Patents Assigned to Shinko Electric Industries Co., LTD
  • Header for semiconductor device, and semiconductor device
    Patent number: 11153962
    Abstract: A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: October 19, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yasuyuki Kimura, Takumi Ikeda
  • Wiring board having two insulating films and hole penetrating therethrough
    Patent number: 11152293
    Abstract: A wiring board includes an insulating layer including a first insulating film provided with a first surface and a second surface that is opposite to the first surface, and composed of only resin, and a second insulating film provided with a first surface and a second surface that is opposite to the first surface, including a reinforcing member and resin, in which the reinforcing member is impregnated with the resin, and stacked on the first surface of the first insulating film such that the second surface of the second insulating film contacts the first surface of the first insulating film and the second surface of the first insulating film is exposed outside; and a first wiring layer embedded in the first insulating film, a predetermined surface of the first wiring layer being exposed from the second surface of the first insulating film.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: October 19, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazuhiro Oshima, Hiroharu Yanagisawa, Kazuhiro Kobayashi, Katsuya Fukase, Ken Miyairi
  • Flat loop heat pipe
    Patent number: 11143461
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 12, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Wiring board having each pad with tapered section continuously formed on columnar section
    Patent number: 11145585
    Abstract: A wiring board includes a semiconductor chip mounting surface, an external connection surface provided on an opposite side from the semiconductor chip mounting surface, and pads provided on the semiconductor chip mounting surface. Each pad includes a columnar section, and a tapered section, continuously formed on a first end of the columnar section, and having a cross sectional area that decreases toward a direction away from the columnar section. The tapered section of each pad projects from the semiconductor chip mounting surface.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: October 12, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Daisuke Sakurai
  • Substrate fixing device
    Patent number: 11145531
    Abstract: A substrate fixing device includes a baseplate, an adhesive layer on the baseplate, and an electrostatic chuck on the adhesive layer. The adhesive layer includes a first layer and a second layer. The second layer is between the first layer and the electrostatic chuck. The thermal conductivity of the first layer is higher in a stacking direction in which the baseplate, the adhesive layer, and the electrostatic chuck are stacked than in a plane direction perpendicular to the stacking direction. The thermal conductivity of the second layer is higher in the plane direction than in the stacking direction.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: October 12, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kazuhiro Fujita
  • Loop heat pipe
    Patent number: 11131509
    Abstract: A loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, a vapor pipe that connects the evaporator and the condenser, to form a loop-shaped passage together with the liquid pipe, and a porous body provided inside the liquid pipe or inside the evaporator. The porous body includes a first metal layer including a first bottomed hole that caves in from a first surface of the first metal layer, and a second bottomed hole that caves in from a second surface of the first metal layer, opposite to the first surface. The first bottomed hole and the second bottomed hole partially communicate with each other to form a pore.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: September 28, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Optical waveguide and optical waveguide device
    Patent number: 11125954
    Abstract: An optical waveguide includes a first clad layer, core layers each formed on the first clad layer, a second clad layer formed on the first clad layer to cover the core layers, grooves each provided corresponding to one of the core layers. The optical waveguide further includes inclined surfaces each disposed in the corresponding groove to face an end surface of the corresponding core layer in an extension direction of the core layers. Each inclined surface is inclined with respect to the extension direction of the core layers. The optical waveguide further includes optical path changing mirrors each formed on the corresponding inclined surface. The grooves are physically separate from each other. Each inclined surface is formed in only the first and second clad layers. Each optical path changing mirror is not in contact with the core layers and is physically separate from the core layers.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: September 21, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Kenji Yanagisawa
  • Heat pipe
    Patent number: 11118843
    Abstract: A heat pipe includes an intermediate metal layer interposed between outermost metal layers, an inlet passage defined by opposing wall portions of the intermediate metal layer and the outermost metal layers, and a porous body provided at one or both of the wall portions. The porous body includes a first bottomed hole that caves in from one surface of the intermediate metal layer, a second bottomed hole that caves in from the other surface of the intermediate metal layer, and a pore formed by the first bottomed hole that partially communicates with the second bottomed hole. The outermost metal layers, the intermediate metal layer, the inlet passage, and the porous body form an inlet for filling a working fluid into the heat pipe.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: September 14, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Interconnect substrate having columnar electrodes
    Patent number: 11121107
    Abstract: An interconnect substrate includes a substrate, and a first connection terminal and a second connection terminal that are disposed on a surface of the substrate, wherein the first connection terminal includes a first columnar electrode and a first bump disposed on the first columnar electrode, the first columnar electrode having a flat or convex surface and having a first diameter, wherein the second connection terminal includes a second columnar electrode and a second bump disposed on the second columnar electrode, the second columnar electrode having a concave surface and having a second diameter larger than the first diameter, and wherein a melting point of the first bump and the second bump is lower than a melting point of the first columnar electrode and the second columnar electrode.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 14, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Akira Takeuchi, Hikaru Tanaka
  • Stem
    Patent number: 11121063
    Abstract: A stem includes a base member that includes a main body, a raised portion raised from the top surface of the main body, and a through-hole through the main body, a lead that is inserted into the through-hole of the base member and is fixed to the through-hole with a fixing material such that one end of the lead juts out of the top surface of the main body of the base member, and a substrate that is inserted into a gap between the raised portion of the base member and one end of the lead and is attached to the raised portion to be electrically connected to the one end. The lead has a curved surface curving in a direction widening the gap into which the substrate is inserted, or an inclined surface inclined in a direction widening the gap, on a tip of the one end.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: September 14, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Masao Kainuma
  • Sensor module
    Patent number: 11103185
