Patents Assigned to Shin-Etsu Polymer Co., Ltd.
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Patent number: 8394183Abstract: An asymmetric membrane contains a porous layer and a dense layer adjacent thereto. The porous layer and the dense layer are formed of a polymeric material. The porous layer and/or dense layer contains a filler. The amount of the filler is 11 parts by mass or more per 100 parts by mass of the polymeric material contained in the asymmetric membrane.Type: GrantFiled: October 27, 2008Date of Patent: March 12, 2013Assignees: Shin-Etsu Polymer Co., Ltd., Denso Corporation, Shin-Etsu Chemical Co., Ltd.Inventors: Junya Ishida, Mitsuaki Negishi, Yuzo Morioka, Mika Kawakita, Katsunori Iwase, Manabu Maeda, Masahiko Minemura, Mamoru Hagiwara
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Patent number: 8390989Abstract: A solid electrolytic capacitor that is able to maintain a high capacitance and low ESR, and also exhibits a high degree of heat resistance. The solid electrolytic capacitor 10 comprises at least an anode body 11 composed of a porous material, a dielectric layer 12 formed on the surface of the anode body 11, and a cathode body 13b, wherein the solid electrolytic capacitor has a solid electrolyte layer 13a formed in contact with the dielectric layer 12, the solid electrolyte layer 13a comprises at least a hydroxy compound having three or more hydroxyl groups, and the hydroxy compound has a melting point of not less than 170° C.Type: GrantFiled: October 5, 2010Date of Patent: March 5, 2013Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Tailu Ning, Michiko Shingai, Sachiko Ode
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Patent number: 8388866Abstract: A conductive composition comprises a ? conjugated conductive polymer, a dopant, and a nitrogen-containing aromatic cyclic compound. A capacitor comprises an anode composed of a porous material of valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a cathode provided on the dielectric layer and having a solid electrolyte layer containing a ? conjugated conductive polymer, which comprises an electron donor compound containing an electron donor element provided between the dielectric layer and the cathode. Another capacitor is based on the above-described capacitor, wherein the solid electrolyte layer further comprises a dopant and a nitrogen-containing aromatic cyclic compound. An antistatic coating material comprises a ? conjugated conductive polymer, a solubilizing polymer containing an anion group and/or an electron attractive group, a nitrogen-containing aromatic cyclic compound, and a solvent. An antistatic coating is formed by applying the antistatic coating material.Type: GrantFiled: November 15, 2011Date of Patent: March 5, 2013Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Kazuyoshi Yoshida, Tailu Ning, Yasushi Masahiro, Yutaka Higuchi, Rika Abe
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Patent number: 8380080Abstract: An optical transceiver of the present invention comprising an OSA, a circuit board, and a flexible substrate connecting these, in which the flexible substrate has high-speed signal lines and other lines other than the high speed signal lines provided separated from each other on the same surface, a ground layer placed apart and opposite these, and a resistive layer placed apart and opposite the high-speed signal lines, the other lines and the ground layer. High-speed signal and the resistive layer are opposite at least a part of the other lines.Type: GrantFiled: September 4, 2009Date of Patent: February 19, 2013Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
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Publication number: 20130032509Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.Type: ApplicationFiled: April 8, 2011Publication date: February 7, 2013Applicant: SHIN-ETSU POLYMER CO., LTD.Inventors: Hiroki Yamagishi, Toshiyuki Kamada
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Patent number: 8365919Abstract: A substrate storage container includes: a container body of a front open box type for holding a multiple number of semiconductor wafers supported in alignment by supporting ribs; a bottom plate removably attached to the bottom of the container body; and a pair of conveyor contact rails integrally formed along both the left and right sides of this bottom plate. These conveyor contact rails inhibit vibrations and impacts acting on the semiconductor wafers when the sealed container body is conveyed by a conveyor.Type: GrantFiled: December 29, 2005Date of Patent: February 5, 2013Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Takayuki Nakayama, Atsushi Sumi
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Patent number: 8356713Abstract: A retainer includes a frame, a pair of first elastic parts projected from a pair of opposing parts of the frame so as to approach to each other, and a second elastic part that is supported at the bent free ends of the paired first elastic parts to hold a substrate. The outside end of the second elastic part is positioned outside the free end of the first elastic part and closer to the opposing part of the frame. Also, first and second holds for holding the rim of the substrate are formed apart from each other. The second hold is positioned on the outer end side of the second elastic part from the first hold.Type: GrantFiled: October 30, 2008Date of Patent: January 22, 2013Assignee: Shin-Etsu Polymer Co., Ltd.Inventor: Osamu Ogawa
