Abstract: The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.

Abstract: A positive electrode for a lithium ion secondary battery, including a positive electrode current collector, a conductive layer which is disposed directly or indirectly on the positive electrode current collector, and which includes a conductive particle, a polymer particle, and a fluororesin or a resin including a structural unit derived from a nitrile group-containing monomer, and a positive electrode active material layer disposed directly or indirectly on the conductive layer, as well as a lithium ion secondary battery using the same.

Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: Provided are a method for producing an FRP precursor and a device for producing an FRP precursor, wherein the method and the device have a good productivity, and under a normal pressure, enable filling of a resin into a bulk gap of an aggregate as well as prevent the resin from spouting out from an edge portion thereof. The method for producing the FRP precursor is to produce the FRP precursor by melt-adhering each of a pair of thermosetting resin films 54 to each of both surfaces 40a and 40b of an aggregate 40 that is in a form of a sheet, the method comprising: an aggregate's surface heating process to heat aggregate's both surfaces, i.e.

Abstract: The present invention is concerned with a frictional material composition not containing copper as an element or having the content of copper of 0.5 mass % or less, the composition containing (A) potassium titanate; and (B) one or more selected from the group consisting of lithium potassium titanate and magnesium potassium titanate, in a total content of the component (A) and the component (B) of 10 to 35 mass %, wherein on heating a molded product of the frictional material composition to 500° C. at a temperature rise rate of 10° C./min under an air atmosphere, the mass reduction rate is 5 to 20%.

Abstract: A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 ?m and less than or equal to 0.8 ?m, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 ?m and less than or equal to 50 ?m, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

Abstract: A nanocrystal production method includes a light irradiation step of applying light to a surface of a metal material immersed in water to form nanocrystals on the surface. In this nanocrystal production method, the metal material contains iron, the nanocrystal contains at least one of iron oxide and iron hydroxide, and in the spectrum of the light, a wavelength at which the intensity is maximum is not less than 360 nm and less than 620 nm.

Abstract: The present invention is concerned with a frictional material composition not containing copper as an element or having the content of copper of 0.5 mass % or less, the composition containing a cashew dust; (A) potassium titanate; (B) one or more selected from the group consisting of lithium potassium titanate and magnesium potassium titanate; and (C) one or more selected from the group consisting of zirconium silicate, zirconium oxide, and magnesium oxide, wherein the content of the cashew dust is 1 to 10 mass %, and the content of the component (C) is 11 to 30 mass %.

Abstract: An epoxy resin, comprising a first epoxy compound having a mesogenic structure and a second epoxy compound having two or more mesogenic structures that are the same as the mesogenic structure of the first epoxy compound, a proportion, determined by liquid chromatography, of the first epoxy compound being from 40% to 50% with respect to a total amount of the epoxy resin.

Abstract: A method for manufacturing an electronic component, includes: a step of temporarily fixing onto a support body a workpiece to become a member constituting an electronic component, via a film-like temporary fixing material; a step of processing the workpiece which is temporarily fixed onto the support body; and a step of separating the processed workpiece from the support body and the film-like temporary fixing material, and the film-like temporary fixing material contains an (meth)acrylic copolymer (A) having a not unevenly distributed reactive functional group.

Abstract: The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.

Abstract: An object of the present invention is to provide an adsorbent material having high dispersibility and reversibility. The adsorbent material has a polymer material having a plurality of functional groups ionizable in water and exhibiting no lower limit critical solution temperature, an adsorption site capable of interacting with a target substance, and a carrier.

Abstract: The present invention provides a separation material including porous polymer particles that comprise at least one of styrene and divinylbenzene as a monomer unit at a proportion of 90% by mass or more based on the total amount of the monomers; and a coating layer that comprises a macromolecule having hydroxyl groups and covers at least a portion of the surface of the porous polymer particles, wherein the coating amount provided by the coating layer is 1 to 15 mg/m2 per unit specific surface area of the porous polymer particles.

Abstract: A negative electrode material for a lithium ion secondary battery includes a silicon oxide and having a diffraction peak attributable to Si (111) in an X-ray diffraction spectrum, in which a size of a silicon crystallite calculated from the diffraction peak is from 2.0 nm to 8.0 nm.

Abstract: Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3: Step 1: a step of laminating, on a substrate with inner layer circuit, a metal foil with adhesive layer including a support, a metal foil having a thickness of 3 ?m or less and ? or less relative to the thickness of the inner layer circuit, and an organic adhesive layer having a thickness of 10 ?m or less in this order, via an organic insulating resin layer such that the organic insulating resin layer and the organic adhesive layer are opposed to each other, and then releasing the support to form a laminated sheet (a) having the metal foil as an outer layer metal foil layer; Step 2: a step of irradiating the laminated sheet (a) with a laser to bore the outer layer metal foil layer, the organic adhesive layer, and the organic insulating resin layer to form a bored laminated sheet (b) having a blind via hole; and Step 3: a step of forming an outer layer circuit connected with the inner layer circui

Abstract: The present invention provides a separation material that comprises porous polymer particles comprising a styrene-based monomer as a monomer unit; and a coating layer comprising a macromolecule having hydroxyl groups, which covers at least a portion of the surface of the porous polymer particles, and the separation material has a 5% compressive deformation modulus of 100 to 1,000 MPa, and has a mode diameter in the pore size distribution of 0.1 to 0.5 ?m.

Abstract: Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 ?m to 3 ?m.

Abstract: A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Abstract: An organic electronic material containing a charge transport polymer for which, in a molecular weight distribution chart measured by GPC, the area ratio accounted for by components having a molecular weight of less than 20,000 is not more than 40%, and the area ratio accounted for by components having a molecular weight of 500 or less is not more than 1%.