Abstract: A resist composition is provided comprising (A) a metal compound having formula (A-1), a hydrolysate or hydrolytic condensate thereof, or the reaction product of the metal compound, hydrolysate or hydrolytic condensate thereof with a di- or trihydric alcohol having formula (A-2), and (B) a sensitizer containing a compound having formula (B-1). The resist composition is adapted to change a solubility in developer upon exposure to high-energy radiation, has high resolution and sensitivity, and forms a pattern of good profile with minimal edge roughness after exposure.
Abstract: The present invention is a radically curable organosiloxane graft polyvinyl alcohol polymer having structural units represented by both of the following general formula (1) and general formula (2). The present invention provides a radically curable organosiloxane graft polyvinyl alcohol polymer having general properties such as film-forming property and transparency, excellent handleability as a liquid material since solubility in an organic solvent is high, and both of solvent resistance and moldability of the obtained film.
Abstract: A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 ?m.
Abstract: The present invention provides a bio-electrode composition comprising a polymer compound having a repeating unit A that contains silver salt of fluorosulfonic acid, silver salt of fluorosulfonimide, or silver salt of fluorosulfonamide. This can form a living body contact layer for a bio-electrode with excellent electric conductivity, biocompatibility and light weight, which can be manufactured at low cost and does not cause large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition and a method for manufacturing the bio-electrode.
February 11, 2019
August 22, 2019
SHIN-ETSU CHEMICAL CO., LTD.
Jun HATAKEYAMA, Osamu WATANABE, Motoaki IWABUCHI, Shiori NONAKA, Koji HASEGAWA
Abstract: Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.
Abstract: A negative electrode active material for a negative electrode material of a non-aqueous electrolyte secondary battery, includes a silicon-based material expressed by SiOx where 0.5?x?1.6 and either or both of a crystalized fluorine compound and a compound containing —CF2—CF2— units in at least a part of a surface layer of the negative electrode active material, the silicon-based material containing at least one of Li6Si2O7, Li2Si3O5, and Li4SiO4. There can be provided a negative electrode active material that can increase the battery capacity and improve the cycle performance and initial charge and discharge performance when used for a lithium-ion secondary battery, as well as a lithium-ion secondary battery having a negative electrode using this negative electrode active material.
Abstract: Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa·s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.
Abstract: A solar battery cell including a finger electrode on a first main surface of a semiconductor substrate, the solar battery cell being including at least a surface of the finger electrode is covered with a material containing an insulating material so that the surface is not exposed, and the material containing the insulating material does not hydrolyze or does not generate a carboxylic acid when it hydrolyzes. Consequently, it is possible to provide a solar battery cell which suppresses a reduction in photoelectric conversion efficiency with time even though EVA is used and to provide a photovoltaic module using this solar battery cell.
Abstract: A (meth)acrylic silicone graft (co)polymer having a unit represented by the following formula (I), a structure represented by the following formula (III) at one terminal, and a structure represented by the following formula (IV) at the other terminal, wherein A is a group having a linear organopolysiloxane structure represented by the following formula (1) or a group having a dendritic organopolysiloxane structure represented by the following formula (2-1) or (2-2), X? is a group as defined for A, wherein Z is a divalent organic group, Q is a group represented by the following formula (2), D is a (3c+1)-valent organopolysiloxanyl group which has a hierachial order of c, 3c means 3 raised to the power of c, c is an integer of from 1 to 8.
Abstract: A polycrystalline silicon rod is synthesized by the Siemens method (S101). After the polycrystalline silicon rod is covered from above with a plastic bag whose inner surface has been washed, and housed in the plastic bag in a reactor (S103), the polycrystalline silicon rod is removed out of the reactor (S104), and heat-sealed and stored in an enclosed state (S105). According to the present invention, steps conventionally considered as essential, such as washing, etching, and water washing, are not always necessary, and therefore the concentrations of fluorine ions, nitrate ions, and nitrogen dioxide ions remaining on the surface can each be less than 0.2 ppbw. In addition, by covering with the plastic bag, the metal contamination levels decrease significantly. Moreover, when the handling according to the present invention is performed, surface contamination hardly proceeds even if the polycrystalline silicon rod is stored for a long period.
