Patents Assigned to Shin-Etsu Polymer Co., Ltd.
  • Patent number: 10312122
    Abstract: The substrate storage container includes a container main body, an air feed valve, and an air replacement unit. The container main body is formed in a front open box form with the air feed valve attached to the rear of the bottom plate. The air replacement unit includes a housing and a cover that covers the open front of the housing. The bottom of the housing is connected to the air feed valve so as to flow the purge gas while the housing is supported at the upper portion thereof by a rear wall of the container main body. Either the housing or the cover is formed with a plurality of blow holes for blowing the purge gas toward the front of the container main body.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: June 4, 2019
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Osamu Ogawa, Kiminori Tominaga, Yasuhiro Fujimoto
  • Publication number: 20190155422
    Abstract: A capacitive three-dimensional sensor includes: a light-guide unit having a side surface and an operation surface, the side surface being formed along the Z direction and including a light entering portion, through which light from a light source enters, the operation surface being configured to input the inputs and including a light output portion, from which the light exits; a sheet-like X-Y electrode body configured to sense the inputs in the plane X and Y directions; a deformable body including a sheet-like elastic body; and a sheet-like Z electrode body configured to sense the input in the Z direction. The light-guide unit includes an optional decorative sheet, and a light-guide sheet to guide the light that has entered the light-guide unit from the side surface and output the light toward the light output portion. A total of bending stiffnesses of the light-guide sheet and decorative sheet is less than 256.
    Type: Application
    Filed: June 27, 2017
    Publication date: May 23, 2019
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Yusuke KOBAYASHI, Yuta ISHII
  • Patent number: 10242896
    Abstract: To provide a substrate storage container capable of keeping low a relative humidity in an internal closed space for a long period of time even after purging, a substrate storage container including a constitutive material, which includes a shell body, a door and an on-off valve, defining the internal closed space, the constitutive material being formed of a specific constitutive material having a water absorption of 0.1 wt. % or less when immersed in water at 23 degree C. for 24 hours, and thereby, an actual requirement is objectively satisfied in terms of water release suppression ability under JIS K 7209 or ISO 62 to significantly suppress releasing of water into the internal closed space 3 through the shell body, the door and the on-off valve.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: March 26, 2019
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Tsutomu Suzuki, Satoshi Odashima, Hiroshi Mimura, Osamu Ogawa
  • Patent number: 10179868
    Abstract: [Problem] To form, by using a conductive composition capable of being stably dispersed and solubilized in a solvent consisting mainly of an organic solvent, a silicone film having excellent conductivity and having few problems originating from amine compounds, such as problems wherein an addition-type silicone does not set easily. [Solution] The present invention relates to: an addition-curable antistatic organopolysiloxane composition that includes (a) a ?-conjugated conductive polymer, (b) a polyanion, (c) a compound represented by chemical formula (1), and (d) an addition-curable organopolysiloxane composition; and an antistatic silicone film formed by supplying the addition-curable antistatic organopolysiloxane composition onto a substrate and curing. (R represents a functional group having an unsaturated bond).
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 15, 2019
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Sou Matsubayashi
  • Patent number: 10134618
    Abstract: The bottom plate has a plate-like shape, is arranged to face an outer face of a lower wall, and has a locking portion. The groove member has: a groove-forming portion having a groove opening downward formed therein, a surrounding wall portion, which is connected to the groove-forming portion, and is arranged around the groove-forming portion; and a locked portion, which is connected to the surrounding wall portion, is elastically deformable, and is locked by way of the locking portion of the bottom plate by being elastically deformed. The groove member is supported and fixed by way of the lower wall and the bottom plate.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: November 20, 2018
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventor: Yuta Kanamori
  • Patent number: 9966952
    Abstract: A switch apparatus has a pressing section that is formed of a rubber-like elastic material and has a pressing region that is pressed in a predetermined pressing direction; and a capacitance sensor for detecting the pressing of the pressing region on the basis of capacitance. The capacitance sensor is positioned apart from the pressing section in the pressing direction, and is configured so that when the pressing region is not being pressed, a space (clearance) is maintained between the part (the lowermost surface of a protruding section of the pressing section on the side towards the capacitance sensor corresponding to the pressing region and another member (base housing disposed in the vicinity of the pressing region along the pressing direction, the space (clearance) allowing the part on the side towards the capacitance sensor to move in the pressing direction.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: May 8, 2018
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Noriaki Okada, Toshihiro Motoki
  • Patent number: 9960064
    Abstract: The lateral substrate support part has: a plurality of plate parts, which have a parallel positional relationship, and support end portions of a plurality of substrates; and a plate-part support part, which supports the plate part, and is fixed to a side wall. The plate-part support part has: a groove-forming portion having a groove formed therein, said groove linearly extending over the whole plate parts in the direction intersecting the plate parts; a protrusion, which is formed in the groove, and which protrudes such that the protrusion reduces the width of the groove in the direction orthogonal to the direction in which the groove extends; and a positioned part that is formed at a center portion of the groove in the direction in which the groove extends.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: May 1, 2018
    Assignees: Miraial Co., Ltd., Shin-Etsu Polymer Co., Ltd.
