Patents Assigned to SHOWA DENKO MATERIALS CO., LTD.
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11149164
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: October 19, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • Method for producing semiconductor device
    Patent number: 11147166
    Abstract: Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: October 12, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomoaki Shibata, Hanako Yori, Tomonori Minegishi, Hidenori Abe, Takashi Masuko, Shunsuke Otake
  • Polishing liquid and polishing method
    Patent number: 11136474
    Abstract: A polishing liquid for polishing a surface to be polished containing a tungsten material, the polishing liquid comprising abrasive grains; a polymer having a cationic group at the terminal; an oxidizing agent; a metal oxide-dissolving agent; and water, in which the polymer has a structural unit derived from an unsaturated carboxylic acid, a weight average molecular weight of the polymer is 20000 or less, and a pH is less than 5.0.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: October 5, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hiroshi Ono, Makoto Mizutani
  • Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board
    Patent number: 11136454
    Abstract: The present invention provides a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin having at least two epoxy groups in one molecule, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (E) a flame retardant dispersion.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: October 5, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Keisuke Kushida, Hiroshi Shimizu, Minoru Kakitani, Yoshikatsu Shiraokawa, Tatsunori Kaneko
  • ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE
    Publication number: 20210301059
    Abstract: An aspect according to the present invention provides an acrylic resin including a first structural unit represented by formula (1) and a second structural unit represented by formula (2): [in the formula (1), R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12-30 carbon atoms] [in the formula (2), R3 and R5 each independently represent a hydrogen atom or a methyl group, and R4 represents a divalent organic group].
    Type: Application
    Filed: June 27, 2019
    Publication date: September 30, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Naoki FURUKAWA, Nozomi MATSUBARA, Tsuyoshi MORIMOTO, Akira NAGAI
  • METHOD FOR DECOMPOSING FLAVONOID GLYCOSIDE AND METHOD FOR PRODUCING FLAVONOID
    Publication number: 20210292294
    Abstract: Provided is a method for decomposing a flavonoid glycoside, wherein a flavonoid glycoside is decomposed into a flavonoid by heat-treating a flavonoid glycoside-containing raw material in the presence of an alcohol in a sealed container at a temperature exceeding the boiling point of the alcohol under atmospheric pressure.
    Type: Application
    Filed: July 26, 2019
    Publication date: September 23, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Motohiro ARIFUKU, Yoshiaki KURIHARA, Masato KANEEDA
  • FRICTION MEMBER, FRICTION MATERIAL COMPOSITION FOR LOWER LAYER MATERIAL, LOWER LAYER MATERIAL, DISC BRAKE PAD, AND VEHICLE
    Publication number: 20210293291
    Abstract: Provided is a friction member (such as a disc brake pad) having light weight by reducing weight of a back plate and having improved durability after repeated braking. The friction member is specifically a friction member in which a friction material (overlying material) is disposed through an underlying material on one surface of a back plate comprising a material having a lower specific gravity than that of steel, wherein the underlying material comprises 30 mass % or more in total of a bonding material, an organic filler, and an organic fiber.
    Type: Application
    Filed: July 24, 2018
    Publication date: September 23, 2021
    Applicant: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yoshihisa TAKAHASHI, Mitsuo UNNO
  • Production method for aerogel laminate, and aerogel laminate roll
    Patent number: 11117353
    Abstract: An aerogel laminate roll is prepared by winding an aerogel laminate around a roll core, the aerogel laminate comprising a support and an aerogel layer disposed on the support and having a thickness of 200 ?m or less.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: September 14, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tomohiko Kotake, Masato Miyatake, Chisato Kikkawa, Hiroyuki Izumi, Hikari Murai
  • Composition, hole transport material composition, and ink composition
    Patent number: 11118005
    Abstract: Embodiments of the present invention relate to a composition containing a polymer or oligomer (A) and an initiator (B), wherein the polymer or oligomer (A) contains no alkyl groups of 5 or more carbon atoms, contains at least one type of structural unit selected from the group consisting of a structural unit containing an aromatic amine structure and a structural unit containing a carbazole structure, and contains, at one or more terminals, a structural unit containing a thienyl group which may have a substituent, and a degree of solubility of the composition is capable of being changed by applying heat, light, or both heat and light.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: September 14, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Kazuyuki Kamo, Hirotaka Sakuma, Kenichi Ishitsuka, Tomotsugu Sugioka, Yuki Yoshinari, Ryo Honna, Daisuke Ryuzaki
  • Sealing resin composition, electronic component device, and method of manufacturing electronic component device
    Patent number: 11111407
    Abstract: A sealing resin composition contains an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein the inorganic filler (C) contains a first inorganic filler (C1) having an average particle size from 0.1 ?m to 20 ?m and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm, and a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 mm2/g or more.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: September 7, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yuma Takeuchi, Hisato Takahashi, Yoshihito Inaba
  • RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
    Publication number: 20210261706
    Abstract: An aspect of the present invention provides a resin composition containing an acrylic resin which is obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer which is copolymerizable with the first monomer and has a block isocyanate group. (In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12-30 carbon atoms.
