Patents Assigned to Shin-Etsu Polymer Co., Ltd.
  • Patent number: 9144152
    Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: September 22, 2015
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Minoru Kubota, Masashi Higuchi
  • Publication number: 20150218410
    Abstract: The invention relates to an antistatic release agent comprising: a release component that contains a condensation-curing type organopolysiloxane, a conductive component that contains a complex of a ?-conjugated electrically conductive polymer and a polyanion and an organic solvent, wherein the amount of the conductive component relative to 100 parts by mass of the release component is 1 to 300 parts by mass, at least one amine-type compound selected from the group consisting of a secondary amine, a tertiary amine or a quaternary ammonium salt is coordinated to or bonded to portion of anion groups in the polyanion as an ion pair, and the amine-type compound has one or more substituent selected from the group consisting of an alkyl group having 4 or more carbon atoms, an aryl group, an aralkyl group, an alkylene group, an arylene group, an aralkylene group and an oxyalkylene group.
    Type: Application
    Filed: September 5, 2013
    Publication date: August 6, 2015
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Sou Matsubayashi, Kohei Kanto, Kazuyoshi Yoshida, Kenji Yamamoto, Shinji Irifune
  • Patent number: 9018533
    Abstract: Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a method for manufacturing the same; and a flexible printed wiring board. Employed is a cover-lay film including: a base material film which has a roughened surface (textured surface) created on at least a part of one surface, and an unroughened surface (non-textured surface) excluding the roughened surface; and a deposition film made of a conductive material which is formed on a surface of the base material film on the side where the roughened surface has been created.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: April 28, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 9014600
    Abstract: Provided are a developing roller having an elastic layer formed on an outer circumferential face of a shaft and a coating layer formed on an outer circumferential face of the elastic layer, wherein the coating layer is composed of first coating layers that are formed at respective edges across the elastic layer, and a second coating layer formed between the first coating layers, and wherein the first coating layers contain a resin obtained through a reaction of a polyol with a silane-coupling agent, fluororesin particles, and an electric conductivity agent; and the second coating layer contains a urethane resin, an ionic liquid, an electric conductivity agent, and filler particles; and a development apparatus and an image-forming device having the developing roller. The provided are capable of keeping the image quality high and of arresting leakage of the toner satisfactorily.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: April 21, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Tomoharu Takeuchi, Taichi Ohkubo
  • Patent number: 9006581
    Abstract: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Hiroyuki Yasuda
  • Patent number: 9005500
    Abstract: When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 14, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Michimasa Ote, Takashi Gonda, Junya Ishida, Kenro Takizawa, Kazuhiro Suzuki, Yuzo Morioka
  • Patent number: 8999043
    Abstract: As a permeable membrane of an air conditioning system that performs as supply to a space to be air conditioned through the permeable membrane and/or gas discharge from the space to be air conditioned through the permeable membrane, an asymmetric membrane is used. The asymmetric membrane is made of a cyclic olefin addition polymer obtained by addition polymerization of a cyclic olefin functionality siloxane, or by addition polymerization of the cyclic olefin functionality siloxane and a cyclic olefin compound, and in which a rate of a structural unit derived from the cyclic olefin functionality siloxane is 5 to 100 mol % of the addition polymer, and a number average molecular weight (Mn) is 10,000 to 2,000,000 in terms of polystyrene conversion measured by a GPC using tetrahydrofuran as a solvent.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: April 7, 2015
    Assignees: DENSO CORPORATION, Shin-Etsu Chemical Co., Ltd., Shin-Etsu Polymer Co., Ltd
    Inventors: Yoshinobu Suzuki, Katsunori Iwase, Takehiro Kurata, Manabu Maeda, Yoshinori Yoneda, Hiroaki Tetsuka, Jyunya Ishida
  • Patent number: 8968168
    Abstract: This invention provides an electrically conductive roller capable of forming an image without fogging even in a low humidity environment and an image-forming device. Specifically, the invention relates to an electrically conductive roller has an elastic layer formed on an outer circumferential surface of a shaft and a urethane coat layer formed on an outer circumferential surface of the elastic layer, wherein the urethane coat layer includes a urethane resin, and at least one ionic liquid selected from the group consisting of pyridinium ionic liquids and amine ionic liquids, in an amount from 1 to 20 parts by mass to 100 parts by mass of the urethane resin; and an image-forming device equipped with the electrically conductive roller.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: March 3, 2015
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Tomoharu Takeuchi, Hiroyuki Takanashi, Taichi Ohkubo
  • Patent number: 8960442
    Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: February 24, 2015
    Assignees: Miraial Co., Ltd., Shin-Etsu Polymer Co., Ltd.
