Patents Assigned to Shipley Company, L.L.C.
  • Fiber array switch having micromachined front face with roller balls
    Patent number: 6832016
    Abstract: An optical fiber switch having two coupled fiber arrays which move in a transverse direction to provide switching action. Each array has a front face and the front faces are nearly in contact. Optical fiber ends are located at the front faces. The front faces of the fiber arrays have transverse grooves in which rolling spheres are disposed. The fiber arrays move by rolling on the spheres. The spheres provide for smooth transverse motion and a fixed distance between optical fiber arrays. The spheres and front face grooves also provide for alignment between the optical fibers.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: December 14, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A Steinberg, David W Sherrer, Mindaugas F Dautartas
  • Leveler compounds
    Publication number: 20040249177
    Abstract: Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and methods are useful for providing a planarized layer of copper on a substrate having small apertures. The compositions and methods provide complete fill of small apertures with reduced void formation.
    Type: Application
    Filed: June 4, 2003
    Publication date: December 9, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Deyan Wang, Chunyi Wu, Robert D. Mikkola
  • Plating bath analysis
    Patent number: 6827839
    Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: December 7, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Wade Sonnenberg, Mark J. Kapeckas, David L. Jacques, Raymond Cruz, Leon R. Barstad, Elie H. Najjar, Eugene N. Step, Robert A. Binstead
  • Optical device package having a configured frame
    Patent number: 6827503
    Abstract: An optical device package includes a substrate, optical semiconductor component, optical fiber, frame and lid. The substrate has a longitudinal notch for mounting the optical fiber and a lateral groove with a proximally facing stop surface. The frame includes at least one downwardly extending projection configured and dimensioned so as to engage a lateral end portion of the lateral groove. The frame is self-aligning and seats itself by being dropped into place.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: December 7, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, Mindaugas F. Dautartas
  • Photoresist compositions and use of same
    Patent number: 6828083
    Abstract: Compositions and methods of the invention provide for a controlled flow of resist into device contact (via) holes during a post-exposure, post-development hard-bake step. Resists of the invention are positive-acting and contain one or more components that are preferably substantially stable (i.e. no substantial crosslinking) during: 1) soft-bake, pre-exposure thermal treatment to remove solvent carrier of the applied resist, and 2) post-exposure, pre-development thermal treatment to promote or enhance the acid-promoted reaction in exposed regions (typically a de-blocking reaction). However, resists of the invention will crosslink during a post-development more stringent thermal treatment (thermal flow hard-bake step).
    Type: Grant
    Filed: April 3, 2001
    Date of Patent: December 7, 2004
    Assignee: Shipley Company, L.L.C.
    Inventor: Timothy G. Adams
  • Optical waveguide switch
    Patent number: 6826324
    Abstract: An optical switch includes a first wavedguide holding member and a second waveguide holding member disposed on a substrate. The first waveguide holding member moves relative to the second waveguide holding member. A movement guiding member guides the motion of the first waveguide holding member and the substrate. Advantageously, the first waveguide holding member moves transversely relative to the second waveguide holding member. The traverse motion enables selective coupling between a waveguide in the first waveguide holding member and a waveguide in the second holding member. Through this transverse motion of the second waveguide holding member, an optical switching action may be implemented.
    Type: Grant
    Filed: April 13, 2001
    Date of Patent: November 30, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, David W. Sherrer
  • Stabilizers for electroless plating solutions and methods of use thereof
    Patent number: 6824597
    Abstract: Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the composition.
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: November 30, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Jochen Heber, André Egli
  • Seed layer deposition
    Patent number: 6824665
    Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: November 30, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
  • Resistive materials
    Publication number: 20040231757
    Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.
    Type: Application
    Filed: June 21, 2004
    Publication date: November 25, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
  • Tin plating
    Publication number: 20040232000
    Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.
    Type: Application
    Filed: June 21, 2004
    Publication date: November 25, 2004
    Applicant: Shipley Company, L.L.C.
