Patents Assigned to Shin-Etsu Polymer Co., Ltd.
  • Patent number: 8715554
    Abstract: The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T dice 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: May 6, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Takashi Nogami, Kenro Takizawa, Kazuhiro Suzuki, Junya Ishida
  • Patent number: 8695211
    Abstract: In a push-button switch manufacturing method, a key-top end of a pressing element is inserted into a lower-mold recess. A reinforcing plate is placed in the lower mold so that the pressing element extends through a plate through hole of the reinforcing plate. An upper mold and the lower mold are moved toward each other so as to insert the other end of the pressing element into an upper-mold recess for the pressing element, which is provided in a lower surface of the upper mold. A liquid silicone rubber, which contains a component that does not adhere to the upper and lower molds but adheres to the pressing element, is introduced into a cavity, the upper and lower molds are opened to remove a molded product in which an intermediate portion in an axial direction of the pressing element is supported in the plate through hole by the silicone rubber.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: April 15, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Shunta Hyuga, Norio Suzuki, Keiichi Fukuda, Haruaki Miyamura
  • Publication number: 20140098501
    Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 10, 2014
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki KAWAGUCHI, Kazutoki TAHARA, Tsutomu SAGA, Minoru KUBOTA, Masashi HIGUCHI
  • Publication number: 20140084225
    Abstract: The present invention relates to an antistatic release agent comprising an aqueous solution of an electrically conductive polymer complex composed of a ?-conjugated electrically conductive polymer and a polyanion having an anionic group in a molecule thereof, an alkaline compound, a silicone emulsion and a dispersion medium, wherein the alkaline compound is at least one type of compound selected from the group consisting of an inorganic alkali, as amine compound and a nitrogen-containing aromatic cyclic compound, the content of the alkaline compound in the antistatic release agent is 0.7 times or more relative to the number of moles of the neutralization equivalent of the electrically conductive polymer complex, and the pH of the antistatic release agent at 25° C. is 10 or lower. The present invention can provide an antistatic release agent having superior storage stability for forming an antistatic release coated film.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 27, 2014
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kouhei KANTO, Sou MATSUBAYASHI, Kenichi FUJITSUNA, Kazuyoshi YOSHIDA
  • Patent number: 8665246
    Abstract: A pointing device includes a first ground potential electrode; a second electrode for applying a voltage; a third electrode for measuring an electrical potential; a printed circuit board on which the first through the third electrodes are provided; a location pointing driving body that is provided on the printed circuit board and that is configured with a conductive part and that contacts the first and second electrodes, and a spherical part; a slide member that is located to cover a top part of the location pointing driving body and that is configured to drive the location pointing driving body by being slidable within a plane parallel to the printed circuit board; and a pressing force restriction member that is configured to restrict pressing force from the spherical part to the printed circuit board by receiving force from the slide member in the pressing direction.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: March 4, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Hitoshi Ando
  • Publication number: 20140057118
    Abstract: A surface material includes, in a matrix composed of an olefin-based polymer, a domain composed of a cross-linked ethylene vinyl acetate copolymer or a non-cross-linked ethylene vinyl acetate copolymer, and a silicone compound.
    Type: Application
    Filed: March 13, 2012
    Publication date: February 27, 2014
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Masayuki Honda
  • Publication number: 20140035599
    Abstract: A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.
    Type: Application
    Filed: April 20, 2012
    Publication date: February 6, 2014
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Satoshi Shimata, Hiroto Komatsu
  • Patent number: 8627959
    Abstract: A separate supporting body for supporting semiconductor wafers of ?450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: January 14, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kazumasa Ohnuki, Hiroyuki Shida, Satoshi Odashima
  • Publication number: 20130343789
    Abstract: Provided is an electrically conductive roller capable of preventing the occurrence of filming for a long time and of providing toners with a desired quantity of electric charge, and a development apparatus and an image-forming device capable of forming high quality images for a long time. The electrically conductive roller has a urethane coat layer that contains a urethane resin and a particulate amino resin, wherein the urethane coat layer is formed on an outer circumferential face of an elastic layer, and a development apparatus and image-forming device equipped with the electrically conductive roller.
    Type: Application
    Filed: January 19, 2012
    Publication date: December 26, 2013
    Applicants: DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Sokuei Motoda, Ryo Nakajima, Isao Harashima, Kiyoshi Ootani, Norihiko Akegamiyama
  • Patent number: 8610017
    Abstract: In a capacitive input switch that is accommodated in a housing of electronic equipment, the capacitive input switch includes a rigidity imparting layer having rigidity and a laminate sheet laminated on the rigidity imparting layer. The rigidity imparting layer and the laminate sheet are three dimensionally formed. The laminate sheet is formed by a substrate sheet, a conductive pattern layer for capacitor formation, and a decorative layer that is laminated at least on any one of the substrate sheet and the conductive pattern layer. A separate conductor is caused to contact with the conductive pattern layer and the conductive pattern layer is caused to be electrically connected to an external electric circuit by the conductor.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: December 17, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Yusuke Kobayashi, Shoji Yamazaki, Sumitaka Araki, Atsuko Tanaka, Hiroto Komatsu
  • Publication number: 20130312460
    Abstract: It is an object of the present invention to provide a manufacturing method of a single crystal substrate and to provide an internal modified layer-forming single crystal member, each of which is capable of easily manufacturing a relatively large and thin single crystal substrate.
    Type: Application
    Filed: February 10, 2011
    Publication date: November 28, 2013
    Applicants: NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY, SHIN-ETSU POLYMER CO., LTD.