    Inventors: Takaharu Oyama, Chiaki Matsutori, Tsuyoshi Nagashima, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Onuki
  • Patent number: 8881907
    Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: November 11, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Hiroki Yamagishi, Toshiyuki Kamada
  • Patent number: 8840812
    Abstract: The conductive polymer solution of the present invention contains a ?-conjugated conductive polymer, polyanions and a solvent, at least one of specific metal ions, silver halide, conductive carbon black and conductive metal oxide particles, and a reducing agent and/or neutralizing agent as necessary. The conductive polymer solution of the present invention can be used a conductive coating film having both superior transparency and being suitable for use a transparent electrode of a touch panel electrode sheet. In addition, the conductive coating film of the present invention has superior transparency that enables it to be used as a transparent electrode of a touch panel electrode sheet.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: September 23, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Yasushi Masahiro
  • Patent number: 8816932
    Abstract: The radio wave transmitting decorative member and the method of producing thereof efficiently and stably of the present invention is provided with radio wave transmitting properties as well as mirror-surface like metallic luster, hardly loses its metallic luster, and can be produced at a low cost. The method of producing a radio wave transmitting decorative member, having a substrate, a transparent organic material layer, and a light reflecting layer formed of an alloy composed of either silicon or germanium and a metal provided between the substrate and the transparent organic material layer; wherein the light reflecting layer is formed from a target having an alloy composed of either silicon or germanium, and of a metal with the use of a DC magnetrons sputtering.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: August 26, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 8790558
    Abstract: A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (?/Ra) of 0.2 or less, and the rough surface of the film has (?/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (?) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: July 29, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kazuhiro Suzuki, Kenro Takizawa, Masaru Yoneyama, Junya Ishida
  • Patent number: 8770410
    Abstract: A substrate storage container includes an attachment structure in a container body for storing substrates so that a transport component is removably attached to the attachment structure. The attachment structure includes a supporting rail portion provided on an outer wall of the container body, a guide piece provided on the outer wall of the container body, and an engagement part formed with the guide piece. A forked portion formed of a combination of the guide piece and the engagement part. The transport component includes a hollowed frame-shape main part member supported by the supporting rail portion of the attachment structure.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 8, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Osamu Ogawa
  • Patent number: 8773843
    Abstract: Provided is a solid electrolytic capacitor which retains a high capacitance and a low ESR and has high heat resistance. The solid electrolytic capacitor (10) is obtained by winding a porous anode foil (11) having a dielectric layer formed thereon and a cathode foil (14) together with separators (15) each interposed therebetween, the separators (15) having a solid electrolyte (13) supported thereon. Each layer of the solid electrolyte comprises a conductive composite (a) of a cationized conductive polymer with a polymer anion, a first hydroxy compound (b) having four or more hydroxy groups, and a second hydroxy compound (c) having an amino group and one or more hydroxy groups, the content of the conductive composite (a), in terms of mass proportion, being lower than that of the first hydroxy compound (b) and higher than that of the second hydroxy compound (c).
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: July 8, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Sachiko Ode, Tailu Ning
  • Publication number: 20140165838
    Abstract: As a permeable membrane of an air conditioning system that performs as supply to a space to be air conditioned through the permeable membrane and/or gas discharge from the space to be air conditioned through the permeable membrane, an asymmetric membrane is used. The asymmetric membrane is made of a cyclic olefin addition polymer obtained by addition polymerization of a cyclic olefin functionality siloxane, or by addition polymerization of the cyclic olefin functionality siloxane and a cyclic olefin compound, and in which a rate of a structural unit derived from the cyclic olefin functionality siloxane is 5 to 100 mol % of the addition polymer, and a number average molecular weight (Mn) is 10,000 to 2,000,000 in terms of polystyrene conversion measured by a GPC using tetrahydrofuran as a solvent.
    Type: Application
    Filed: August 1, 2012
    Publication date: June 19, 2014
    Applicants: DENSO CORPORATION, SHIN-ETSU POLYMER CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinobu Suzuki, Katsunori Iwase, Takehiro Kurata, Manabu Maeda, Yoshinori Yoneda, Hiroaki Tetsuka, Jyunya Ishida
  • Patent number: 8736562
    Abstract: The present application provides an input member and an electrical device that includes the input member in which a slide operation can be performed, and in which a predetermined input value for each position touched by a user can be entered. The input member includes that one or a plurality of conductive elastic bodies; an operation plate that has an operation plane and that has the conductive elastic bodies on a rear surface side of the operation plane; a base plate including a group of electrodes, the electrodes being provided at positions opposite to the conductive elastic bodies without contacting each other; and a plurality of protruding parts protruding from the conductive elastic bodies toward the base plate are aligned in a predetermined direction.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: May 27, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Hitoshi Ando
  • Publication number: 20140138279
    Abstract: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.
    Type: Application
    Filed: July 3, 2012
    Publication date: May 22, 2014
    Applicants: SHIN-ETSU POLYMER CO., LTD., MIRAIAL CO., LTD.
    Inventors: Tsuyoshi Nagashima, Shuichi Inoue, Takaharu Oyama, Chiaki Matsutori, Kazumasa Ohnuki, Hiroyuki Shida, Hiroki Yamagishi
  • Patent number: 8728351
    Abstract: The present invention provides a conductive polymer solution capable of forming a conductive coating film having both superior preservation stability and water resistance. The conductive polymer solution of the present invention includes a ?-conjugated conductive polymer, a polyanion, a compound having oxetane ring and a solvent; wherein, the amount of the compound having oxetane ring is within the range of 1 to 500% by mass based on a value of 100% by mass for the total amount of then-conjugated conductive polymer and the polyanion.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: May 20, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Yasushi Masahiro, Toshihide Sakuta, Kazuyoshi Yoshida
  • Publication number: 20140124975
    Abstract: The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T die 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.5 to 6 times or less as large as an average thickness of the film.
    Type: Application
    Filed: January 9, 2014
    Publication date: May 8, 2014
    Applicant: SHIN-ETSU POLYMER CO. LTD.
    Inventors: Takashi Nogami, Kenro Takizawa, Kazuhiro Suzuki, Junya Ishida