Abstract: An optical waveguide mounting substrate includes a wiring substrate, and an optical waveguide mounted on the wiring substrate with an adhesive layer being interposed therebetween. The optical waveguide includes a first cladding layer, a core layer formed on a surface of the first cladding layer facing toward the wiring substrate, and a second cladding layer formed on the surface of the first cladding layer facing toward the wiring substrate so as to cover a periphery of the core layer. An opening is opened on the second cladding layer-side, penetrating the second cladding layer and the core layer, and closed on the first cladding layer-side, and a metal film is provided on an end face of the core layer in the opening. The second cladding layer faces the wiring substrate via the adhesive layer. A part of the adhesive layer is filled in the opening.

Abstract: A cooler includes a plurality of loop heat pipes. Each of the plurality of loop heat pipes includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, and a vapor pipe that connects the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe. Evaporators of the plurality of loop heat pipes overlap each other, and a pressure inside the loop-shaped passage is different among the plurality of loop heat pipes.

Abstract: A wiring board includes a first interconnect layer, a first insulating layer covering the first interconnect layer, a second interconnect layer, thinner than the first interconnect layer, formed on the first insulating layer and having an interconnect density higher than that of the first interconnect layer, and a second insulating layer formed on the first insulating layer and covering the second interconnect layer. The first insulating layer includes a first layer including no reinforcing material, and a second layer including a reinforcing material. The first and second layers include a non-photosensitive thermosetting resin as a main component thereof. The first layer has a coefficient of thermal expansion higher than that of the second layer, and the second insulating layer includes a photosensitive resin as a main component thereof. The second interconnect layer includes an interconnect formed directly on and electrically connected to the first interconnect layer.

Abstract: A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.

Abstract: An optical waveguide includes a first clad layer, core layers each formed on the first clad layer, a second clad layer formed on the first clad layer to cover the core layers, grooves each provided corresponding to one of the core layers. The optical waveguide further includes inclined surfaces each disposed in the corresponding groove to face an end surface of the corresponding core layer in an extension direction of the core layers. Each inclined surface is inclined with respect to the extension direction of the core layers. The optical waveguide further includes optical path changing mirrors each formed on the corresponding inclined surface. The grooves are physically separate from each other. Each inclined surface is formed in only the first and second clad layers. Each optical path changing mirror is not in contact with the core layers and is physically separate from the core layers.

Abstract: A first insulation layer includes a concave portion formed in a lower surface thereof. A first wiring layer is formed in the concave portion. A protective insulation layer has an opening configured to expose a part of the first wiring layer and is stacked on the lower surface of the first insulation layer. An adhesion layer is interposed between the first wiring layer and the protective insulation layer and has higher adhesiveness with the protective insulation layer than the first wiring layer. The first wiring layer includes a pad portion formed in the concave portion and a protrusion protruding from a portion of a lower surface of the pad portion into the opening. The adhesion layer is formed to cover the lower surface of the pad portion and a side surface of the protrusion and to expose a lower end face of the protrusion.

Abstract: A loop type heat pipe includes: an evaporator configured to evaporate a working fluid; a condenser configured to condense the evaporated working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. The vapor pipe includes: a lower-side metal layer; an intermediate metal layer disposed on the lower-side metal layer; an upper-side metal layer disposed on the intermediate metal layer; a pipe conduit formed by the lower-side metal layer, the intermediate metal layer and the upper-side metal layer; and a support column that is provided inside the pipe conduit, wherein the support column divides the pipe conduit into a first flow path and a second flow path. The pipe conduit has a first opening portion that communicates with the first flow path and the second flow path.

Abstract: A wiring board includes: a Cu pad; an insulating layer covering the Cu pad and having an opening portion; a first metallic layer formed on the Cu pad in the opening portion; and a connecting terminal formed on the first metallic layer to extend from the opening portion to above an upper surface of the insulating layer. The connecting terminal includes: a seed layer formed on the first metallic layer; and a second metallic layer formed on the seed layer. A stacked body is formed of the first metallic layer and the connecting terminal and includes a constricted portion. The constricted portion is located in a certain position of the first metallic layer in a thickness direction of the first metallic layer, and a sectional area of the stacked body is the smallest at the constricted portion.

Abstract: An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and an embedment part. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and a hole open at the second surface of the substrate. The hole includes a threaded inner wall surface. The temperature sensor is at the bottom of the hole. The embedment part includes a threaded side surface, and is embedded in the hole with the threaded side surface mating with the threaded inner wall surface. The substrate and the embedment part are formed of the same material.

