract: An anti-tampering device and method to inhibit or prevent unauthorized probing of an electronic circuit. Propriety target circuitry transmits a distinct signature in the form of an RF signal which is received by the RF anti-tampering detection circuitry. The transmitted RF signature is monitored by the RF anti-tampering detection circuitry for user-defined changes. In the event an unauthorized attempt is made to probe the target system electronics, the mass of the probe alters the RF transmission characteristics of the RF transmission media, changing the RF signature. The altered RF signature is received by the receiving antenna and RF receiver and is processed by signal processing electronics. The change in the RF signature indicates a tamper event and a predefined anti-tamper event is generated.

Abstract: A switched tracking power supply circuit that monitors an input power source and modifies the output based on the characteristics of the input source. A power source is input into a switching power supply. A plurality of gain networks and feedback paths from Vref of the switching power supply are in connection whereby the invention monitors the input power source and modifies the output based on the characteristics of the input source. In one embodiment, a smart controller monitors the discharge curve of a power source and translates the output to emulate the discharge curve of a second power source.

Abstract: A device and method using one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs. The nano-structure is in connection with a monitoring circuit and acts as a “trip wire” to detect unauthorized tampering with the device or module. Such a monitoring circuit may include a power source such as an in-circuit or in-module battery and a “zeroization” circuit within the chip or package to erase the contents of a memory when the nano-structure is breached or altered. One or more electrically conductive nano-structures interconnect and reroute one or more electrical connections between one or more ICs to create an “invisible” set of electrical connections on the chip or stack to obfuscate an attempt to reverse engineer the device. microscope.

Abstract: In a preferred embodiment of the invention, a mirror compiler is provided for each protected device or circuit resulting in a program that is embedded into the protected device's source code. The mirror compiler can be configured to have multiple selectable compilation parameters offering the programmer flexible options for mirrored power cancellations. In the preferred embodiment, the mirror compiler comprises a digital-to-analog converter and a digital-to-analog load to sink current. These elements serve to define a complement of the normal (i.e., unprotected) programmed device's output current. The digital-to-analog load currents are output and thus act to cancel the expected variations in the currents of the protected programmed device.

Abstract: A micro-lamellar grating interferometer for deriving the spectrum of an incident beam from a scene of interest from a generated interferogram is disclosed with a method for using the same. The interferometer comprises a lamellar grating defined by two interleaved reflective mirror set; a first stationary set of electromagnetically reflective elements and a second moveable set of electromagnetically reflective elements. The first and second set of electromagnetically reflective elements are referred to as mirror elements herein. The second mirror element set is disposed on a moveable platform supported by flexures that are driven with a high stiffness magnetic, thermal or piezoelectric actuator designed have a predetermined vertical displacement that is perpendicular to the first mirror set.

Abstract: An unmanned aerial surveillance and reconnaissance system are disclosed wherein an unmanned aerial vehicle is launchable from a launch tube, for instance, the bore of an existing weapons system mounted on a mobile vehicle, such as a weapon barrel of a tank or armored combat vehicle and which the launch may be remotely initiated from the protected armored compartment of the mobile vehicle.

Abstract: The invention is comprised of one or more variably conductive thermal switches. The thermal switches are sandwiched between two thermal conductors (e.g., heat pipes). Within each thermal switch is an array of micro-switches with a number of finger-like structures that are electrically actuated to form one or more thermal connection between two thermally conductive layers. The net thermal conductance of the switch is scalable based on the number of activated micro-switches. By changing the thermal conductance between the source and the sink, the temperature of the source may be adjusted based on the needs of the system in which it is employed.

Abstract: In a preferred embodiment of the invention, a high density interconnect structure is provided comprised of a dielectric structure and one or more compressible conductive member for the electrical connection of a plurality of inputs and outputs of a three-dimensional module to external circuitry using a compression frame and a flex connector. The compression frame has a surface equal to or less than the surface area of the module surface upon which it is mounted and permits a plurality of modules to be “butted” together to provide, for instance, a buttable focal plane array module comprising a mosaic of buttable focal plane arrays.

Abstract: A device and method for concurrently obtaining ultrasound and MRI image data are disclosed. A probe member comprises ultrasound imaging means at a first predetermined position on the probe member and an MRI coil at a second predetermined position on the probe member. An MRI imaging system having an MRI pulse sequence comprising an MRI image data acquisition period and an MRI pulse sequence time gap generates an MRI image data set. An ultrasound image data set is acquired only during the MRI pulse sequence time gap in which the operation of the ultrasound imaging means does not interfere with the MRI imaging operation.

Abstract: An intelligent surveillance system is disclosed for the identification of suspicious behavior near the exterior of a vehicle. The system of the invention is comprised of a “fish-eye” visible camera imaging system installed on the interior ceiling of an automobile for the 360-degree imaging and observation of the lower hemisphere around the perimeter of the vehicle. The camera of the system is augmented with an embedded processor based on DSP (digital signal processor) or FPGA (field-programmable gate array) technology to provide for the automatic detection of suspicious/hostile activities around the vehicle. The system is preferably provided with wireless transmitter means for alerting a person (e.g. the owner) of detected suspicious behavior.

Abstract: Inclinometer and directional field sensor readings can have gain, offset, and non-orthogonality errors, as well as reference alignment rotation errors. When a series of readings are taken by a three axis sensor with a variety of different orientations, the resulting dataset looks like a perfect hypothetical sphere in the absence of any errors; with errors as mentioned above the dataset looks like an offset, rotated, ellipsoidal quadratic surface. This invention provides a simple method of removing the above errors from a tilt reference device. A disclosed algorithm is divided into two distinct components: the ellipsoidal quadratic surface component, which covers gain, offset, and axis misalignment; and the rotation component, which covers rotation relative to a set of reference axes. The solution presented here addresses both components combined, or separated and for inclinometers, magnetometers and rate sensors.

Abstract: A thermally conductive heat spreader is disclosed comprising one or more electrically isolated through-hole vias to provide, for instance, one or more thermal management layers having one or more electrically insulated and electrically conductive through-hole vias in a microelectronic module for the rerouting of one or more electrical signals to one or more layers in a stack of integrated circuit chip layers. The method of the invention comprises disposing an electrically conductive member within an aperture in a heat spreader blank wherein the electrically conductive member is electrically insulated from the heat spreader blank by means of a dielectric layer to provide a vertical through-hole via for the vertical routing of an electrical signal through the heat spreader.

Abstract: A multilayer electronic module for photon counting such as in the solar blind region of the ultraviolet electromagnetic spectrum is provided. The device comprises a photocathode for detecting photons and generating an electron output, a micro-channel plate for receiving the output electrons emitted from the photocathode in response to the photon input and amplifying same, readout circuitry and one or more bit-counting circuit layers used to count the electron output of the micro-channel plate.