Patents Assigned to Sensor Corporation
  • Patent number: 5045685
    Abstract: An integrated circuit chip having a plurality of parallel channels, and a stack of such chips, are disclosed, in which the function of A/D signal conversion is accomplished in each on-chip channel. In order to satisfy the power and real estate limitations of the chip(s), a substantial part of the A/D conversion circuitry is located off-chip. Two devices are required in each channel on each chip, a precision comparator, and a storage register. These may be combined with an off-chip analog ramp, and an off-chip digital ramp. Certain on-chip performance enhancements are disclosed, which can operate either in the analog mode or the digital mode. One such enhancement is compensating for the voltage offset of each comparator. Another enhancement is reducing the duty cycle of each precision comparator, in order to lower power requirements. An important use for the disclosed concepts is the field of multi-layer Z-technology modules, having two dimensional photo-detector arrays.
    Type: Grant
    Filed: June 6, 1990
    Date of Patent: September 3, 1991
    Assignee: Irvine Sensors Corporation
    Inventor: Llewellyn E. Wall
  • Patent number: 5027499
    Abstract: The invention is concerned with a method for manufacturing a channel device, especially for recordings of thermal conductivity, viscosity, density, dielectric constants, refractive indices, etc. of materials such as fluids and gases (called samples), where the material under investigation is guided through a measuring channel with at least one sensor and at least one inlet and one outlet orifice for the sample. The invention also concerns the fabrication procedure of the channel device, especially the recording unit for determining the thermal conductivit, viscosity, density, dielectric constant, etc. of samples where the material under investigation is passed through or brought into a measuring channel which is equipped with sensors and actuators.
    Type: Grant
    Filed: April 21, 1989
    Date of Patent: July 2, 1991
    Assignee: Otto Sensors Corporation
    Inventor: Otto J. Prohaska
  • Patent number: 4983533
    Abstract: A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all the leads of the stack are exposed on an access plane. Where heat extraction augmentation is needed, additional interleaved layers are included in the stacks which have high thermal conductivity, and are electrical insulators. These interleaved layers may carry rerouting electrical conductors. Bonding bumps are formed at appropriate points on the access plane. A stack-supporting substrate is provided with suitable circuitry and bonding bumps on its face. A layer of insulation is applied to either the access plane or stack-supporting substrate, preferably the latter. The bonding bumps on the insulation-carrying surface are formed after the insulation has been applied.
    Type: Grant
    Filed: October 28, 1987
    Date of Patent: January 8, 1991
    Assignee: Irvine Sensors Corporation
    Inventor: Tiong C. Go
  • Patent number: 4912545
    Abstract: A bump bonding process and product are disclosed in which both pressure and heating are used in situations where the temperature should not exceed a predetermined amount, e.g., bonding of a photoconductor array to a module containing electronic processing devices. The bonding process involves eutectic alloying of indium and bismuth, allowing welding of the bumps at a temperature substantially below the two metals' melting points. In one version of the invention, bumps on adjacent substrates are directly aligned. In another version, each bump on one substrate is wedged between a pair of bumps on the other substrate.
    Type: Grant
    Filed: September 16, 1987
    Date of Patent: March 27, 1990
    Assignee: Irvine Sensors Corporation
    Inventor: Tiong C. Go
  • Patent number: 4911892
    Abstract: A gas sensing thick film is positioned on an insulating substrate in contact with a pair of electrodes. A non-porous glass layer surrounds the film to stabilize it on the substrate. A heating element maintains the film at a preselected elevated temperature. The gas sensing thick film has a response characteristic for a preselected target gas to be detected which is enhanced by impregnating the film with platinum or palladium chlorine free compounds. The response characteristic of the gas sensing film is further increased by promoting combustion of interference gases on an outer filter layer fabricated of either conductive or nonconductive material. The incorporation of an insulating material between the gas sensing film and the outer filter layer also serves to increase the relative response of the gas sensing film to a preselected target gas.
    Type: Grant
    Filed: February 24, 1987
    Date of Patent: March 27, 1990
    Assignee: American Intell-Sensors Corporation
    Inventors: Richard Grace, Alberto M. Guzman, Marc A. Portnoff, Paul D. Runco, Lymperios N. Yannopoulos
  • Patent number: 4814629
    Abstract: An optical/electronic real time image motion transfer system is disclosed in which voltage output signals from photodetectors in an array are fed through a switching network. This network includes intermediate buses, electronic switching devices between such buses and addresses of the signals from the photodetectors, and electronic switching devices between such buses and addresses of the signals which are fed to the output lines. The output lines preferably receive their multiplexed signals from filters, or bins, which have stored (and thus integrated) successive voltage signals from individual pixels.
    Type: Grant
    Filed: October 13, 1987
    Date of Patent: March 21, 1989
    Assignee: Irvine Sensors Corporation
    Inventor: Jack L. Arnold
  • Patent number: 4806761
    Abstract: A thermal imaging system is disclosed in which infrared radiation from the viewed scene is transmitted to a two-dimensional detector array carried on the focal plane of an optical/electronics module which has embedded in it amplifying, filtering and multiplexing circuitry utilizing MOSFET transistors. The module is located inside the cooling device. Cooling requirements depend on the alternatives (a) of using detectors responsive to wavelengths in the 3.0 to 5.0 micron range, which require less cooling, or (b) of using detectors responsive to wavelengths in the 8.0 to 12.0 micron range, which require liquid nitrogen cooling. The two-dimensional detector array may be combined with a limited scanning, called "nutation", which causes each detector to view a plurality of pixels in the incoming infrared radiation.
