Patents Assigned to Shin-Etsu Polymer Co., Ltd.
  • Patent number: 8960442
    Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: February 24, 2015
    Assignees: Miraial Co., Ltd., Shin-Etsu Polymer Co., Ltd.
    Inventors: Takaharu Oyama, Chiaki Matsutori, Tsuyoshi Nagashima, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Onuki
  • Patent number: 8881907
    Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: November 11, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Hiroki Yamagishi, Toshiyuki Kamada
  • Patent number: 8840812
    Abstract: The conductive polymer solution of the present invention contains a ?-conjugated conductive polymer, polyanions and a solvent, at least one of specific metal ions, silver halide, conductive carbon black and conductive metal oxide particles, and a reducing agent and/or neutralizing agent as necessary. The conductive polymer solution of the present invention can be used a conductive coating film having both superior transparency and being suitable for use a transparent electrode of a touch panel electrode sheet. In addition, the conductive coating film of the present invention has superior transparency that enables it to be used as a transparent electrode of a touch panel electrode sheet.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: September 23, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Yasushi Masahiro
  • Patent number: 8816932
    Abstract: The radio wave transmitting decorative member and the method of producing thereof efficiently and stably of the present invention is provided with radio wave transmitting properties as well as mirror-surface like metallic luster, hardly loses its metallic luster, and can be produced at a low cost. The method of producing a radio wave transmitting decorative member, having a substrate, a transparent organic material layer, and a light reflecting layer formed of an alloy composed of either silicon or germanium and a metal provided between the substrate and the transparent organic material layer; wherein the light reflecting layer is formed from a target having an alloy composed of either silicon or germanium, and of a metal with the use of a DC magnetrons sputtering.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: August 26, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga
  • Patent number: 8790558
    Abstract: A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (?/Ra) of 0.2 or less, and the rough surface of the film has (?/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (?) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: July 29, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kazuhiro Suzuki, Kenro Takizawa, Masaru Yoneyama, Junya Ishida
  • Patent number: 8773843
    Abstract: Provided is a solid electrolytic capacitor which retains a high capacitance and a low ESR and has high heat resistance. The solid electrolytic capacitor (10) is obtained by winding a porous anode foil (11) having a dielectric layer formed thereon and a cathode foil (14) together with separators (15) each interposed therebetween, the separators (15) having a solid electrolyte (13) supported thereon. Each layer of the solid electrolyte comprises a conductive composite (a) of a cationized conductive polymer with a polymer anion, a first hydroxy compound (b) having four or more hydroxy groups, and a second hydroxy compound (c) having an amino group and one or more hydroxy groups, the content of the conductive composite (a), in terms of mass proportion, being lower than that of the first hydroxy compound (b) and higher than that of the second hydroxy compound (c).
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: July 8, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Sachiko Ode, Tailu Ning
  • Patent number: 8770410
    Abstract: A substrate storage container includes an attachment structure in a container body for storing substrates so that a transport component is removably attached to the attachment structure. The attachment structure includes a supporting rail portion provided on an outer wall of the container body, a guide piece provided on the outer wall of the container body, and an engagement part formed with the guide piece. A forked portion formed of a combination of the guide piece and the engagement part. The transport component includes a hollowed frame-shape main part member supported by the supporting rail portion of the attachment structure.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 8, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Osamu Ogawa
  • Publication number: 20140165838
    Abstract: As a permeable membrane of an air conditioning system that performs as supply to a space to be air conditioned through the permeable membrane and/or gas discharge from the space to be air conditioned through the permeable membrane, an asymmetric membrane is used. The asymmetric membrane is made of a cyclic olefin addition polymer obtained by addition polymerization of a cyclic olefin functionality siloxane, or by addition polymerization of the cyclic olefin functionality siloxane and a cyclic olefin compound, and in which a rate of a structural unit derived from the cyclic olefin functionality siloxane is 5 to 100 mol % of the addition polymer, and a number average molecular weight (Mn) is 10,000 to 2,000,000 in terms of polystyrene conversion measured by a GPC using tetrahydrofuran as a solvent.
