Abstract: The invention includes polymers that contain a polymers of the invention contain one or more 1) carbonate units and/or 2) a lactone provided by a monomer having a ring oxygen adjacent to the monomer vinyl group. The invention also provides photoresists that contain such polymers, particularly for imaging at short wavelengths such as sub-200 nm.

Abstract: The present invention includes polymers and photoresist compositions that comprise the polymers as a resin binder component. Photoresists of the invention include chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-200 nm, particularly 193 nm. Polymers of the invention suitably contain 1) photoacid labile groups that preferably contain an alicyclic moiety; 2) a polymerized electron-deficient monomer; 3) a polymerized cyclic olefin moiety. Particularly preferred polymers of the invention are tetrapolymers or pentapolymers, preferably with differing polymerized norbornene units.

Abstract: Optoelectronic packages comprise both an optical array and base chip. The array and base chip are aligned and coupled using a combination of V-grooves, wick stops, and alignment spheres (e.g., presion ball bearings). The array and base chip are passively aligned by disposeing an optical fiber having an angled endface onto V-grooves in both the array and base chip. The base chip typically comprises an optical surface device, such as a vertical cavity, surface emitting laser or photodetector.

Abstract: This invention relates to new photoacid generator compounds and photoresist compositions that comprise such compounds. In particular, the invention relates to photoacid generator compounds that generate an ?,?-difluoroalkyl sulfonic acid upon exposure to activating radiation. Positive- and negative-acting chemically amplified resists that contain such PAGs are particularly preferred. The invention also includes methods for synthesis of such PAGs and ?,?-difluoroalkyl sulfonic acids.

Abstract: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.

Abstract: New methods and compositions are provided that enable application and processing of photoresist as thick coating layers, e.g. at dried layer (post soft-bake) thicknesses of in excess of 2 microns. Resists can be imaged at short wavelengths in accordance with the invention, including 248 nm.

Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent or iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.

Abstract: An optical interconnect includes a waveguide holder having a first side and a second side. The first side has a first depression and the second side has a second depression. The waveguide holder has an opening in which a plurality of waveguides are disposed.

Abstract: The present invention includes polyacetal polymers and photoresist compositions that include the polymers as a resin binder component. Photoresists of the invention include chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-300 nm, particularly 157 nm.

Abstract: Provided are photodefinable compositions suitable for use in forming an optical waveguide. The compositions include a silsesquioxane polymer having polymerized units of the formula (R1SiO1.5) and (R2SiO1.5), wherein R1 and R2 are different and are substituted or unsubstituted organic side chain groups and are free of hydroxy groups, and two or more functional end groups, and a photoactive component. The solubility of the silsesquioxane polymer is altered upon exposure to actinic radiation such that the composition is developable in an aqueous developer solution. Also provided are methods of forming an optical waveguide with the inventive compositions, optical waveguides, and electronic devices including one or more optical waveguide.

Abstract: The invention includes new polymers and methods for providing such polymers and photoresists that comprises the polymers. Methods of the invention include those that comprise providing a reaction mixture and adding over the course of a polymerization reaction one or more polymerization reagents to the reaction mixture to provide the polymer. Photoresists containing a polymer of the invention can exhibit significantly improved lithographic properties.

Abstract: The present invention provides an optical switch. The switch includes a substrate and a first waveguide holding member. The switch also includes a second waveguide holding member disposed over the substrate and movable relative to the first waveguide holding member to provide a switching function. A movement guiding member is provided for guiding the movement of the second waveguide holding member. A registration element is disposed at the movement guiding member for positioning the second waveguide holding member at a selected location relative to the first waveguide holding member. The selected location is one that provides alignment between a selected waveguide of the first waveguide holding member and a selected waveguide of the second waveguide holding member.

Abstract: An optical assembly which allows for passive alignment of the various elements is described. A substrate with a cut out portion and an upper surface is utilized as a mount for an optical array and an imaging assembly. The optical array, which preferably includes a plurality of optical fibers is positioned on V-grooves located on the upper surface. The imaging assembly, which preferably includes a plurality of lenses, such as GRIN lenses, is lowered at least partially into the cut-out portion. The optical fibers are optically coupled with said lenses. A waveguide, having a plurality of waveguide cores within a cladding, may further be optically coupled with the lenses, or alternatively, directly to the optical fibers. An integrated optic chip may also be affixed to the substrate or mounted on the substrate.

Abstract: Multilayer photoresist systems are provided. In particular aspects, the invention relates to underlayer composition for an overcoated photoresist, particularly an overcoated silicon-containing photoresist that is imaged at short exposure wavelengths.

Abstract: Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The method described above can maintain and restore the electrolytic copper plating solution so as to maintain satisfactory appearance of plated copper, fineness of deposited copper film, and via-filling.

Abstract: A method to determine and monitor concentrations of inert metal plating components in metal plating baths. An inert indictor is included in the bath composition and the concentration of the inert indictor is monitored during plating. The change in the concentration of the inert indicator is used to determine the change in the concentration of inert bath components.

Abstract: Resistive materials have resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.

Abstract: The invention includes new polymers and methods for providing such polymers and photoresists that comprises the polymers. Methods of the invention include those that comprise providing a reaction mixture and adding over the course of a polymerization reaction one or more polymerization reagents to the reaction mixture to provide the polymer. Photoresists containing a polymer of the invention can exhibit significantly improved lithographic properties.

Abstract: This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-tin catalyst on a resin substrate, and then treating said resin substrate having the catalyst deposited thereon with a formaldehyde-free electroless copper plating solution that contains copper ions and a reducing agent, wherein the need for an accelerating treatment of a catalyst after said catalyst depositing treatment is obviated. The productivity of a copper-resin composite material is dramatically enhanced by the process of the present invention, because a copper thin layer can be formed on the resin substrate in a short time, even if an accelerating treatment for a catalyst is not performed in a separate process.

Abstract: Multilayer photoresist systems are provided. In particular aspects, the invention relates to underlayer composition for an overcoated photoresist, particularly an overcoated silicon-containing photoresist. Preferred underlayer compositions comprise one or more resins or other components that impart etch-resistant and antireflective properties, such as one or more resins that contain phenyl or other etch-resistant groups and anthracene or other moieties that are effective anti-reflective chromophores for photoresist exposure radiation.