    Type: Grant
    Filed: March 9, 1987
    Date of Patent: February 21, 1989
    Assignee: Irvine Sensors Corporation
    Inventors: John C. Carson, Stewart A. Clark
  • Patent number: 4801865
    Abstract: A probe for sensing the moisture content in a porous medium such as soil. The probe includes an array of a multiplicity of conductors and resistors formed on a substrate, with contact pins or electrodes connected to one end of each resistor, typically extending outwardly from the substrate. The resistor array is preferably divided into at least two groups, providing a separate output for each group. An appropriate voltage source and indicator means are connected to the resistor array in a circuit to provide indication of soil moisture. The transfer characteristic of the apparatus is such that the probe has improved sensitivity in the area of primary interest, that is at, between 80 and 100% of saturation.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: January 31, 1989
    Assignee: California Sensor Corporation
    Inventors: Ralph W. Miller, Kent O'Brien
  • Patent number: 4791286
    Abstract: Circuitry for a focal plane pre-amplifier is disclosed in which the input of the pre-amplifier is switched between the signal from its photo-detector and a connection to ground. During the ground-connected interval, the pre-amplifier transistor is temporarily diode-connected in such a way that the transistor's voltage is stored on a capacitor, which is connected between the incoming photo-detector signal and the input of the pre-amplifier transistor. During the photo-detector connected interval, the voltage stored on the capacitor is subtracted from the voltage signal supplied by the photo-detector.
    Type: Grant
    Filed: April 27, 1987
    Date of Patent: December 13, 1988
    Assignee: Irvine Sensors Corporation
    Inventor: Llewellyn E. Wall
  • Patent number: 4779005
    Abstract: A focal plane electronic system is disclosed, in which a two-dimensional array of photo-detectors receives pixel information from a scanned scene. Each pixel is observed by a plurality of detectors, and their signals are summed by time delay and integration (TDI) circuitry. The TDI circuitry comprises parallel capacitors which are charged and discharged under the control MOSFET switches. The discharge timing is such that all the detector signals representing a given pixel arrive simultaneously at a summing node. Means are included for automatically reducing the effect of anomalous detector signals on the summed output. The entire TDI system is included in a Z-type three-dimensional focal plane module.
    Type: Grant
    Filed: May 11, 1987
    Date of Patent: October 18, 1988
    Assignee: Irvine Sensors Corporation
    Inventor: Jack L. Arnold
  • Patent number: 4764846
    Abstract: A high density electronic package is disclosed in which a stack of layer-like sub-modules have their edges secured to a stack-carrying substrate, the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has a cavity, inside which one or more IC chips are located. Each cavity-providing sub-module may be formed either by securing a rectangular frame to a chip-carrying substrate, or by etching a cavity in a single piece of material. In the latter case, the chips are mounted on the flat surface of one sub-module, and located inside the cavity of the next sub-module.
    Type: Grant
    Filed: January 5, 1987
    Date of Patent: August 16, 1988
    Assignee: Irvine Sensors Corporation
    Inventor: Tiong C. Go
  • Patent number: 4706166
    Abstract: A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all the leads of the stack are exposed on an access plane. Bonding bumps are formed at appropriate points on the access plane. A supporting substrate, formed of a light transparent material, such as silicon, is provided with suitable circuitry and bonding bumps on its face. A layer of insulation is applied to either the access plane or the substrate face, preferably the latter. The bonding bumps on the insulation-carrying surface are formed after the insulation has been applied. The substrated face is placed on the access plane of the stack, their bonding bumps are microscopically aligned, and then bonded together under heat and/or pressure.
    Type: Grant
    Filed: April 25, 1986
    Date of Patent: November 10, 1987
    Assignee: Irvine Sensors Corporation
    Inventor: Tiong C. Go
  • Patent number: 4704319
    Abstract: A method and related fixtures are disclosed which permit formation of stacks of thin circuitry-carrying layers. The layers terminate in an access plane having a two dimensional array of closely-spaced electrical leads. The method includes the steps of measuring the thickness of separate chips, selecting groups of chips having appropriate thicknesses, applying appropriate amounts of epoxy between adjacent chips, aligning the chips (and their electrical leads) in the direction parallel to their planes (i.e., the X-axis), and closing the cavity with an end wall which (a) exerts pressure on the stacked chips and epoxy in a direction perpendicular to the chip planes, and (b) establishes a fixed height of the stack in order to align the leads in the Y-axis. The final fixture provides a fixed-size cavity for confining the layers during curing of thermo-setting adhesive which has been applied between each adjacent pair of layers.
