Abstract: Circuitry and program code adapted for carrying out an associated technique for characterizing the response of one or more magnetoelastic sensor elements during exposure to an excitation field generated by an interrogation coil: including: (a) measuring a total sensor signal from the coil with the sensor element positioned within the excitation field within a spacing created by a winding of the coil; and (b) automatically determining: (i) a total measured impedance spectrum from said total sensor signal so measured, and (ii) a plurality of magnitude values representing the real part of a reconstructed impedance spectrum for the sensor element. The reconstructed impedance spectrum for the sensor element, having been calculated by subtracting an impedance generally attributable to the coil during the time an AC excitation signal is provided, from the total measured impedance.

Abstract: A signal processing method and device for measuring the input rate of an FM micro-gyro having a modulation frequency FM and having an oscillator sense element having a nominal frequency FOSC is disclosed. In a first aspect of the invention, the method comprises defining a first time interval TWN and a second time interval TWP and measuring the first time interval and the second time interval by counting the number of periods of a predetermined reference frequency. The nominal frequency of the oscillator sense element FOSC is measured along with the modulation frequency FM. From these measurements, the proof mass period NW is calculated. The time difference ?t is calculated from the above measurements. The method then comprises calculating a modulation M that produced the measured ?t, preferably using an iterative method. From the above, the input rate ? is calculated by dividing M by a sensitivity S of the FM micro-gyro.

Abstract: A readout circuit is disclosed for use in an AM chirp LADAR system. The circuit comprises a photodetector such as a metal-semiconductor-metal detector coupled to a passive electronic filter. The filter output coupled to a capacitive-coupled transimpedance amplifier with an output coupled to an analog storage register. The analog storage register output is coupled to a sample-and-hold circuit which in turn is coupled to a sample and hold circuit. The output of the sample and hold circuit is digitized by an analog-to-digital converter circuit for further processing. The circuit may be used as a cell for the readout of an individual pixel on a photodetector or a plurality of cells used in a stack of integrated circuit chips for the read out of a plurality of pixels in a photodetector array.

Abstract: An energy-harvesting buoy is provided comprising an air-pressure generator, such as a piezo-electric generator, or any other generator that can harvest energy from an air pressure. The energy harvesting buoy consists of a first float and a second float. An air pressure is created when relative vertical motion occurs between the first float and the second float which drives an air pressurization means such as a piston driven air pump using a linkage member pivotably mounted between the respective floats. The generator uses the air pressure from the air pressurization means to drive the generator to generate electrical power.

Abstract: A device for in-situ calibration of a thermal imager on a UAS is disclosed. A rotatable lens curtain is provided with an aperture for the lens of a thermal imager to observe a field of view. The lens curtain comprises a balancing weight and blocking portion having a thermally uniform interior surface that functions as a calibration surface. The lens curtain is disposed with respect to the lens such that when the UAS is in a substantially level flight path, the lens is exposed to the field of view through the aperture. The lens curtain is provided such that when the UAS is rotated about an axis, the lens curtain maintains its absolute position relative to the Earth by virtue of the balance weight and the lens rotates within the lens curtain such that the blocking position obscures the lens from the field of view and the lens is exposed to the thermally uniform interior surface such that a calibration operation can be performed by the thermal imager.

Abstract: A phase-sensing and scanning time-of-flight LADAR method and device are disclosed that take advantage of an atmospheric absorption bands within the solar IR spectrum. In the phase-sensing LADAR embodiment, an object is illuminated with electromagnetic energy such as a laser beam having a wavelength substantially equal to a predetermined atmospheric absorption band such as 1.39 microns. The transmitted laser beam is modulated at a predetermined frequency and has a first phase. The phase of the reflected and returned laser beam is altered proportional to the distance of the object and has a second phase. The first phase of the transmitted signal and the second phase of the received signal are compared and used to determine the distance of the object from the device. The system may comprise a modified laser that is tuned to operate in an atmospheric absorption band.