    Inventor: Yuta Kanamori
  • Patent number: 9946396
    Abstract: A transparent electrode capacitance sensor includes a transparent resin substrate; at least one transparent electrode formed on the transparent resin substrate; a pseudo auxiliary electrode formed in at least a portion of an outer periphery of the transparent electrode; and a lead wire connected to the pseudo auxiliary electrode, wherein the pseudo auxiliary electrode is thicker than the transparent electrode, and includes the same material as the transparent electrode.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: April 17, 2018
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Tomohiro Nozaki, Hiroto Komatsu, Takashi Kawamura
  • Patent number: 9768045
    Abstract: The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: September 19, 2017
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Chiaki Matsutori, Tsuyoshi Nagashima, Takaharu Oyama, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Ohnuki
  • Patent number: 9741631
    Abstract: A handling member includes: a substantially plate-like handling member main body that is arranged along a pair of the side walls, respectively; a circular position-restriction through hole that is formed to extend through the handling member main body in a thickness direction of the handling member and with which the semicircular convex portion can be engaged; a handling member side guided portion that is engaged with the guide members and of which a movement is guided between the mounting position and the detachment position by the guide members; and a back-side guided portion that can be engaged with the back-side engaging portion by a movement of the handling member from the detachment position to the mounting position.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: August 22, 2017
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventor: Yuta Kanamori
  • Publication number: 20170213752
    Abstract: To provide a substrate storage container that enables efficient replacement of the air inside the container main body with a substrate protecting gas. The substrate storage container includes: a container main body 1 capable of accommodating a plurality of semiconductor wafers W; an air feed valve for supplying a purge gas into the container main body 1; and an air replacement unit 40 that blows out the purge gas from the air feed valve into the interior of the container main body 1. The container main body 1 is formed in a front open box form with the air feed valve attached to the rear of the bottom plate 6. The air replacement unit 40 includes a housing 41 for reserving the purge gas from the air feed valve and a cover 52 that covers the open front 42 of the housing 41. The bottom of the housing 41 is connected to the air feed valve so as to flow the purge gas while the housing 41 is supported at the upper portion thereof by a rear wall 18 of the container main body 1.
    Type: Application
    Filed: July 21, 2015
    Publication date: July 27, 2017
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Osamu Ogawa, Kiminori Tominaga, Yasuhiro Fujimoto
  • Patent number: 9711385
    Abstract: The substrate storage container includes: a container body for storing a semiconductor wafer; a lid body for opening and closing a front of the container body; and a locking mechanism for locking the lid body that has closed the front of the container body. The lid body is formed of a lid main body to be fitted to the front of the container body and a cover plate for covering a front face of the lid main body. The locking mechanism includes a rotating operation portion that is pivotally supported by the lid main body and rotationally operated from an outside of the cover plate. A plurality of posture control members for the rotating operation portions are provided for, at least, the cover plate, among the cover plate and the rotating operation portion.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: July 18, 2017
    Assignees: Shin-Etsu Polymer Co., Ltd., Miraial Co., Ltd.