    Type: Application
    Filed: June 27, 2019
    Publication date: August 26, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Naoki FURUKAWA, Tsuyoshi MORIMOTO, Akira NAGAI, Nozomi MATSUBARA
  • Negative electrode active material for lithium ion secondary battery, negative electrode for lithium ion secondary battery, and lithium ion secondary battery
    Patent number: 11094931
    Abstract: A negative electrode active material for a lithium ion secondary battery includes silicon oxide particles, each of which has carbon on at least a portion of its surface, in which: a ratio (PSi/PSiO2) of an intensity of an X-ray diffraction peak at 2? of from 27° to 29°, which is derived from Si, to an intensity of an X-ray diffraction peak at 2? of from 20° to 25°, which is derived from SiO2, is within a range of from 1.0 to 2.6, when CuK? radiation having a wavelength of 0.15406 nm is used as a radiation source; and a ratio (SH2O/SN2) of a specific surface area calculated from moisture adsorption at 298 K to a specific surface area calculated from nitrogen adsorption at 77 K is 0.60 or less.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: August 17, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Akira Yasuda, Yoshie Ohsaki, Tatsuya Nishida
  • RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
    Publication number: 20210246349
    Abstract: An aspect of the present invention is a resin composition containing an acrylic resin obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer copolymerizable with the first monomer and having a reactive group. [In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents a group having a polyoxyalkylene chain.
    Type: Application
    Filed: May 10, 2019
    Publication date: August 12, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Naoki FURUKAWA, Tsuyoshi MORIMOTO, Atsuko SANO, Hiroshi YOKOTA, Nozomi MATSUBARA, Akira NAGAI, Keiko KIZAWA
  • SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
    Publication number: 20210229222
    Abstract: A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 ?m to 30 ?m; and the C.V. value of the solder particles is 20% or less.
    Type: Application
    Filed: June 26, 2019
    Publication date: July 29, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Liquid epoxy resin composition for sealing, and electronic component device
    Patent number: 11059966
    Abstract: A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: July 13, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Naoyuki Nojiri, Hisato Takahashi, Makoto Kunimi, Kohji Hori
  • Wavelength conversion member, back light unit, image display device, resin composition for wavelength conversion, and resin cured product for wavelength conversion
    Patent number: 11061278
    Abstract: Provided are a wavelength conversion member including: a quantum dot phosphor; a white pigment including an organic substance layer that contains an organic substance, on at least a part of a surface of the white pigment; and a resin cured product including the quantum dot phosphor and the white pigment.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 13, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kouhei Mukaigaito, Shigeaki Funyu, Hiroaki Takahashi, Tomoyuki Nakamura, Masato Fukui, Takanori Kajimoto, Yoshitaka Katsuta, Tatsuya Yahata
  • Negative electrode active material for lithium ion secondary battery, negative electrode for lithium ion secondary battery, and lithium ion secondary battery
    Patent number: 11063255
    Abstract: A negative electrode active material for a lithium ion secondary battery includes silicon oxide particles, each of which has carbon on at least a portion of its surface, in which: a ratio (PSi/PSiO2) of an intensity of an X-ray diffraction peak at 2? of from 27° to 29°, which is derived from Si, to an intensity of an X-ray diffraction peak at 2? of from 20° to 25°, which is derived from SiO2, is within a range of from 1.0 to 2.6, when CuK? radiation having a wavelength of 0.15406 nm is used as a radiation source; and a specific surface area calculated from carbon dioxide adsorption at 273 K is 8.5 m2/g or less.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 13, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Akira Yasuda, Yoshie Ohsaki, Tatsuya Nishida
  • Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package
    Patent number: 11054744
    Abstract: Provided is a photosensitive element including a support film, and a photosensitive layer provided on the support film and formed from a photosensitive resin composition, in which the surface roughness of the surface of the support film that is in contact with the photosensitive layer is 200 to 4,000 nm.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: July 6, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Toshimasa Nagoshi, Shigeo Tanaka, Shizu Fukuzumi
  • Method for producing semiconductor device
    Patent number: 11049825
    Abstract: A method for producing a semiconductor device of the present invention includes: step (I) of disposing one or more semiconductor elements each having an active surface, on a thermosetting resin film containing a thermosetting resin composition, such that the thermosetting resin film and the active surfaces of the semiconductor elements come into contact; step (II) of encapsulating the semiconductor elements disposed on the thermosetting resin film with a member for semiconductor encapsulation; step (III) of providing openings in the thermosetting resin film or a cured product thereof after step (II), the openings extending to the active surfaces of the semiconductor elements; and step (IV) of filling the openings with a conductor or forming a conductor layer inside the openings.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: June 29, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Aya Kasahara, Toshihisa Nonaka, Daisuke Fujimoto, Naoya Suzuki
  • Polishing liquid, polishing liquid set, and substrate polishing method
    Patent number: 11046869
    Abstract: A polishing liquid comprising a liquid medium, an abrasive grain and a polymer, wherein the polymer includes a first molecular chain having a functional group directly bonded thereto, and a second molecular chain branched from the first molecular chain, and the functional group is at least one selected from the group consisting of a carboxyl group, a carboxylic acid salt group, a hydroxyl group, a sulfo group and a sulfonic acid salt group.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: June 29, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Toshiaki Akutsu, Hisataka Minami, Tomohiro Iwano, Tetsuro Yamashita, Masako Aoki, Masato Fukasawa