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Publication number: 20120325708Abstract: A substrate storage container includes: a container body molded of molding material in a front open box type for storing substrates; a door element fitted to an opening at the front of the container body; and a compressively deformable gasket for sealing between the container body and the door element. The opening of the container body is projected sidewards and outwards forming a rim portion. A sealing surface for the gasket is formed on an inner surface of the rim portion. The container body is formed with a reinforcing rib directed toward the rim portion. An opposing portion of the reinforcing rib that opposes the rim portion of the container body is reduced in thickness so as to prevent a depression from forming in the sealing surface of the rim portion during molding the container body.Type: ApplicationFiled: September 5, 2012Publication date: December 27, 2012Applicant: SHIN-ETSU POLYMER CO., LTD.Inventors: Shigenobu Sasaki, Shinichi Ohori, Hiroki Yamagishi
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Publication number: 20120325707Abstract: In a substrate storage container, a container body for storing semiconductor wafers has an attachment structure on a roof so that a robotic flange as a transport component is removably attached to attachment structure. Attachment structure includes multiple pairs of supporting rails opposing each other, disposed on roof, a multiple number of guide pieces provided on roof and interference/engagement parts each formed with guide piece. Guide piece and interference/engagement part are combined forming a forked portion in the front part. Transport component includes a main part member supported between multiple pairs of supporting rails. Main part member is formed with circulation openings for fluids and incorporates an elastic engagement piece that is elastically deformable so as to interfere with forked portion.Type: ApplicationFiled: February 24, 2011Publication date: December 27, 2012Applicant: Shin-etsu polymer co., ltd.Inventor: Osamu Ogawa
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Patent number: 8339770Abstract: A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor according to the present invention includes an anode made of porous valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer. The solid electrolyte layer includes a ? conjugated conductive polymer, a polyanion, and an ion-conductive compound.Type: GrantFiled: February 21, 2007Date of Patent: December 25, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Kazuyoshi Yoshida, Tailu Ning, Hironao Fujiki, Mitsuaki Negishi
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Patent number: 8334344Abstract: The sliding material is obtainable by extrusion of a raw material containing an olefin-based polymer and a silicone compound as the essential components. A part of the olefin-based polymer forms a crosslinked material in the sliding material. The crosslinked material forms domains to disperse in the sliding material so as to prevent uneven distribution of the silicone compound in the extrusion direction. The residual fraction of hot xylene reflux of the sliding material is in a range from 33 to 75% by weight based on the total weight of the sliding material, and the content of the silicone compound based on the total weight of the sliding material is in a range from 5 to 35% by weight.Type: GrantFiled: May 13, 2009Date of Patent: December 18, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Masayuki Honda, Nobuyasu Noda, Hajime Tsujihana, Fukuji Watanobe, Nobuhiko Takahashi, Tsuneo Usuda
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Patent number: 8323531Abstract: There is provided a method for producing a conductive polymer solution comprising: a freeze-drying step in which an aqueous conductive polymer solution containing a complex that includes a ?-conjugated conductive polymer and a polyanion is freeze dried to thereby obtain a solid complex; and a dispersion step in which an organic solvent having a water content of 4% by mass or less and an amine compound are mixed to the solid complex, followed by a dispersion treatment.Type: GrantFiled: August 2, 2010Date of Patent: December 4, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Kazuyoshi Yoshida, Sou Matsubayashi
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Patent number: 8322533Abstract: A substrate storage container includes a locking mechanism, provided in a lid for opening and closing an opened front portion of a container body which stores a substrate of three sheets or less, for locking the lid fitted into the front portion of the container body. The locking mechanism is supported by the lid which is substantially laterally long when viewed from the front. The locking mechanism includes an advance/retreat engaging body that opposes an inner periphery of the front portion of the container body when the lid is fitted into the front portion of the container body, and a spring member that causes the advance/retreat engaging body to advance from the lid to the inner periphery of the front portion of the container body and thus causes a tip end portion side thereof to interfere when the lid is fitted into the front portion of the container body.Type: GrantFiled: July 4, 2008Date of Patent: December 4, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Satoshi Odashima, Hidehiro Masuko
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Publication number: 20120298549Abstract: A substrate storage container is disclosed that includes: a container body that stores semiconductor wafers W being supported by pairs of left and right supporting pieces; a removable door that opens and closes an open front of container body; and interface portions that are provided in the container body and the door and are connected to a load port apparatus of processing equipment. The door is positioned and connected to the load port apparatus when the open front of container body is opened and closed by the door. The container body, its paired supporting pieces, the door and the interface portions are all formed of conductive materials so that their surface resistance values are specified to fall within the range of 103 to 1012?, to thereby inhibit adherence of particles to these due to electrification of static electricity.Type: ApplicationFiled: February 14, 2011Publication date: November 29, 2012Applicant: SHIN-ETSU POLYMER CO., LTD.Inventors: Yoshiaki Fujimori, Osamu Ogawa
