Abstract: Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Abstract: A negative electrode material for a lithium ion secondary battery including carbon over a part or a whole of a surface of an oxide of silicon, in which the content of the carbon is from 0.5 mass-% to less than 5 mass-%.

Abstract: One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

Abstract: An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.

Abstract: A sol composition for aerogel formation including a hydrolysis product of a polysiloxane compound.

Abstract: A polyamideimide resin having isocyanate groups at the terminals, wherein at least a portion of the isocyanate groups are blocked with an ether group-containing cyclic amine.

Abstract: The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: An organic electronic material including a charge transporting polymer having a structure that is represented by Formula (1) and that is branched in three or more directions (in the formula, Rf's are each independently a fluoroalkyl group, a and b are 0 or 1, and a and b are not both 0 at the same time).

Abstract: A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.

Abstract: Disclosed is a temporary protective film for semiconductor sealing molding 10 including a support film 1; and an adhesive layer 2 provided on the support film 1 and containing an acrylic rubber. A solid shear modulus at 200° C. of the temporary protective film for semiconductor sealing molding 10 may be 5.0 MPa or higher.

Abstract: The present invention relates to a friction member comprising a friction material and a back metal, wherein the friction material comprises no copper, or has a copper content of less than 0.5% by mass in terms of a copper element even if the friction material comprises copper, the friction material comprises magnesium oxide and a carbon material comprising graphite and coke, the carbon material is obtained by blending in a combination of a coarse-grained material and a fine-grained material, an average particle diameter of the coarse-grained material is 100 to 600 ?m, and an average particle diameter of the fine-grained material is less than 100 ?m.

Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.

Abstract: A two-part curable urethane composition comprising a main agent (A) and a curing agent (B), wherein the main agent (A) contains a urethane prepolymer (a), an isocyanurate-modified polyisocyanate compound (b), and a silane coupling agent (c) at a specified ratio by mass; and the curing agent (B) contains a polyether polyol (d), a polyether polyol having 4 or more hydroxy groups (e), and an amine catalyst (f) at a specified ratio by mass.

Abstract: This heat radiation material contains metal particles and a resin, and has a structure in which the metal particles are localized in at least one surface side.

Abstract: A device which includes a heat generator, a resinous housing covering the heat generator, and a heat radiation material disposed on at least some of the surfaces of the heat generator, wherein the heat radiation material includes metal particles and a resin and has a region where the metal particles arranged along the surface direction are present at a relatively high density.

Abstract: An organic electronic material that includes a charge transporting polymer which has a branched structure and has a structural unit having a structure represented by Formula (1).

Abstract: A heat radiation material which includes metal particles and a resin and has a region inside where the metal particles arranged along the surface direction are present in a relatively high density.

Abstract: A friction material composition containing a binder, an organic filler, an inorganic filler and a fibrous base material, wherein the friction material composition either contains no copper as an element or has a content of copper as an element that does not exceed 0.5% by mass, contains ?-alumina and ?-alumina in a mass ratio within a range from 1:20 to 1:5, contains a silicone-containing phenol resin, contains 20 to 35% by mass of a titanate salt, contains 3 to 7% by mass of a graphite having a median diameter of 1 to 30 ?m, and contains antimony trisulfide.

Abstract: An epoxy resin composition that comprises an epoxy resin and a curing agent, the epoxy resin comprising an epoxy compound that has, in one molecule, two or more structural units represented by the following Formula (I) and two or more epoxy groups, and the curing agent comprising a compound having two or more amino groups that are directly bound to an aromatic ring.