    Type: Application
    Filed: August 1, 2012
    Publication date: June 19, 2014
    Applicants: DENSO CORPORATION, SHIN-ETSU POLYMER CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshinobu Suzuki, Katsunori Iwase, Takehiro Kurata, Manabu Maeda, Yoshinori Yoneda, Hiroaki Tetsuka, Jyunya Ishida
  • Patent number: 8736562
    Abstract: The present application provides an input member and an electrical device that includes the input member in which a slide operation can be performed, and in which a predetermined input value for each position touched by a user can be entered. The input member includes that one or a plurality of conductive elastic bodies; an operation plate that has an operation plane and that has the conductive elastic bodies on a rear surface side of the operation plane; a base plate including a group of electrodes, the electrodes being provided at positions opposite to the conductive elastic bodies without contacting each other; and a plurality of protruding parts protruding from the conductive elastic bodies toward the base plate are aligned in a predetermined direction.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: May 27, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Hitoshi Ando
  • Publication number: 20140138279
    Abstract: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.
    Type: Application
    Filed: July 3, 2012
    Publication date: May 22, 2014
    Applicants: SHIN-ETSU POLYMER CO., LTD., MIRAIAL CO., LTD.
    Inventors: Tsuyoshi Nagashima, Shuichi Inoue, Takaharu Oyama, Chiaki Matsutori, Kazumasa Ohnuki, Hiroyuki Shida, Hiroki Yamagishi
  • Patent number: 8728351
    Abstract: The present invention provides a conductive polymer solution capable of forming a conductive coating film having both superior preservation stability and water resistance. The conductive polymer solution of the present invention includes a ?-conjugated conductive polymer, a polyanion, a compound having oxetane ring and a solvent; wherein, the amount of the compound having oxetane ring is within the range of 1 to 500% by mass based on a value of 100% by mass for the total amount of then-conjugated conductive polymer and the polyanion.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: May 20, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Yasushi Masahiro, Toshihide Sakuta, Kazuyoshi Yoshida
  • Publication number: 20140124975
    Abstract: The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T die 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.5 to 6 times or less as large as an average thickness of the film.
    Type: Application
    Filed: January 9, 2014
    Publication date: May 8, 2014
    Applicant: SHIN-ETSU POLYMER CO. LTD.
    Inventors: Takashi Nogami, Kenro Takizawa, Kazuhiro Suzuki, Junya Ishida
  • Patent number: 8715554
    Abstract: The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipment 10 is charged with a molding material 1 to extrude a film 2 for a film capacitor from a T dice 20, in which the above extruded film 2 for a film capacitor is interposed between plural rolls in a receiving device 30 and cooled and in which the above cooled film 2 for a film capacitor is wound on a winding tube 42 of a winding device 40, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material 1; the above molding material 1 is extruded through a filter 50 having apertures 51 which are 0.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: May 6, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Takashi Nogami, Kenro Takizawa, Kazuhiro Suzuki, Junya Ishida
  • Patent number: 8695211
    Abstract: In a push-button switch manufacturing method, a key-top end of a pressing element is inserted into a lower-mold recess. A reinforcing plate is placed in the lower mold so that the pressing element extends through a plate through hole of the reinforcing plate. An upper mold and the lower mold are moved toward each other so as to insert the other end of the pressing element into an upper-mold recess for the pressing element, which is provided in a lower surface of the upper mold. A liquid silicone rubber, which contains a component that does not adhere to the upper and lower molds but adheres to the pressing element, is introduced into a cavity, the upper and lower molds are opened to remove a molded product in which an intermediate portion in an axial direction of the pressing element is supported in the plate through hole by the silicone rubber.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: April 15, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Shunta Hyuga, Norio Suzuki, Keiichi Fukuda, Haruaki Miyamura
  • Publication number: 20140098501
    Abstract: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings penetrating in a thickness direction of the electromagnetic wave shielding layer are provided in the electromagnetic wave shielding layer.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 10, 2014