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Patent number: 8318275Abstract: A multicolor molding article is integrally formed of first and second molding materials in combination. At least part of the peripheral portion in the boundary between a first molding part of the first molding material and a second molding part of the second molding material is formed with a thin projected piece. The tapering inclined angle of the thin projected piece is specified to range from 5° to 40°.Type: GrantFiled: November 14, 2007Date of Patent: November 27, 2012Assignees: Shin-Etsu Handotai Co., Ltd., Shin-Etsu Polymer Co., Ltd.Inventors: Hideo Kudo, Hiroki Yamagishi
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Patent number: 8317029Abstract: A wafer storage container including a container body having an opening adapted to store wafers is disclosed. The container body includes a window and wafer support parts. Delivery components are attached to the exterior face part of the container body. The delivery components includes a bottom plate disposed at a bottom of the container body, a pair of side handles disposed at both sides of the container body, and a robotic flange disposed at a top of the container body. The container further is provided with a lid adapted to seal the opening of the container body. The lid includes a lid main body, a pair of latch mechanism disposed within the lid main body, a retainer member disposed at an inner surface of the lid main body, a seal gasket member disposed at a periphery of the lid main body such that it contacts a periphery of an opening part of the container body and a lid cover.Type: GrantFiled: October 7, 2010Date of Patent: November 27, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Toshiyuki Kamada, Hidehiro Masuko
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Patent number: 8292081Abstract: A container includes: a container body for storing substrates of semiconductor wafers; a door element detachably fitted to an open front portion of the container body; and a compressively deformable gasket for sealing between the container body and the door element. While a sealing surface for the gasket is formed on an inner periphery of an open front portion of the container body so that the difference between the maximum and minimum of a flatness is less than 0.50 mm, a fitting portion for the gasket is formed in a frame shape. The gasket is formed of a base fitted to the fitting portion; a flexible sealing part extended from the base toward the sealing surface; and a contact portion that is curvedly formed at a distal end of the sealing part and put in press-contact with the sealing surface.Type: GrantFiled: May 21, 2007Date of Patent: October 23, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Shigenobu Sasaki, Shinichi Ohori, Hiroki Yamagishi
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Patent number: 8274358Abstract: A multidirectional input member according to the present invention includes a base plate on which a looped sensor that includes a plurality of groups of non-contacting electrodes configured in a loop is formed and an operation plate locating opposite to the base plate. The operation plate has a first loop-shaped protrusion that is located at a plane opposite to the base plate, that is protruded toward the base plate side, that is opposite to the looped sensor, and that is configured with a resistant rubber member. The first protrusion has a configuration in which its sectional area of a plane parallel to the base plate is tapered in the direction from the operation plate side toward the base plate side.Type: GrantFiled: June 18, 2010Date of Patent: September 25, 2012Assignee: Shin-Etsu Polymer Co., Ltd.Inventors: Hitoshi Ando, Brian St. Jacques, David Moe
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Patent number: 8269108Abstract: A transparent conductive film (12, 22) including a transparent base material (2) having insulation properties; and a mesh member made of a conductive metal and provided in the transparent base material (2), wherein the transparent base material (2) is provided with a conductive portion in which the mesh member is arranged, and an insulating portion (I) in which a gap (5) formed by removing the mesh member is arranged.Type: GrantFiled: March 31, 2011Date of Patent: September 18, 2012Assignees: Shin Etsu Polymer Co., Ltd., National University Corporation Saitama UniversityInventors: Yousuke Kunishi, Hideki Suzuki, Hiroto Komatsu, Junichi Ikeno
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Publication number: 20120227251Abstract: In a manufacturing method of a push-button switch, a key-top end of a pressing element 25 is inserted into a lower-mold recess for the pressing element, which is provided in a surface of a lower mold. A reinforcing plate 28 is placed in the lower mold so that the pressing element 25 extends through a plate through hole of the reinforcing plate 28. An upper mold and the lower mold are moved toward each other so as to insert the other end of the pressing element 25 into an upper-mold recess for the pressing element, which is provided in a lower surface of the upper mold. A liquid silicone rubber 27, which contains a component that does not adhere to the upper and lower molds but adheres to the pressing element 25, is introduced into a cavity.Type: ApplicationFiled: July 21, 2011Publication date: September 13, 2012Applicant: Shin-Etsu Polymer Co., Ltd.Inventors: Shunta Hyuga, Norio Suzuki, Keiichi Fukuda, Haruaki Miyamura