    Inventor: Jeffrey N. Crosby
  • Dielectric structure
    Patent number: 6819540
    Abstract: Dielectric structures particularly suitable for use in capacitors and having a textured surface are provided, together with methods of forming these structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: November 16, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Craig S. Allen, Maria Anna Rzeznik, David L. Jacques
  • Fiber array with V-groove chip and mount
    Patent number: 6819858
    Abstract: A molded mount of non-crystalline polymer material is configured to have a channel for retaining a silicon chip having a plurality of juxtaposed V-groove formed in a top surface between right and left side portions, thereof, a recessed area being provided in the channel behind the chip for accommodating fiber buffer coating, and a notch being formed in a top portion of the mount between the channel and one side portion thereof, for retaining strengthening fibers of an optical fiber cable, with the V-groove being configured to receive individual optical fibers therein respectively. Two such molded mounts with silicon chips are securely sandwiched together with V-groove of the chips opposing one another to retain optical fibers therebetween.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: November 16, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, David W. Sherrer, Mindaugas F. Daurtartas, Robert G. Schinazi
  • Photosensitive resin composition and method for the formation of a resin pattern using the composition
    Publication number: 20040224252
    Abstract: A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. The method for the formation of a resin pattern uses a photosensitive resin composition, which contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. By using the method of this invention, it is possible to form a conductive film selectively on a resin pattern formed through exposure and development of the photosensitive resin composition of this invention.
    Type: Application
    Filed: January 30, 2004
    Publication date: November 11, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Masaki Kondo, Takashi Kanda
  • Electronic device manufacture
    Publication number: 20040224528
    Abstract: A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric layers can be easily removed following etching through the use of certain removable layers disposed between the substrate and the cross-linked polymeric layers.
    Type: Application
    Filed: December 19, 2003
    Publication date: November 11, 2004
    Applicant: Shipley Company, L.L.C.
    Inventor: George P. Mirth
  • Functionalized polymer
    Publication number: 20040224259
    Abstract: A functionalized copolymer containing a main chain derived from polymerizable monomers and pendent functional groups terminated with one or more &agr; or &bgr; ethylenically or acetylenically unsaturated groups. The functionalized copolymers are self cross-linking and are suitable for use as binders.
    Type: Application
    Filed: December 11, 2003
    Publication date: November 11, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Edgardo Anzures, Robert K. Barr, Yueping Fu
  • Negative-type photosensitive resin composition containing epoxy compound
    Publication number: 20040224253
    Abstract: A negative-type photosensitive resin compositions containing an epoxy compound are provided. These compositions use poly(p-vinylphenol) as the base resin and have good development performance when using an aqueous developer, such as tetramethylammonium hydroxide solution.
    Type: Application
    Filed: January 30, 2004
    Publication date: November 11, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Kei Arao, Makoto Nomura
  • Antireflective coating compositions
    Publication number: 20040219453
    Abstract: Antireflective compositions are provided that contain an ionic thermal acid generator material. Use of such a thermal acid generator material can significantly increase the shelf life of solutions of antireflective compositions in protic media. Antireflective compositions of the invention can be effectively used at a variety of wavelengths used to expose an overcoated photoresist layer, including 248 nm and 193 nm.
    Type: Application
    Filed: June 2, 2004
    Publication date: November 4, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Edward K. Pavelchek, Peter Trefonas
  • Desmear and texturing method
    Publication number: 20040216761
    Abstract: A method for desmearing resin accretions from the surface of a substrate and texturing resins by generating a free radical which attacks and removes the resin accretions and textures the resin.
    Type: Application
    Filed: October 28, 2003
    Publication date: November 4, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Martin T. Goosey, Mark A. Poole
  • Methods of forming waveguides and waveguides formed therefrom
    Publication number: 20040218889
    Abstract: Provided are methods of forming optical waveguides. The methods involve: (a) forming over a substrate a layer of a photodefinable composition; (b) exposing a portion of the layer to actinic radiation; (c) developing the exposed layer to form a waveguide core structure; and (d) heating the waveguide core structure to a temperature and for a time effective to reflow the structure such that it becomes at least partially rounded in cross-section. Also provided are optical waveguides formed from the described methods and electronic devices including one or more of the optical waveguides.
    Type: Application
    Filed: December 2, 2003
    Publication date: November 4, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, Matthew L. Moynihan, Omari Patterson
  • Method for electrolytic copper plating
    Publication number: 20040217008
    Abstract: A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.
    Type: Application
    Filed: November 26, 2003
    Publication date: November 4, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Hideki Tsuchida, Masaru Kusaka, Shinjiro Hayashi