    Type: Grant
    Filed: March 21, 1986
    Date of Patent: November 3, 1987
    Assignee: Irvine Sensors Corporation
    Inventors: Robert J. Belanger, Alan G. Bisignano
  • Patent number: 4675532
    Abstract: A photodetector sensing system is disclosed which combines staring and scanning features. By providing both temporal and spatial filtering, many system benefits are obtained. Each pixel in the viewed scene has a "dedicated" filter, which receives signals only from that pixel. By integrating time spaced signals from the same pixel, the filter maintains the staring effect of a two-dimensional detector array. A single detector may view a plurality of pixels, thereby improving resolution. A single pixel may be viewed by a plurality of detectors, thereby providing redundancy to correct for detector failures. The signal from each detector, after amplification, is first sent through a spatial, high frequency filter, and then is set to one of a plurality of parallel temporal, low frequency filters, which time share the detector. Synchronizing means are provided for ensuring that each temporal filter always receives its time spaced signals from the same source. Any suitable scanning mechanism may be used.
    Type: Grant
    Filed: November 6, 1985
    Date of Patent: June 23, 1987
    Assignee: Irvine Sensors Corporation
    Inventor: John C. Carson
  • Patent number: 4672737
    Abstract: A photo-detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each plane is etched to cut back the semiconductor material, then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.
    Type: Grant
    Filed: August 2, 1985
    Date of Patent: June 16, 1987
    Assignee: Irvine Sensors Corporation
    Inventors: John C. Carson, Stewart A. Clark
  • Patent number: 4646128
    Abstract: A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.
    Type: Grant
    Filed: April 8, 1985
    Date of Patent: February 24, 1987
    Assignee: Irvine Sensors Corporation
    Inventors: John C. Carson, Stewart A. Clark
  • Patent number: 4617160
    Abstract: A method and related fixtures are disclosed which permit formation of stacks of thin circuitry-carrying layers. The layers terminate in an access plane having a two dimensional array of closely-spaced electrical leads. The method includes the steps of measuring the thickness of separate chips, selecting groups of chips having appropriate thicknesses, applying appropriate amounts of epoxy between adjacent chips, aligning the chips (and their electrical leads) in the direction parallel to their planes (i.e., the X-axis), and closing the cavity with an end wall which (a) exerts pressure on the stacked chips and epoxy in a direction perpendicular to the chip planes, and (b) establishes a fixed height of the stack in order to align the leads in the Y-axis. The final fixture provides a fixed-size cavity for confining the layers during curing of thermo-setting adhesive which has been applied between each adjacent pair of layers.
    Type: Grant
    Filed: November 23, 1984
    Date of Patent: October 14, 1986
    Assignee: Irvine Sensors Corporation
    Inventors: Robert J. Belanger, Alan G. Bisignano
  • Patent number: 4613816
    Abstract: A magnetic probe for detecting the location of a magnetic anomaly. The probe includes an outer dewar jacket that defines a chamber maintained at cryogenic temperatures by a helium reservoir. Mounted on the reservoir in the chamber is a substrate which supports a plurality of pairs of gradiometer coils and a magnetometer. A plurality of SQUIDs detect the magnetic fields sensed by the magnetometer and the pairs of gradiometer coils to determine the magnetic field intensities, directions and gradients from which can be determined location, speed and direction of the anomaly. A valving network connecting the reservoir to a vent allows the probe to be operated in any orientation around its horizontal axis.
    Type: Grant
    Filed: April 3, 1984
    Date of Patent: September 23, 1986
    Assignee: Geo-Sensors Corporation
    Inventor: Geoffrey H. Zeamer
  • Patent number: 4596948
    Abstract: A stabilized current source for integrated circuit use utilizes a linear ramp voltage across a capacitor to provide the desired current value in a "control" transistor which is in a current mirror relationship with a bias-current-providing transistor. The control and bias-providing transistors are "matched", in the sense that the ratio of the current value in one to the current value in the other remains the same at all times, provided they are subject to the same voltage. The linear ramp voltage across the capacitor causes a constant current to flow through the capacitor and the control transistor. The voltages across the control and bias-providing transistors are retained at the same value. Leakage at one voltage reference terminal of the bias-providing transistor is periodically compensated for by closing a switch between it and the corresponding reference terminal of the control transistor. Thus, the constant current in the control transistor is replicated in the matched bias-providing transistor.
    Type: Grant
    Filed: October 17, 1984
    Date of Patent: June 24, 1986
    Assignee: Irvine Sensors Corporation
    Inventor: Llewellyn E. Wall
  • Patent number: RE33331
    Abstract: A multiplexer circuit is disclosed, for use with such signal sources as focal plane detector arrays, which contains a large number of parallel branches, each of which includes a transconductance MOSFET amplifier and a MOSFET switch of opposite channel polarity from the amplifier. The amplifier in each branch receives high impedance voltage signals orginating from its individual detector and converts them with high power gain into current signals which feed into the common output line whenever the switch in the same branch is turned on. The multiplexer branches, together with the multiplexer control logic, and other electronic devices, are all included on a signal IC chip which provides CMOS logic.
    Type: Grant
    Filed: April 10, 1989
    Date of Patent: September 11, 1990
    Assignee: Irvine Sensors Corporation
    Inventor: Randolph S. Carlson