Abstract: An optical subassembly which positions an optical device is described. The optical device is mounted on a plurality of spheres or columns placed in predetermined positions in an upper surface of a substrate. The predetermined positions include pits formed in the upper surface of the substrate. The spheres may be the same size or may be of varying sizes. Pits or grooves also may be formed in the optical device. The optical device may be formed with flexure positions to assist in holding it in place on the spheres. Further, the optical device, spheres and substrate may be metallized or formed of metal and the surface tension forces of solder may be utilized to position the optical device.

Abstract: New organic-based radiation absorbing compositions are provided that are suitable for use as an antireflective coating composition (“ARC”) for an overcoated photoresist. These compositions also serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectively from an undercoated dielectric layer.

Abstract: A method for producing conductor coating on dielectric surface may be used in many areas of industry for preparation of dielectric surfaces for selective electroplating. Using this method, conductor coatings are obtained when dielectric items are etched in acidic solutions containing oxidizing agents, then treated in trivalent bismuth compound solution and additionally treated in sulphide solution.

Abstract: A composition and method to reduce or to prevent residue and scum formation on a substrate or in a solution. The composition contains an aromatic alkoxylate in combination with a polyol or ether or ester of a polyol. The composition also reduces or prevents foam formation such as in developing processes in the manufacturing of printed wiring boards.

Abstract: Antireflective compositions are provided that contain an ionic thermal acid generator material. Use of such a thermal acid generator material can significantly increase the shelf life of solutions of antireflective compositions in protic media. Antireflective compositions of the invention can be effectively used at a variety of wavelengths used to expose an overcoated photoresist layer, including 248 nm and 193 nm.

Abstract: An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive visa extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.

Abstract: A novel micromachining method in which dry etching and anisotropic wet etching are combined.

Abstract: Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an electrolytic copper plating solution. The present invention can prevent the copper layer on the resulting composite material from forming aggregation and, when the plating is intended to fill vias, make it possible to achieve the via-filling without voids. The present invention also relates to a method for controlling the electrolytic copper plating solution by using an amount of a specific decomposition product of the sulfur-containing compound as an index.

Abstract: An opaque, low resistivity silicon carbide and a method of making the opaque, low resistivity silicon carbide. The opaque, low resistivity silicon carbide is a free-standing bulk material that may be machined to form furniture used for holding semi-conductor wafers during processing of the wafers. The opaque, low resistivity silicon carbide is opaque at wavelengths of light where semi-conductor wafers are processed. Such opaqueness provides for improved semi-conductor wafer manufacturing. Edge rings fashioned from the opaque, low resistivity silicon carbide can be employed in RTP chambers.

Abstract: A continuous feed coater for coating a length of substrate with vaporized or sprayed material, is disclosed. A specific example is a roll-to-roll coater which includes two lower supply rollers for supporting two webs of uncoated material, and two upper take-up rollers for supporting the webs after they are coated. A central web-support forms a plenum that acts as a deposition chimney or chamber by bringing the two webs into close proximity to each other to form two large walls of the plenum. The ends of the webs are sealed using side dams to form the chimney with a rectangular cross section such that the vapor cannot exit from the edges of the material. The vaporized coating constituents to be deposited on the rolled material are directed into the deposition plenum from a coating material supply source located at the bottom of the plenum, and are exhausted through the top of the plenum.

Abstract: A method for constructing an optical switch and the switch constructed thereby are described. An optical switch having a pair of chips is assembled with a plurality of optical fibers mounted on the chips such that endfaces of the fibers extend beyond ends of the chips. The optical fibers may be mounted by adhering them to the chips. The endfaces of the fibers and the front surfaces of the chips are then polished to provide coplanar surfaces which are good optical couplers. The chips are then etched with an etchant material which is ineffective at etching the optical fibers. The chips may include a coating which is resistant to the etchant material.

Abstract: An optical fiber array having a V-groove chip with a front portion and a rear portion. The optical fibers are disposed in the V-grooves. The optical fibers are bnonded (e.g. glued) to the V-groove chip in the rear portion of the chip. The optical fibers are not bonded to the front portion of the chip. Preferably, the optical fibers have endfaces that are flush with a front face of the chip. The optical fibers extend from the rear portion. In use, the optical fiber array is pressed against V-grooves of an integrated optics chip or optoelectronic submount. Since the optical fibers are not bonded to the front portion, they can move slightly to fit precisely into V-grooves of the IO chip or submount. Hence, optical fiber alignment is improved. Also, there is no danger of residual adhesive preventing close contact between the optical fibers and IO chip.

Abstract: A waveguide array is provided for use in optical systems requiring a two-dimensional array of waveguides. The two-dimensional array comprises a first one-dimensional array which includes a plurality of optical waveguides and at least one registration feature. The two-dimensional array also comprises a second one-dimensional array having a plurality of optical waveguides and comprising at least one detent disposed in communication with the registration feature. The detent and registration feature are provided in respective locations of the first and second one-dimensional arrays so that the conjoined first and second one-dimensional arrays provide a two-dimensional array of waveguides. In a particular configuration of the two-dimensional array, the waveguides comprise optical fibers.

Abstract: The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state.

Abstract: A method for dispensing a chemical solution in the small-scale manufacture of semiconductors is provided. The method includes associating a dispensing unit with a semiconductor coat/develop track machine and a pneumatic syringe of a chemical solution with the dispensing unit. A dispensing pressure is applied to the pneumatic syringe. The flow control diaphragm is opened to allow the dispensing pressure to drive the chemical solution from the dispensing nozzle, while the drip prevention diaphragm is moved from a first position to a second position. The flow control diaphragm is closed to prevent the dispensing pressure from driving the chemical solution from the dispensing nozzle, while the drip prevention diaphragm is returned to the first position to generate a suck-back force in the flow path at the dispensing nozzle.

Abstract: New photoresists are provided that are suitable for short wavelength imaging, including sub-200 nm such as 157 nm. In one aspect, resists of the invention comprise a fluorine-containing polymer, a photoactive component, and one or more additional components of an amine or other basic composition, a dissolution inhibitor compound, a surfactant or leveling agent, or a plasticizer material. In another aspect, resists of the invention contain a fluorine-containing resin and one or more photoacid generator compounds, particularly non-aromatic onium salts and imidosulfonates, and other non-ionic photoacid generator compounds.

Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.

Abstract: Disclosed are photoimageable compositions having improved stripping properties as well as methods for manufacturing printed wiring boards using such photoimageable compositions.

Abstract: The present invention provides new light absorbing compositions suitable for use as antireflective coating compositions (“ARCs”), including for deep UV applications. The antireflective compositions of the invention are particularly useful where a planarizing coating layer is required. ARCs of the invention contain a low molecular weight resin, a plasticizer compound and/or a low Tg resin. The invention also includes methods for applying forming planarizing ARC coating layers.

Abstract: Disclosed are photoresist compositions suitable for imaging with sub 200 nm wavelength radiation including as polymerized units one or more monomers having an electronegative substituent and an ester group containing certain leaving groups. Also disclosed are methods of providing photoresist relief images using the photoresist compositions.