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki KAWAGUCHI, Kazutoki TAHARA, Tsutomu SAGA, Minoru KUBOTA, Masashi HIGUCHI
  • Publication number: 20140084225
    Abstract: The present invention relates to an antistatic release agent comprising an aqueous solution of an electrically conductive polymer complex composed of a ?-conjugated electrically conductive polymer and a polyanion having an anionic group in a molecule thereof, an alkaline compound, a silicone emulsion and a dispersion medium, wherein the alkaline compound is at least one type of compound selected from the group consisting of an inorganic alkali, as amine compound and a nitrogen-containing aromatic cyclic compound, the content of the alkaline compound in the antistatic release agent is 0.7 times or more relative to the number of moles of the neutralization equivalent of the electrically conductive polymer complex, and the pH of the antistatic release agent at 25° C. is 10 or lower. The present invention can provide an antistatic release agent having superior storage stability for forming an antistatic release coated film.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 27, 2014
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kouhei KANTO, Sou MATSUBAYASHI, Kenichi FUJITSUNA, Kazuyoshi YOSHIDA
  • Patent number: 8665246
    Abstract: A pointing device includes a first ground potential electrode; a second electrode for applying a voltage; a third electrode for measuring an electrical potential; a printed circuit board on which the first through the third electrodes are provided; a location pointing driving body that is provided on the printed circuit board and that is configured with a conductive part and that contacts the first and second electrodes, and a spherical part; a slide member that is located to cover a top part of the location pointing driving body and that is configured to drive the location pointing driving body by being slidable within a plane parallel to the printed circuit board; and a pressing force restriction member that is configured to restrict pressing force from the spherical part to the printed circuit board by receiving force from the slide member in the pressing direction.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: March 4, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Hitoshi Ando
  • Publication number: 20140057118
    Abstract: A surface material includes, in a matrix composed of an olefin-based polymer, a domain composed of a cross-linked ethylene vinyl acetate copolymer or a non-cross-linked ethylene vinyl acetate copolymer, and a silicone compound.
    Type: Application
    Filed: March 13, 2012
    Publication date: February 27, 2014
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventor: Masayuki Honda
  • Publication number: 20140035599
    Abstract: A capacitive sensor sheet producing method for producing a capacitive sensor sheet uses a base having an insulative base layer on which a binder resin layer including conductive nanowires is formed. The conductive nanowires partially projecting from a surface of the binder resin layer. The method includes removing a binder resin from projections of conductive nanowires partially projected from a plurality of detection electrodes by implementing a surface etching and shaping treatment on a surface of the binder resin layer, or surface ends of at least partial detection electrodes of the plurality of detection electrodes, forming wiring lines of the conductive pattern layer, and connecting the wiring lines to the surface ends of at least partial detection electrodes in the pattern layer. The projections of the conductive nanowires removed the binder resin are put into contact with the connecting portions.
    Type: Application
    Filed: April 20, 2012
    Publication date: February 6, 2014
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Satoshi Shimata, Hiroto Komatsu
  • Patent number: 8627959
    Abstract: A separate supporting body for supporting semiconductor wafers of ?450 mm is attached to the inner surface of either side wall of a container body. Each supporting body is formed of a front supporting piece that is projected laterally from a frame and horizontally retains the wafer on, at least, the side part in the front peripheral edge; and a rear supporting piece that is projected laterally from frame and horizontally retains the wafer on, at least, the side part in the rear peripheral edge. Front supporting piece is formed of a projected part that extends from the front of frame toward the front peripheral edge of the semiconductor wafer and a curved part that extends rearwards from projected part along the peripheral edge of the semiconductor wafer.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: January 14, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kazumasa Ohnuki, Hiroyuki Shida, Satoshi Odashima