    Inventors: Kazumasa Ohnuki, Hiroyuki Shida, Hiroki Yamagishi, Tsuyoshi Nagashima, Shuichi Inoue, Chiaki Matsutori, Takaharu Oyama
  • Patent number: 9698033
    Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 4, 2017
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Chiaki Matsutori, Tsuyoshi Nagashima, Takaharu Oyama, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Ohnuki
  • Patent number: 9688868
    Abstract: A conductive polymer dispersion is provided which is capable of easily forming a conductive coating film having both excellent water resistance and excellent solvent resistance. The conductive polymer dispersion of the present invention includes a ?-conjugated conductive polymer, a polyanion, a polyester resin having an alkali metal salt of an acid group, and a glycidyl group-containing acrylic resin. In the conductive polymer dispersion, the ratio (?/?) of total mass ? of the polyester resin and the glycidyl group-containing acrylic resin to total mass ? of the ?-conjugated conductive polymer and the polyanion is in a range of 6.90 to 62.5.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: June 27, 2017
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Sou Matsubayashi, Norimasa Shinada, Kazuyoshi Yoshida
  • Patent number: 9657181
    Abstract: The invention relates to a composition for an antistatic release agent comprising: a release component, a conductive component, an organic solvent, and water, wherein the release component contains a condensation-type organopolysiloxane, the conductive component contains a complex with a ?-conjugated electrically conductive polymer and a polyanion having a molecular weight of 20,000 to 900,000, an amount of the conductive component is 1 to 300 parts by mass, relative to 100 parts by mass of the release component, at least one amine compound selected from the group consisting of a secondary amine, a tertiary amine or a quaternary ammonium salt is coordinated to or bonded to portion of anion groups in the polyanion as an ion pair, and the water content is 5% by mass or less, relative to a total amount of the composition for an antistatic release agent.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: May 23, 2017
    Assignees: SHIN-ETSU POLYMER CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Sou Matsubayashi, Kohei Kanto, Kazuyoshi Yoshida, Kenji Yamamoto, Shinji Irifune
  • Patent number: 9640296
    Abstract: The present invention relates to an electroconductive polymer dispersion liquid characterized in containing a ?-conjugated electrically conductive polymer, a polyanion, a compound represented by the following chemical formula (1), and a dispersion medium. In accordance with the present invention, an electroconductive polymer dispersion liquid capable of readily forming an electroconductive coating having excellent electrical conductivity, heat resistance, moist-heat resistance, and substrate adhesion property can be provided. [Chemical formula 1] CH2?C(R1)—CO—NH—R2—O—CO—NH—R3—Si(OR4)3??(1) In chemical formula (1), R1 represents a hydrogen atom or a methyl group, R2 and R3 each independently represent an arbitrary substituent group, and R4 represents a methyl group or an ethyl group.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: May 2, 2017
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Toshihide Sakuta, Kazuyoshi Yoshida
  • Patent number: 9624398
    Abstract: The invention relates to an antistatic release agent comprising: a release component that contains a condensation-curing type organopolysiloxane, a conductive component that contains a complex of a ?-conjugated electrically conductive polymer and a polyanion and an organic solvent, wherein the amount of the conductive component relative to 100 parts by mass of the release component is 1 to 300 parts by mass, at least one amine-type compound selected from the group consisting of a secondary amine, a tertiary amine or a quaternary ammonium salt is coordinated to or bonded to portion of anion groups in the polyanion as an ion pair, and the amine-type compound has one or more substituent selected from the group consisting of an alkyl group having 4 or more carbon atoms, an aryl group, an aralkyl group, an alkylene group, an arylene group, an aralkylene group and an oxyalkylene group.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: April 18, 2017
    Assignees: SHIN-ETSU POLYMER CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Sou Matsubayashi, Kohei Kanto, Kazuyoshi Yoshida, Kenji Yamamoto, Shinji Irifune
  • Patent number: 9609793
    Abstract: A electromagnetic shielding film includes a conductive supporting substrate which includes a cured material of a thermosetting resin including a conductive filler; a metal thin film layer which covers one surface of the conductive supporting substrate; a thermosetting adhesive layer which covers a surface of the metal thin film layer; and a peeling substrate which covers the other surface of the conductive supporting substrate.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: March 28, 2017
    Assignee: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Toshiyuki Kawaguchi
  • Publication number: 20170070226
    Abstract: A switch apparatus has a pressing section that is formed of a rubber-like elastic material and has a pressing region that is pressed in a predetermined pressing direction; and a capacitance sensor for detecting the pressing of the pressing region on the basis of capacitance. The capacitance sensor is positioned apart from the pressing section in the pressing direction, and is configured so that when the pressing region is not being pressed, a space (clearance) is maintained between the part (the lowermost surface of a protruding section of the pressing section on the side towards the capacitance sensor corresponding to the pressing region and another member (base housing disposed in the vicinity of the pressing region along the pressing direction, the space (clearance) allowing the part on the side towards the capacitance sensor to move in the pressing direction.
    Type: Application
    Filed: March 4, 2015
    Publication date: March 9, 2017
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Noriaki OKADA, Toshihiro MOTOKI
  • Patent number: 9558862
    Abstract: The present invention is a conductive polymer composition containing a ?-conjugated conductive polymer, a polyanion, and a gemini surfactant. There can be provided a conductive polymer composition that has excellent antistatic performance and excellent application properties, does not adversely affect a resist, and can be suitably used in lithography using electron beam or the like.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: January 31, 2017
    Assignees: SHIN-ETSU POLYMER CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Toshiya Sawai, Takayuki Nagasawa, Satoshi Watanabe, Keiichi Masunaga