Patents Assigned to Shinko Electric Industries Co., LTD
  • Electrostatic chuck and semiconductor/liquid crystal manufacturing equipment
    Patent number: 11037811
    Abstract: An electrostatic chuck includes, a chuck function portion including a plurality of chuck regions on which an attractable object is placed respectively, and a concave surface portion provided in an outer region of the chuck regions, and electrodes arranged in an inner part of the chuck function portion corresponding to the chuck regions and an inner part of the chuck function portion corresponding to the concave surface portion, respectively.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: June 15, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Norio Shiraiwa
  • Wiring substrate
    Patent number: 11019722
    Abstract: A wiring substrate includes a plurality of wiring layers, a component mounting part on which an electronic component can be mounted, and a component non-mounting part on which an electronic component cannot be mounted. A portion located in the component non-mounting part of one wiring layer of the plurality of the wiring layers includes a plurality of first through-holes having an elongated shape as seen from above and aligned with predetermined intervals with longitudinal directions of the first through-holes being faced toward a direction perpendicular to a longitudinal direction of the wiring substrate.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: May 25, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kenichi Mori, Yoshihiro Kita
  • Wiring substrate
    Patent number: 11011457
    Abstract: A wiring substrate includes a first insulation layer containing insulating resin, a first through hole passing through the first insulation layer is the thickness direction, a pad formed within the first through hole, a second insulation layer containing insulating resin and laminated on a first surface of the first insulation layer, and a first wiring layer provided on the second insulation layer and connecting to the pad. A connecting surface of the pad that connects the first wiring layer includes a curved surface that curves in a protruding shape toward the first surface of the first insulation layer.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: May 18, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Koichi Nishimura, Noriyoshi Shimizu, Jun Furuichi
  • Loop heat pipe, method of manufacturing the same, and electronic device
    Patent number: 11009927
    Abstract: Disclosed loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid line connecting the evaporator and the condenser; a porous body provided in a columnar shape in the liquid line; and a vapor line connecting the evaporator and the condenser, and forming a loop together with the liquid line.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: May 18, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takeshi Shioga, Yoshihiro Mizuno
  • Method of manufacturing wiring board
    Patent number: 11001930
    Abstract: A method of manufacturing a wiring board, includes forming an interconnect layer on a first insulating layer, roughening a surface of the interconnect layer, not in contact with the first insulating layer, to form concavo-convex portions, forming a bond enhancing film on the concavo-convex portions, partially removing the bond enhancing film, using an acid solution, and forming a second insulating layer on the first insulating layer, to cover the interconnect layer.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 11, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO, LTD.
    Inventors: Tomoyuki Shimodaira, Hitoshi Kondo
  • Sintered body and electrostatic chuck
    Patent number: 10998216
    Abstract: A sintered body includes a ceramic substrate including sintered oxide particles, a through-hole formed in the ceramic substrate such that the side surfaces of the oxide particles exposed from an inner wall of the through-hole form a flat surface, and a porous body disposed in the through-hole, the porous body including spherical oxide ceramic particles and a mixed oxide configured to bind the spherical oxide ceramic particles.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: May 4, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Michio Horiuchi, Masakuni Miyazawa
  • Wiring substrate
    Patent number: 10991645
    Abstract: A wiring substrate includes: a substrate; an oxide film including an oxide of one or both of Ti and Zr, the oxide film being formed on a surface of the substrate; an alloy film including an alloy of one or any combination of Ni, Co, and W with Cu, the alloy film being formed on the oxide film; and a Cu layer formed on the alloy film.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: April 27, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoko Nakabayashi
  • Circuit board, laminated circuit board, and method of manufacturing circuit board
    Patent number: 10993322
    Abstract: A circuit board includes: an insulating layer having at least a part formed of an insulating resin; and an electrode pad embedded in the insulating layer and having a neck formed on an outer side surface, the neck being held in contact with the insulating resin of the insulating layer. The electrode pad includes: a first conductor layer having an end surface exposed from one surface of the insulating layer; and a second conductor layer formed on the first conductor layer and having a grain boundary density different from a grain boundary density of the first conductor layer. The neck is formed in a region of the outer side surface, the region corresponding to a boundary part between the first conductor layer and the second conductor layer.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: April 27, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Keigo Sato, Hiroshi Taneda, Noriyoshi Shimizu
  • Lead frame and method of manufacturing lead frame
    Patent number: 10985094
    Abstract: A lead frame includes a lead portion having a first surface and a second surface, a connecting bar that has a first surface and a second surface and to which the lead portion is connected, and a raised portion provided on the first surface of the connecting bar. The first surface of the connecting bar is positioned between the first and the second surfaces of the lead portion. The tip of the raised portion is positioned between the first surface of the lead portion and the first surface of the connecting bar.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: April 20, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shintaro Hayashi, Hajime Koike, Konosuke Kobayashi
  • Laminated circuit board, and electronic component
    Patent number: 10986732
    Abstract: A laminated circuit board includes a base having a first surface, and a second surface on an opposite side from the first surface, a first metal layer provided in the base and including a first electrode exposed from the first surface, and a second metal layer provided in the base and including a second electrode exposed from the second surface. The first metal layer includes an inductor electrically connected to the first electrode, and the first electrode and the second electrode are bonded and electrically connected to each other.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: April 20, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takayuki Matsumoto, Tsukasa Nakanishi
  • Loop type heat pipe
    Patent number: 10976111
