Patents Assigned to Shipley Company, L.L.C.
  • Plating bath and method for depositing a metal layer on a substrate
    Publication number: 20050155866
    Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: November 24, 2003
    Publication date: July 21, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: David Gabe, Andrew Cobley, Leon Barstad, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
  • Optoelectronic submount having an on-edge optoelectronic device
    Patent number: 6917056
    Abstract: An optoelectronic submount for providing optical connection and electrical connection to a vertically communicating optical device, such as a vertical cavity surface-emitting laser. The submount has a trench for holding the optoelectronic device on-edge, and electrical connection pits adjoining the trench. A metallization layer is disposed in the electrical connection pits. The electrical connection pits are aligned with the trench and optoelectronic device so that compact pads on the optoelectronic device can be soldered to the metallization layer. A groove can be provided in the submount for holding an optical fiber in alignment with an active area of the optoelectronic device.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: July 12, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Mindaugas F. Dautartas, Dan A. Steinberg
  • Capture compounds for electronic plating compositions and electronic packaging device manufacture
    Patent number: 6916741
    Abstract: The invention relates to use of capture compounds such as a crown ether to facilitate selected compositions and processes employed in manufacture of electronic packaging devices such as printed circuit boards, semiconductor integrated circuit systems, multichip modules, lead frames and other interconnection devices, flat panel display substrates, and the like.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: July 12, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Gary S. Calabrese, Jeffrey Doubrava
  • Plating bath and method for depositing a metal layer on a substrate
    Publication number: 20050139118
    Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 30, 2005
    Applicant: SHIPLEY COMPANY, L.L.C.
    Inventors: Andrew Cobley, Mark Kapeckas, Erik Reddington, Wade Sonnenberg, Leon Barstad, Thomas Buckley
  • Plating bath and method for depositing a metal layer on a substrate
    Patent number: 6911068
    Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: June 28, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Plating method
    Patent number: 6911230
    Abstract: Disclosed are methods of depositing electroless gold layers on a metal substrate using a catalytic palladium deposit. Such electroless gold layers have increased adhesion as compared to conventional electroless gold deposits.
    Type: Grant
    Filed: November 23, 2002
    Date of Patent: June 28, 2005
    Assignee: Shipley Company, L.L.C.
    Inventor: Miriana Kanzler
  • Tapered optical fiber for coupling to diffused optical waveguides
    Patent number: 6912345
    Abstract: An optical fiber having an a core with a D-shape or an oval shape at an endface. The optical fiber tapers from a round, cylindrical section to the endface so that adiabatic mode transformation is provided. Preferably, the D-shape or oval shape is selected so that the optical fiber has a mode shape at its endface that matches the mode shape of a diffused waveguide.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: June 28, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Mindaugas F. Dautartas, Dan A. Steinberg
  • Method and system for recycling materials
    Patent number: 6907432
    Abstract: A system and method is provided for recycling raw materials from a plurality waste streams generated by waste stream providers and includes a waste stream monitoring module for monitoring the plurality of waste streams and determining an amount of reusable raw materials contained in each of the plurality of waste streams. Also included is a reusable materials database for storing the amount of each of the raw materials contained in any of the plurality of waste streams. A user operating an access device communications with the reusable materials database for viewing the amount of each of said raw materials.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: June 14, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Charles R. Szmanda, Peter Trefonas, III, Richard C. Hemond, Mark S. Thirsk, Leo L. Linehan, Anthony Zampini
  • Etching process for micromachining crystalline materials and devices fabricated thereby
    Patent number: 6907150
    Abstract: The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic planes of a single crystal substrate. Two of the structures provided are an etch-stop pit and an anisotropically etched feature disposed adjacent the etch-stop pit. At the point of intersection between the etch-stop pit and the anisotropically etched feature the orientation of the crystallographic planes is maintained. The present invention also provides a method for micromachining a substrate to form an optical microbench. The method comprises the steps of forming an etch-stop pit and forming an anisotropically etched feature adjacent the etch-stop pit. The method may also comprise coating the surfaces of the etch-stop pit with an etch-stop layer.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: June 14, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, Larry J. Rasnake
  • Polymer synthesis and films therefrom
    Patent number: 6903175
    Abstract: Disclosed are methods of preparing solution polymers and compositions derived therefrom.