Abstract: A device and method are disclosed comprising one or more electrically conductive nano-structures defined on one or more surfaces of a microelectronic circuit such as an integrated circuit die, microelectronic circuit package (such as a TSOP, BGA or other prepackaged IC) a stacked microelectronic circuit package, or on the surface of one or more layers in a stack of layers containing one or more ICs. In one embodiment, the electrically conductive nano-structure is in electrical connection with a monitoring circuit and acts as a “trip wire” to detect unauthorized tampering with the device or module. Such a monitoring circuit may include a power source such as an in-circuit or in-module battery and a “zeroization” circuit within the chip or package to erase the contents of a memory when the electrically conductive nano-structure is breached or altered. The device may be configured to blow one or more fuses or overcurrent protection devices when the electrically conductive nano-structure is breached or altered.

Abstract: A micro-combustion power system is disclosed. In a first embodiment, the invention is comprised of a housing that further comprises two flow path volumes, each having generally opposing flow path directions and each generally having opposing configurations. Each flow path volume comprises a pre-heating volume having at least one pre-heating heat exchange structure. Each flow path volume further comprises a combustion volume having a combustion means or structure such as a catalytic material disposed therein Further, each flow path volume comprise a post-combustion volume having at least one post-combustion heat exchange structure. One or more thermoelectric generator means is in thermal communication with at least one of the combustion volumes whereby thermal energy generated by an air/fuel catalytic reaction in the combustion volume is transferred to the thermoelectric generator to convert same to electrical energy for use by an external circuit.

Abstract: A selectively positionable lens cover is disclosed comprising a lens housing volume and comprising an arcuate lip portion for the selective engagement to and disengagement from a lens. The lens cover further comprises a first engagement structure whereby the first engagement structure may be releaseably engaged with and removed from a second engagement structure. In a preferred embodiment, the lens cover further comprises an aperture having a first longitudinal axis whereby the first engagement structure may be selectively engaged with and removed from the second engagement structure in a first position that is substantially aligned with a user-defined second longitudinal axis.

Abstract: A micro-image acquisition and transmission system is provided. In a preferred embodiment, the system is comprised of an image acquisition chip comprising an electronic imager, control electronics and a micro powered rotary stage comprising a transceiver array that acts as a hub to optically link a group of distributed image acquisition chips. A preferred embodiment is further comprised of a transceiver array chip comprising one or more micro-powered rotary stages having a transceiver array assembly disposed thereon. The micro-powered rotary stage is supported by a micro-brush bearing.

Abstract: An artificial synapse array and virtual neural space are disclosed. More specifically, a cognitive sensor system and method are disclosed comprising a massively parallel convolution processor capable of, for instance, situationally dependent identification of salient features in a scene of interest by emulating the cortical hierarchy found in the human retina and visual cortex.

Abstract: A network of remote sensing node assemblies, a first and second of which each has a sensor element, as well as associated technique and program code for transmitting information collected about a liquid environment. The network provides the capability of sensing the liquid to collect a wide variety of types of information/data about the liquid and any surrounding environments, and transmitting from the originating node assembly to a different node within acoustic transmission range, and then transmitting further to a third node assembly where the information may be processed and communicated to a user, or further transmitted by way of suitable medium, preferably as electromagnetic signals, to a host location for processing into a compilation of data. Each of at least two sensing node assemblies has at least one sensor element adapted for operation while immersed within the liquid, a source of power, and a transducer for receiving acoustic waves/signals transmitted from another node assembly.

Abstract: A known good die is economically fabricated. A tested integrated circuit is provided which includes a die having a bonding location on an upper surface and a lead. An upper portion of the integrated circuit package is removed or ground away to expose the bonding location. The lead is removed leaving the die and exposed bonding location to provide a known good die. The backside portion of the integrated circuit package is removed or ground away to expose the backside of the die. A contact pad is disposed on the bonding location. The bonding wire and exterior lead are also removed or ground away. The upper portion of the bonding ball is removed to provide a flattened bonding location. Preferably, the tested integrated circuit package provided is a thin small outline integrated circuit package (TSOP), and advantageously may be a packaged flash memory integrated circuit.