    Abstract: A loop type heat pipe includes: an evaporator configured to vaporize a liquid working fluid; a condenser configured to condense the vaporized working fluid into the liquid working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. Each of the vapor pipe and the liquid pipe includes: a lower-side metal layer; an intermediate metal layer that is disposed on the lower-side metal layer; an upper-side metal layer that is disposed on the intermediate metal layer; and a conduit that is formed by the lower-side metal layer, the intermediate metal layer, and the upper-side metal layer, and at least one of the upper-side metal layer and the lower-side metal layer warps outward in a first portion of the vapor pipe.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: April 13, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Wiring board and method of manufacturing the same
    Patent number: 10978383
    Abstract: A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: April 13, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Noriyoshi Shimizu, Wataru Kaneda, Akio Rokugawa
  • Manufacturing method of semiconductor device and semiconductor device
    Patent number: 10964553
    Abstract: A manufacturing method of a semiconductor device includes mounting a semiconductor element on a first electrode disposed on a first surface of a substrate; preparing a metal plate including a main body part and a projection part; mounting the metal plate on the first surface side of the substrate, by joining the projection part to a second electrode that is disposed on the first surface of the substrate; sealing the semiconductor element and the projection part with a sealing resin; and forming an electrode terminal made of a base end part that is connected to the second electrode and has a side surface that is covered by the sealing resin, and a tip end part that is integrally formed with the base end part and that projects from a front surface of the sealing resin, by etching the main body part excluding a portion overlapping with the projection part.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: March 30, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Tetsuichiro Kasahara
  • Wiring substrate
    Patent number: 10964633
    Abstract: A wiring substrate includes: a wiring layer; an insulating layer covering the wiring layer, and including a first opening portion exposing the wiring layer and a second opening portion exposing the wiring layer, wherein a diameter of the second opening portion is larger than that of the first opening portion; a first metal layer formed in the first opening portion and the second opening portion, and having a recess in the second opening portion; and a second metal layer that is formed on the first metal layer formed in the first opening portion and the second opening portion, wherein a portion of the second metal layer fills the recess. The first metal layer and the second metal layer serve as connection terminals to be electrically connected to an electronic component.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 30, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Hikaru Tanaka
  • Loop heat pipe
    Patent number: 10962301
    Abstract: A loop heat pipe includes a first flow path, a second flow path over the first flow path, and a divider provided between the first flow path and the second flow path. Each of the first flow path and the second flow path includes an evaporator configured to vaporize a working fluid, a condenser configured to condense the working fluid, a first transport pipe connecting the evaporator and the condenser, and a second transport pipe connecting the evaporator and the condenser and forming a loop flow path with the transport pipe.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: March 30, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Nobuyuki Kurashima
  • Electrostatic chuck and substrate fixing apparatus
    Patent number: 10957574
    Abstract: An electrostatic chuck includes a base having a support surface configured to retain a retaining target by electrostatic retention, and a thermocouple configured to detect a temperature of the base. The thermocouple includes first and second metal parts provided inside the base and having ends connected to each other to form a measuring junction, a first wire part having one end connected to the other end of the first metal part inside the base, and another end extending outside the base, and a second wire part having one end connected to the other end of the second metal part inside the base, and another end extending outside the base. The first metal part and the first wire part are formed from a first material, and the second metal part and the second wire part are formed from a second material different from the first material.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: March 23, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Tomotake Minemura
  • Stem
    Patent number: 10945337
    Abstract: A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: March 9, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takumi Ikeda, Yasuyuki Kimura, HanSu Kim, HaeRyong Ahn
  • Substrate with multi-layer resin structure and semiconductor device including the substrate
    Patent number: 10943857
    Abstract: A substrate for semiconductor elements includes a terminal part including a first surface, a second surface opposite to the first surface, and side surfaces joining the first surface and the second surface, and a resin part covering the side surfaces and exposing the first surface of the terminal part. The resin part has a multi-layer structure including a first resin and a second resin, and the first resin is provided in contact with the side surfaces of the terminal part. The first resin and the second resin include a filler, and an amount of the filler included in the first resin is smaller than an amount of the filler included in the second resin.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: March 9, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kentaro Kaneko, Harunobu Sato, Tsukasa Nakanishi, Junichi Nakamura, Koji Watanabe
  • Optical waveguide having support member, optical waveguide mounting substrate and optical transceiver
    Patent number: 10935719
    Abstract: An optical waveguide is formed on a support member. A second cladding layer is formed on a surface of a first cladding layer so as to cover a core layer. An opening is opened at the second cladding layer-side, penetrates the second cladding layer and the core layer, and closed at the first cladding layer-side. The opening has a first surface and a second surface ranging from the opened side to the closed side. In a vertical section taken along a longitudinal direction of the core layer, a first angle between a perpendicular line drawn from an opening end of the first surface to the surface of the first cladding layer and the first surface, and a second angle between a perpendicular line drawn from an opening end of the second surface to the surface of the first cladding layer and the second surface are all acute angles.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: March 2, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kenji Yanagisawa
  • Optical waveguide mounting substrate and optical communication device
    Patent number: 10928598
    Abstract: An optical waveguide mounting substrate includes a wiring substrate, and an optical waveguide mounted on the wiring substrate with an adhesive layer being interposed therebetween. The optical waveguide includes a first cladding layer, a core layer formed on a surface of the first cladding layer facing toward the wiring substrate, and a second cladding layer formed on the surface of the first cladding layer facing toward the wiring substrate so as to cover a periphery of the core layer. An opening is opened on the second cladding layer-side, penetrating the second cladding layer and the core layer, and closed on the first cladding layer-side, and a metal film is provided on an end face of the core layer in the opening. The second cladding layer faces the wiring substrate via the adhesive layer. A part of the adhesive layer is filled in the opening.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: February 23, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kenji Yanagisawa