    Type: Grant
    Filed: September 22, 2001
    Date of Patent: June 7, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert H. Gore, Michael K. Gallagher, Yujian You
  • Solder pads and method of making a solder pad
    Patent number: 6902098
    Abstract: A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: June 7, 2005
    Assignee: Shipley Company, L.L.C.
    Inventor: Mindaugas F. Dautartas
  • Method for forming resin composite material
    Patent number: 6899781
    Abstract: This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 ?m or less, can be prepared that is otherwise difficult to prepare using conventional methods.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: May 31, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Koichi Yomogida, Hidemi Nawafune
  • Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
    Patent number: 6899829
    Abstract: A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: May 31, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, Wade Sonnenberg, Patrick J. Houle
  • Photoresist processing aid and method
    Patent number: 6900003
    Abstract: A composition and method to reduce photolithographic residue and scum formation on a substrate or in a solution, and to reduce or prevent foam formation. The composition contains a diphenyl oxide compound in combination with an antifoam agent. The composition may be added to developer solutions and stripper solutions used in manufacturing printed wiring boards.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: May 31, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Edgardo Anzures, Daniel E. Lundy, Robert K. Barr, Corey O'Connor
  • Optical bench with alignment subassembly
    Patent number: 6898029
    Abstract: An optical subassembly which positions an optical device is described. The optical device is mounted on a plurality of spheres or columns placed in predetermined positions in an upper surface of a substrate. The predetermined positions include pits formed in the upper surface of the substrate. The spheres may be the same size or may be of varying sizes. Pits or grooves also may be formed in the optical device. The optical device may be formed with flexure positions to assist in holding it in place on the spheres. Further, the optical device, spheres and substrate may be metallized or formed of metal and the surface tension forces of solder may be utilized to position the optical device.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: May 24, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, Mindaugas F. Dautartas, Hui Luo
  • Antireflective hard mask compositions
    Patent number: 6890448
    Abstract: New organic-based radiation absorbing compositions are provided that are suitable for use as an antireflective coating composition (“ARC”) for an overcoated photoresist. These compositions also serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectively from an undercoated dielectric layer.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: May 10, 2005
    Assignee: Shipley Company, L.L.C.
    Inventor: Edward K. Pavelchek
  • Residue and scum reducing composition and method
    Patent number: 6887654
    Abstract: A composition and method to reduce or to prevent residue and scum formation on a substrate or in a solution. The composition contains an aromatic alkoxylate in combination with a polyol or ether or ester of a polyol. The composition also reduces or prevents foam formation such as in developing processes in the manufacturing of printed wiring boards.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: May 3, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Daniel E. Lundy, Robert K. Barr, Edgardo Anzures, Edward J. Brady, James G. Shelnut
  • Antireflective coating compositions
    Patent number: 6887648
    Abstract: Antireflective compositions are provided that contain an ionic thermal acid generator material. Use of such a thermal acid generator material can significantly increase the shelf life of solutions of antireflective compositions in protic media. Antireflective compositions of the invention can be effectively used at a variety of wavelengths used to expose an overcoated photoresist layer, including 248 nm and 193 nm.
    Type: Grant
    Filed: June 2, 2004
    Date of Patent: May 3, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Edward K. Pavelchek, Peter Trefonas, III
  • Methods and producing conductor layers on dielectric surfaces
    Patent number: 6887561
    Abstract: A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidizing agents, then treated in trivalent bismuth compound solution and additionally treated in sulphide solution.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: May 3, 2005
    Assignee: Shipley Company, L.L.C.
    Inventor: Mykolas Baranauskas
  • Combined wet and dry etching process for micromachining of crystalline materials
    Patent number: 6885786
    Abstract: A novel micromachining method in which dry etching and anisotropic wet etching are combined.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: April 26, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Dan A. Steinberg, Jasean Rasnake