Abstract: A method is disclosed for providing electrical connections to electronic elements within a multilayer module. The method includes providing first and second active layers having first and second edges, respectively. Each active layer includes a flexible, polymer substrate and at least one electronic element formed within the substrate. Electrically-conductive traces provide electrical connections from the first and second edges to the electronic elements. An adhesive is applied to at least one of a top surface of the first active layer and a bottom surface of the second active layer and the top surface of the first active layer is adhered to the bottom surface of the second active layer. The first edge and the second edge are aligned with each other thereby forming a side of the multilayer module. Electrically-conductive lines are applied along the side of the multilayer module to provide electrical connections to the traces.

Abstract: A chip stack includes a field programmable gate array (FPGA) and an auxiliary component coupled to the FPGA with intercommunicated clock, control and/or data signals. The auxiliary component has a functionality mapped into the FPGA. The pin definition of the FPGA is redefined so that the FPGA and the auxiliary component in combination operate as a modified FPGA. A test circuit is programmed into the FPGA to exercise the auxiliary component to test functionality and timing performance at full speed. The functionality of the auxiliary component mapped into the FPGA is parameterized, such as for the data word width for reading and/or writing data words of different lengths into the auxiliary component in both an aligned and nonaligned manner. A memory interface allows multiple auxiliary circuits to be accessed through the FPGA either together to generate a wider data word or serially to achieve a greater memory depth.

Abstract: An anti-tamper module is provided for protecting the contents and functionality of an integrated circuit incorporated in the module. The anti-tamper module is arranged in a stacked configuration having multiple layers. A connection layer is provided for connecting the module to an external system. A configurable logic device is provided for routing connections between the integrated circuit and the connection layer. Specifically, the configurable logic device is programmable to create logical circuits connecting at least one of the input/output connectors of the integrated circuit to at least one of the input/output connectors of the connection layer. Configuration information for programming the reconfigurable logic device is stored in a memory within the module.

Abstract: Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The leads on the access plane are interconnected among layers to form a high-density electronic package.

Abstract: A temperature dependent focal plane array operates without a temperature stabilization cooler and/or heater over a wide range of ambient temperatures. Gain, offset and/or bias correction tables are provided in a flash memory in memory pages indexed by the measured temperature of the focal plane array. The memory stores a calibration database, which is accessed using a logic circuit which generates a memory page address from a digitized temperature measurement of the focal plane array. The calibration database is comprised of an array of bias, gain and offset values for each pixel in the focal plane array for each potential operating temperature over the entire range of potential operating temperatures. The bias, gain and offset data within the database are read out, converted to analog form, and used by analog circuits to correct the focal plane array response.

Abstract: A sensor system (30) has a sensor module (10) and a receiver module (45). The sensor module (10) functions as a wireless data collection device and has a flexible thin sheet of silicon (60, 65, 70) comprising circuitry (71, 72, 73), a flexible power source (105), and a flexible support substrate (55). The silicon, power source, and flexible support substrate are integrated as layers of the sensor module (10). The layers are placed together in the form of an adhesive bandage (10). A plurality of electrodes (80) are connected to the sensor module (10) and protrude from the flexible substrate (55) for contacting the skin of a subject body (20). The receiver module (45) includes one of an RF receiver with a wireless port for continuously receiving data (40), or a physical I/O port (87) to which the sensor module (10) can be physically connected for downloading stored data from the sensor module (10).

Abstract: A structure of an image sensor for sensing the light of an image impinging thereupon and for translating the image into a standard television format is disclosed. The structure comprises a plurality of first and second light detecting elements (22, 23) arranged in rows and columns and half as many rows and columns as scan lines of a television format for generating respective analog signals in proportion to the intensity of the light impinging respectively on each of the first and second light detecting elements (22, 23), wherein the first and second light detecting elements in each row are alternately disposed and activated by first read lines RDOn (n=1 . . . 256) to generate odd field signals, and wherein the first and second light detecting elements (22, 23) of two adjacent rows disposed in a zigzag or serrated manner are activated by second read lines RDEn (n=1 . . . 256) to generate even field signals.