Abstract: A loop heat pipe includes a liquid pipe and a vapor pipe that connect an evaporator and a condenser and form a loop-shaped passage. The liquid pipe includes two outermost metal layers, and inner metal layers stacked between the outer metal layers. The inner metal layers include one or more flow passages in which a working fluid flows, and a porous body communicating with the one or more flow passages. One inner metal layer includes a first bottomed groove opening to a side of another inner metal layer adjacent to the one inner metal layer, and the other inner metal layer includes a second bottomed groove opening to a side of the one inner metal layer. The one or more flow passages include a flow passage formed by the first and second bottomed grooves that are arranged to oppose and communicate with each other in a thickness direction.

Abstract: A wiring substrate includes a pad including an opening formed to penetrate the pad, a first insulation layer having a cavity to which the pad is exposed, an electronic component mounted on the pad exposed in the cavity, and a second insulation layer formed on the first insulation layer with covering the electronic component. The opening is formed so as to penetrate the pad which is exposed in the cavity. The electronic component is mounted on the pad so that the opening is exposed. An outermost layer of the electronic component includes a concave portion having a predetermined volume distribution. A position and a size of the opening are determined based on the predetermined volume distribution. The second insulation layer is provided in the concave portion, in a gap between a side surface of the electronic component and an inner wall surface of the cavity, and in the opening.

Abstract: A heat pipe includes an inlet through which a working fluid is injected. The inlet includes a non-sealed portion and a sealed portion connected to the non-sealed portion. The non-sealed portion and the sealed portion each include two outermost metal layers and a plurality of intermediate metal layers stacked between the outermost metal layers. The heat pipe further includes a porous body arranged in the inlet.

Abstract: A loop heat pipe includes an evaporator to vaporize a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, a porous body provided inside a flow passage in which the working fluid or vapor thereof flows, and a vapor pipe to connect the evaporator and the condenser and form a loop-shaped passage together with the liquid pipe. The porous body includes a metal layer including a first bottomed hole that caves in from a first surface thereof, a second bottomed hole that caves in from a second surface thereof, opposite to the first surface, and a pore formed by and partially communicating the first and second bottomed holes. An inner wall surface of each of the first and second bottomed holes formed in the porous body has a concave shape formed by a curved surface.

Abstract: An electrostatic chuck includes: an insulating plate consisting of alumina, and YAG (Yttrium Aluminum Garnet) added with cerium, and configured to mount a substrate thereon; and an electrode which is embedded in the insulating plate and configured to generate electrostatic force for adsorbing the substrate.

Abstract: A wiring substrate includes: a first insulating layer; a plurality of wiring patterns formed on one surface of the first insulating layer; a dummy pattern formed, on the one surface of the first insulating layer, between the nearby wiring patterns; and a second insulating layer made of resin and formed on the one surface of the first insulating layer so as to cover the nearby wiring patterns and the dummy pattern, wherein the dummy pattern is a dot pattern arranged at a center portion between the nearby wiring patterns, and wherein a height of at least one dot constituting the dummy pattern is lower than heights of the nearby wiring patterns.

Abstract: An inductor device includes a resin film, a first base conductor layer formed on one surface of the resin film and having a first pad, a second base conductor layer formed on the other surface of the resin film and having a second pad, a through-hole penetrating from the first pad to the second pad, a through conductor filled in the through-hole and provided to connect the first pad and the second pad each other, a first insulating layer formed on the one surface of the resin film and having an opening arranged on the first base conductor layer, and a first conductor part formed on the first base conductor layer in the opening of the first insulating layer. A first conductor pattern layer includes the first base conductor layer and the first conductor part. The first conductor pattern layer has a convex sectional shape.

Abstract: A heat pipe includes an inlet port. The inlet port includes an unsealed part and a sealed part that include metal layers that are a first outermost layer, intermediate layers stacked on the first outermost layer, and a second outermost layer stacked on the intermediate layers. In the unsealed part, the intermediate layers include respective openings and respective first and second walls on first and second opposite sides, respectively, of the openings. The openings form an injection channel defined by the first and second outermost layers and the first and second walls of the intermediate layers. The inner wall faces of the first walls and the inner wall faces of the second walls of at least two adjacent intermediate layers form a first step and a second step, respectively. In the sealed part, each metal layer contacts one or more of other metal layers to hermetically seal the inlet port.

Abstract: A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.

Abstract: A method of manufacturing a semiconductor device includes, in this order: preparing a bottom plate having an upper surface and a lower surface, wherein the upper surface includes an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part, and wherein the lower surface of the bottom plate includes a reference part and a recess positioned above the reference part, at least a part of the recess being disposed directly below the outer peripheral part; joining a frame member to the outer peripheral part of the bottom plate, a linear expansion coefficient of the frame member being smaller than a linear expansion coefficient of the bottom plate; and fixing a semiconductor element to the inside part of the bottom plate.

Abstract: There is provided a lead frame. The lead frame includes: a die pad; a lead terminal that is separated from the die pad and disposed around the die pad; and a resin layer that is formed between the die pad and the lead terminal so as to fix the die pad and the lead terminal. The resin layer has an opening portion that exposes at least a lower surface of the lead terminal.