    Abstract: A semiconductor device includes an antenna mounted on a wiring substrate. A holding member includes a first plate-shaped part having a first surface and a second surface, a second plate-shaped part having a third surface and a fourth surface, and a coupling part configured to couple the first plate-shaped part and the second plate-shaped part so that the second surface and the third surface have parts facing each other with a space therebetween. The one end of the wiring substrate is fixed to the holding member so that the antenna overlaps the coupling part, as seen from above. A part continuing to the one end of the wiring substrate is folded back so as to being arranged sequentially along the first surface, the second surface, the third surface, and the fourth surface. The other end of the wiring substrate extends in an elastically deformable state from the fourth surface.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: August 31, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Tatsuaki Denda
  • Loop-type heat pipe
    Patent number: 11105562
    Abstract: A liquid pipe has a flow path provided in a stacked body of a plurality of metal layers. The plurality of metal layers includes a first metal layer configuring an upper wall surface of the flow path, a second metal layer configuring a lower wall surface of the flow path, and an intermediate metal layer stacked between the first metal layer and the second metal layer and configuring right and left wall surfaces of the flow path. The porous body includes a first porous body having first and second bottomed holes and fine pores provided in the first metal layer, and a second porous body having first and second bottomed holes and fine pores provided in the second metal layer. The porous body is not provided in the intermediate metal layer.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: August 31, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Loop-type heat pipe
    Patent number: 11098958
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser and to form a loop together with the liquid pipe, a first porous body provided in the evaporator, and a second porous body provided in the liquid pipe. A connection region between the evaporator and the liquid pipe includes a first porous extension part extending from one of the first porous body and the second porous body toward the other, and a space part in contact with the first porous extension part. A leading end of the first porous extension part is inserted in a first concave part formed in the other of the first porous body and the second porous body.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: August 24, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Loop-type heat pipe
    Patent number: 11098957
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to liquefy the operating fluid, a liquid pipe configured to interconnect the evaporator and the condenser, a steam pipe configured to interconnect the evaporator and the condenser and to form a loop together with the liquid pipe, a porous body provided in the liquid pipe and configured to retain therein the liquid operating fluid, and a solid columnar support provided in the liquid pipe and configured to guide the operating fluid liquefied by the condenser to the porous body. At least one first groove is formed at a side surface of the columnar support.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 24, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Lead pin and wiring board having lead pin
    Patent number: 11101202
    Abstract: A lead pin includes a shaft portion, a head portion formed on one end of the shaft portion, and having a diameter greater than a diameter of the shaft portion, a tin-based first plated layer exposed at a surface of the head portion visible from the other end of the shaft portion, and a second plated layer exposed at an end surface of the shaft portion visible from the other end of the shaft portion. The second plated layer has a reflectivity with respect to visible light and a conductivity higher than a reflectivity with respect to the visible light and a conductivity of the first plated layer, respectively.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: August 24, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Naomichi Koyama
  • Electrostatic chuck
    Patent number: 11088006
    Abstract: An electrostatic chuck includes a platform, a power feed pin, a tubular insulator, an adhesive layer, and a first primer. The platform includes an electrode. The power feed pin contacts the electrode. The tubular insulator is provided around the power feed pin. The adhesive layer bonds the platform and the tubular insulator together. The first primer is provided on a surface of the tubular insulator facing toward the adhesive layer.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 10, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takamasa Yoshikawa, Hiroharu Yanagisawa, Nobuyuki Iijima
  • Loop heat pipe
    Patent number: 11060798
    Abstract: A loop heat pipe includes an evaporator, a condenser, a liquid pipe, and a vapor pipe. The liquid pipe is formed a metal layer stack of metal layers. The metal layers include a first metal layer through which a first through hole extends in a thickness-wise direction. The liquid pipe includes a flow passage formed by at least the first through hole and having four walls that define the flow passage. The liquid pipe further includes a plurality of porous bodies that form at least two of the four walls of the flow passage.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 13, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Yoshihiro Machida
  • Component-embedded substrate
    Patent number: 11058006
    Abstract: A component-embedded substrate includes: a buildup layer including an insulating resin layer and a conductor layer; a cavity that is formed in the buildup layer; an electronic component that is mounted on a bottom face of the cavity through an adhesive layer; a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: July 6, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Hirokazu Yoshino
  • Substrate holding apparatus
    Patent number: 11056369
    Abstract: A substrate holding apparatus includes a baseplate, an adhesive layer disposed on the baseplate, and an electrostatic chuck disposed on the adhesive layer to hold an object, wherein a first side surface of a first portion of the electrostatic chuck is at a same position in a plan view as a second side surface of a second portion of the baseplate, the first portion being in contact with a first face of the adhesive layer, the second portion being in contact with a second face of the adhesive layer, wherein the adhesive layer has a protruding part extending outwardly from the first side surface and the second side surface, and wherein the first face and the second face are flat planes extending from an inside of the first side surface and the second side surface to an outside of the first side surface and the second side surface.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: July 6, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Masakuni Kitajima
  • PACKAGE, LIGHT-EMITTING DEVICE, AND LASER DEVICE
    Publication number: 20210203127
    Abstract: A package for at least one laser diode includes: leads configured to be electrically connected to the at least one laser diode; a base including a mounting surface on which the at least one laser diode is to be mounted and a lateral wall located around the mounting surface so as to surround the at least one laser diode, the lateral wall defining first through-holes and including a light-transmissive part configured to transmit a laser beam emitted from the at least one laser diode; and a lead holding member bonded to the lateral wall of the base and defining second through-holes. The leads are disposed through the first through-holes and the second through-holes. At least a central portion of each of the leads is made of copper.
    Type: Application
    Filed: December 22, 2020
    Publication date: July 1, 2021
    Applicants: NICHIA CORPORATION, SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Hidenori MATSUO, Masaki OMORI, Wataru KATAYAMA, Ryota MITSUI