Abstract: An inorganic hydrophilic coating solution including (a) an aqueous solution containing an amorphous silicate compound obtained by hydrolyzing and condensing a tetrafunctional silicon compound having a purity of 99.0 mass % or greater in an aqueous medium in the presence of a basic compound at a temperature within a range from normal temperature to 170° C., (b) water, and optionally, (c) not more than 30 mass % of an alcohol, a ketone, or a surfactant, where the concentration of the solid fraction derived from the aqueous solution containing the amorphous silicate compound is 0.01 to 2.0 mass % and the pH is 5 to 8; an inorganic hydrophilic coating film formed from a dried and cured product of the inorganic hydrophilic coating solution; a member having a substrate and the inorganic hydrophilic coating film formed on the surface of the substrate; and a cover panel for a solar cell module including the member.
Abstract: An optical fiber base material manufacturing apparatus including a reaction chamber; a burner that has a portion thereof inserted into the reaction chamber through an insertion opening that creates a connection between the inside and outside of the reaction chamber, and emits a flame toward a starting member positioned within the reaction chamber; and a seal connection member that creates an air-tight seal between the burner and the reaction chamber at the insertion opening. One end of the seal connection member firmly contacts the burner inserted therethrough, another end of the seal connection member firmly contacts the reaction chamber and has a through-hole formed therein through which the burner is inserted without contacting the seal connection member, and the seal connection member includes a connecting portion that connects the one end to the other end, while preventing transfer of stress between the one end and the other end.
Abstract: A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.
Abstract: A polymer comprising recurring units derived from vinylanthraquinone, recurring units containing a benzene ring having a hydroxyl-bearing tertiary alkyl group bonded thereto, and recurring units derived from hydroxystyrene is provided. The polymer is used as a base resin to formulate a negative resist composition having a high resolution and minimal LER.
Abstract: An optical isolator includes: an optical isolator chip in which a first polarizer, a Faraday rotator made of a ferromagnet, and a second polarizer are bonded and fixed in this order; and a magnet for applying a magnetic field to the optical isolator chip. A light-entering end surface or a light-exiting end surface of the optical isolator chip is bonded and fixed to a component. On an optical axis of the optical isolator, a center of a magnetic flux formed by the magnet is positioned closer to the end surface side bonded and fixed to the component than a central position of the Faraday rotator on the optical axis. The optical isolator has high bonding reliability to the component.
Abstract: This is to provide a thermosetting epoxy resin sheet for encapsulating a semiconductor which is excellent in flexibility in a state before curing, and good in handling property, while maintaining a high glass transition temperature after curing, and also excellent in storage stability and moldability. The thermosetting epoxy resin sheet for encapsulating a semiconductor is a material which comprises a composition containing (A) a bisphenol A type epoxy resin and/or a bisphenol F type epoxy resin each having crystallinity, (B) a polyfunctional type epoxy resin which is solid at 25° C. and other than the Component (A), (C) a phenol compound having two or more phenolic hydroxyl groups in one molecule, (D) an inorganic filler, and (E) an imidazole-based curing accelerator having a melting point of 170° C. or higher, and one or two hydroxymethyl groups in one molecule, being molded in a sheet form.
Abstract: The present invention is a stretchable film composition including: a silicone main-chain type urethane having a structure shown by the following general formula (1)-1 and/or (1)-2, and a silicone-pendant type urethane having a structure shown by the following general formula (2)-1 and/or (2)-2. The present invention provides a stretchable film composition that has excellent stretchability and strength, with the film surface having excellent water repellency, and is favorably used for a non-tackiness stretchable film, a stretchable film using the stretchable film composition, and a method for forming the same.
January 29, 2019
August 8, 2019
SHIN-ETSU CHEMICAL CO., LTD.
Jun HATAKEYAMA, Motoaki IWABUCHI, Shiori NONAKA, Koji HASEGAWA
Abstract: This waterproof sheet made of a silicone rubber is characterized by being provided with: a base material layer obtained by curing a silicone rubber composition; and a pressure-sensitive adhesive layer comprising a cured product of a silicone gel composition laminated on one surface of the base material layer, wherein, on the other surface of the base material layer, a coating layer containing a silicone resin represented by average composition formula (1): [RSiO3/2]m[R2SiO]n (in the formula, each R represents an identical or a different monovalent hydrocarbon group that is unsubstituted or substituted and that contains 1-20 carbon atoms, m is 0.45-1.0, n is 0-0.55, and m+n?1.0 is satisfied) is included.
Abstract: Provided are phosphor particles comprising Mn-doped complex fluoride red phosphor particles and inorganic fine particles which are affixed to the surface of each red phosphor particle. The Mn-doped complex fluoride red phosphor-containing phosphor particles are suppressed in mutual adhesion and agglomeration, flow well during mixing with a silicone or epoxy resin, and have excellent humidity resistance.