    Inventors: Yosuke Kunishi, Hideki Suzuki, Rika Matsuo, Junichi Ikeno
  • Publication number: 20130294013
    Abstract: The object of the present invention is to provide a condenser that exhibits excellent conductivity of the solid electrolyte layer, and has a low ESR, a high degree of heat resistance, and a high withstand voltage. A condenser of the present invention includes an anode composed of a valve metal, a dielectric layer formed by oxidation of the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer, wherein the solid electrolyte layer contains a ?-conjugated conductive polymer, a polyanion, and an amide compound.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 7, 2013
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Tailu NING, Kazuyoshi Yoshida, Yasushi Masahiro, Sou Matsubayashi, Rika Abe, Mitsuaki Negishi
  • Publication number: 20130272755
    Abstract: Provided are a developing roller having an elastic layer formed on an outer circumferential face of a shaft and a coating layer formed on an outer circumferential face of the elastic layer, wherein the coating layer is composed of first coating layers that are formed at respective edges across the elastic layer, and a second coating layer formed between the first coating layers, and wherein the first coating layers contain a resin obtained through a reaction of a polyol with a silane-coupling agent, fluororesin particles, and an electric conductivity agent; and the second coating layer contains a urethane resin, an ionic liquid, an electric conductivity agent, and filler particles; and a development apparatus and an image-forming device having the developing roller. The provided are capable of keeping the image quality high and of arresting leakage of the toner satisfactorily.
    Type: Application
    Filed: February 24, 2011
    Publication date: October 17, 2013
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Tomoharu Takeuchi, Taichi Ohkubo
  • Patent number: 8551366
    Abstract: A conductive composition comprises a ? conjugated conductive polymer, a dopant, and a nitrogen-containing aromatic cyclic compound. A capacitor comprises an anode composed of a porous material of valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a cathode provided on the dielectric layer and having a solid electrolyte layer containing a ? conjugated conductive polymer, which comprises an electron donor compound containing an electron donor element provided between the dielectric layer and the cathode. Another capacitor is based on the above-described capacitor, wherein the solid electrolyte layer further comprises a dopant and a nitrogen-containing aromatic cyclic compound. An antistatic coating material comprises a ? conjugated conductive polymer, a solubilizing polymer containing an anion group and/or an electron attractive group, a nitrogen-containing aromatic cyclic compound, and a solvent. An antistatic coating is formed by applying the antistatic coating material.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: October 8, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kazuyoshi Yoshida, Tailu Ning, Yasushi Masahiro, Yutaka Higuchi, Rika Abe
  • Publication number: 20130258554
    Abstract: Provided is a solid electrolytic capacitor which retains a high capacitance and a low ESR and has high heat resistance. The solid electrolytic capacitor (10) is obtained by winding a porous anode foil (11) having a dielectric layer formed thereon and a cathode foil (14) together with separators (15) each interposed therebetween, the separators (15) having a solid electrolyte (13) supported thereon. Each layer of the solid electrolyte comprises a conductive composite (a) of a cationized conductive polymer with a polymer anion, a first hydroxy compound (b) having four or more hydroxy groups, and a second hydroxy compound (c) having an amino group and one or more hydroxy groups, the content of the conductive composite (a), in terms of mass proportion, being lower than that of the first hydroxy compound (b) and higher than that of the second hydroxy compound (c).
    Type: Application
    Filed: March 11, 2011
    Publication date: October 3, 2013
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Sachiko Ode, Tailu Ning
  • Patent number: 8541686
    Abstract: A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: September 24, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Mitsuaki Negishi
  • Patent number: 8529314
    Abstract: When both surfaces of a wafer are sequentially subjected to processing, the wafer is made to be surely supported so that a predetermined processing and transporting can be performed. On one surface of the wafer a first fixing jig (3a) is fixed in close contact. After having performed a predetermined processing to the opposite surface of the wafer, a second fixing jig (3b) is fixed in close contact with the opposite surface of the wafer. The first fixing jig (3a) is removed and the wafer is handed over to the second fixing jig (3b). Each of the fixing jigs is made up of a jig main body (31), and a close contact layer (32) which is disposed on one surface thereof. The jig main body has a plurality of supporting projections (33) to support the close contact layer, and a side wall (34). The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (35) enclosed by the side wall, between the close contact layer and the jig main body.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: September 10, 2013
    Assignees: Lintec Corporation, Shin-Etsu Polymer Co., Ltd.
    Inventors: Takeshi Segawa, Kiyofumi Tanaka
  • Patent number: 8524133
    Abstract: The present invention provides a method for manufacturing a film for a film capacitor making it possible to produce a film for a film capacitor which has a thickness of 10 ?m or less and which is excellent in a heat resistance and a voltage resistance at a high thickness accuracy by using a polyetherimide resin and provides as well a film for a film capacitor.
    Type: Grant
    Filed: November 1, 2010
    Date of Patent: September 3, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd
    Inventors: Kenro Takizawa, Yuzo Morioka, Kazuhiro Suzuki, Michimasa Ote
  • Patent number: 8507801
    Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: August 13, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 8472165
    Abstract: The object of the present invention is to provide a condenser that exhibits excellent conductivity of the solid electrolyte layer, and has a low ESR, a high degree of heat resistance, and a high withstand voltage. A condenser of the present invention includes an anode composed of a valve metal, a dielectric layer formed by oxidation of the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer, wherein the solid electrolyte layer contains a ?-conjugated conductive polymer, a polyanion, and an amide compound.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: June 25, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Tailu Ning, Kazuyoshi Yoshida, Yasushi Masahiro, Sou Matsubayashi, Rika Abe, Mitsuaki Negishi