Abstract: Copper electroplating baths containing one or more suppressor compounds capable of providing copper filled sub-micron sized apertures free of pits and voids are provided. Such copper electroplating baths are useful in the manufacture of electronic devices, such as printed wiring boards and integrated circuits.

Abstract: A method for patterning different types of surface features on a semiconductor substrate (e.g. metal pads, etched pits and grooves) where the features are accurately located by a single mask. First, a dielectric layer is formed on the substrate. Next, an etch-resistant metal layer is formed on the dielectric and patterned according to a mask. Then, a patterned resist mask (e.g. PMMA) is formed on the patterned metal so that areas of the dielectric are exposed. The resist mask has edges that lie on top of the patterned metal layer. Therefore, the exposed dielectric areas are bounded by patterned metal. Then, the dielectric layer is etched using a directional dry etch to expose the underlying semiconductor substrate. Then, the semiconductor substrate is etched. The dielectric layer functions as a mask in the substrate etching step. Since the metal pattern determines the areas of the substrate that are etched, all the features are located according to the original mask that defined the metal pattern.

Abstract: New photoacid generator systems that comprise a sensitizer compound and one or more photoacid generator compounds are provided and photoresist compositions that comprise such systems. Photoacid generator systems of the invention are particularly useful as photoactive components of photoresists imaged at short wavelengths such as 248 nm, 193 nm and 157 nm.

Abstract: A chemical vapor deposited, &bgr; phase polycrystalline silicon carbide having a high thermal conductivity and reduced stacking faults. The silicon carbide is synthesized under specific conditions using hydrogen gas and methyltrichlorosilane gas as reactants. The thermal conductivity of the silicon carbide is sufficiently high such that it can be employed as parts of apparatus and components of electrical devices where a high heat load is generated. Such components may include active thermoelectric coolers, heat sinks and fans.

Abstract: An optical switch and method for assembling are described. Optical arrays are mounted on a flex plate with an interface between them. The direction of certain forces on the flex plate allows coupling/decoupling of the optical arrays. The flex plate includes an area which exhibits a different flex profile than the remainder of the flex plate and that is located beneath the optical arrays interface. Flexing of the flex plate optically couples the optical arrays. A tool with grooves is used to align the optical arrays relative to each other. The tool uses grooves and spheres to mate with the optical arrays in such a way as to provide an appropriate interface between the optical arrays.

Abstract: In a first aspect, organic coating compositions are provided, particularly spin-on antireflective coating compositions, that contain a polyester resin component. In a further aspect, coating compositions are provided that contain a resin component obtained by polymerization of a multi-hydroxy compound. Coating compositions of the invention are particularly useful employed in combination with an overcoated photoresist layer to manufacture integrated circuits.

Abstract: New photoresists are provides that are suitable for short wavelength imaging, particularly sub-170 nm such as 157 nm. Resists of the invention comprise a fluorine-containing polymer, a photoactive component, and a solvent component. Preferred solvents for use on the resists of the invention can maintain the resist components in solution and include one or more preferably two or more (i.e. blends) of solvents. In particularly preferred solvent blends of the invention, each blend member evaporates at substantially equal rates, whereby the resist composition maintains a substantially constant concentration of each blend member.

Abstract: In a first aspect, silicon polymers are provided that have controlled ratio of silanol (Si—OH) moieties:Si atoms and/or a controlled amount of alkaline aqueous-solubilizing groups. Si-polymers of the invention are particularly useful as a photoresist resin component. In a further aspect, halogenated sulfonamide and thiol compounds and Si-containing polymers comprising such reacted monomers are provided.

Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Abstract: A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.

Abstract: Disclosed are photoimageable compositions containing silsesquioxane binder polymers and photoactive compounds, methods of forming relief images using such compositions and methods of manufacturing electronic devices using such compositions. Such compositions are useful as photoresists and in the manufacture of optoelectronic devices.

Abstract: The invention provides new photoresist compositions that contain a resin binder and a blend of photoacid generators. Photoacid generator blends of the invention produce photoacids that differ in acid strength and/or size.

Abstract: A dielectric composed of a core material between two polymer layers that have permittivity values less than the core material. The polymer layers provide structural integrity for the dielectric. The dielectric can be employed in a capacitor to fine tune the capacitance of the capacitor. The dielectric and the capacitor may have a thickness in the micron range. Accordingly, the dielectric and capacitor provide for the miniaturization of electronic devices. The dielectric may be employed in decoupling capacitors to reduce noise in electronic devices.

Abstract: New methods and compositions are provided that enable application and processing of photoresist as thick coating layers, e.g. at dried layer (post soft-bake) thicknesses of in excess of 2 microns. Resists can be imaged at short wavelengths in accordance with the invention, including 248 nm.

Abstract: A method for recovering catalytic metals from compositions containing catalytic metal colloids. Compositions such as rinse solutions or dragout baths containing catalytic metal colloids are passed through a filter that entraps catalytic metal colloids from the solutions. The catalytic metal colloid has a high affinity for the filter in contrast to other components of the solutions. The other components of the solution pass through the filter concentrating the catalytic colloid on the filter. The filter containing the catalytic metal colloid is rinsed with an acid solution to remove the catalytic metal from the filter. The catalytic metal is collected in a suitable container or on an adsorbent such as a resin. The method is economically efficient and environmentally friendly.

Abstract: A system for aligning two optical connectors includes first and second connectors each having optical components housed therein. The first connector has V-shaped opposite side walls which define grooves therealong. The second connector has a pair of recesses defined in the front face which are dimensioned to receive a pair of alignment spheres. Upon assembly, the alignment spheres align and engage the V-shaped grooves to lock the two connectors in precise and secure alignment.

Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.

Abstract: An optical switch is provided for selectively coupling outputs of one or more fibers of a first array to one or more inputs of fibers of a second array. The first array includes a first groove disposed within a front face of the first array. The second array optionally includes a second groove disposed within a front face of the second array. The first and second fiber arrays are oriented so that their respective front faces are disposed in a facing relationship. A roller element is located within at least the first groove, permitting the first array to translate relative to the second array upon the roller element along the direction of the first groove. In addition, detents may be formed within the grooves of each array to create areas in which the roller element may at least temporarily seat. The location and number of detents are arranged to correspond to the location and number of rows of fibers in the respective arrays.

Abstract: A fiber array is provided for use in optical systems requiring a one-dimensional or two-dimensional array of fibers. The fiber array includes a support post disposed within a fiber-containing cavity of the fiber array to provide support within the internal cavity. The use of the support post permits the height of the fiber array to be reduced thereby enabling such fiber arrays to be stacked together more closely providing increased fiber packing density among arrays. In addition, the fiber array is configured to support and protect un-jacketed fibers, where the absence of the jacket permits increased packing density among fibers in an individual fiber array.