Abstract: Provided is a method for decomposing a flavonoid glycoside, wherein a flavonoid glycoside-containing raw material is hydrothermally treated to decompose a flavonoid glycoside into a flavonoid.
Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.
Abstract: Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer: wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.
Abstract: Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 ?m to 0.8 ?m, and flake-shaped micro copper particles having a maximum particle size of 1 ?m to 20 ?m, and an aspect ratio of 4 or greater, and the amount of the micro copper particles contained, which are included in the metal particles and have a maximum particle size of 1 ?m to 20 ?m and an aspect ratio of less than 2, is 50% by mass or less on the basis of a total amount of the flake-shaped micro copper particles.
Abstract: A polishing agent containing abrasive grains and water, in which the abrasive grains contain silica particles, an average particle diameter Rave of the abrasive grains is 50 nm or more, a ratio Rave/Rmin of the average particle diameter Rave to an average minor diameter Rmin of the abrasive grains is 1.0 to 2.0, and a zeta potential of the abrasive grains in the polishing agent is positive.
Abstract: A negative electrode material for a lithium-ion secondary battery contains graphitic particles of which a standard deviation of circularity at a cumulative frequency ranging from 10% by particle to 90% by particle from the lower circularity, determined by a flow-type particle analyzer, is from 0.05 to 0.1.
Abstract: The present disclosure relates to methods of collecting exosomes and microvesicles (EMV) from urine, isolating corresponding mRNA, and analyzing expression patterns in order to diagnose and treat various urothelial cancers. In particular, various expression patterns are analyzed through a unique diagnostic formula.
Type:
Grant
Filed:
August 30, 2016
Date of Patent:
June 8, 2021
Assignees:
Showa Denko Materials Co., Ltd., Showa Denko Materials (America), Inc., City of Sapporo
Inventors:
Taku Murakami, Cindy M. Yamamoto, Masato Mitsuhashi, Hiroshi Harada
Abstract: An epoxy resin, comprising an epoxy compound, the epoxy compound comprising two or more structures represented by the following Formula (I) and at least one divalent biphenyl group: wherein, in Formula (I), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.
Abstract: A negative electrode active material for a lithium ion secondary battery, the negative electrode active material includes silicon oxide particles, each of which has carbon on at least a portion of its surface, in which: a ratio (PSi/PSiO2) of an intensity of an X-ray diffraction peak at 2? of from 27° to 29°, which is derived from Si, to an intensity of an X-ray diffraction peak at 2? of from 20° to 25°, which is derived from SiO2, is within a range of from 1.0 to 2.6, when CuK? radiation having a wavelength of 0.15406 nm is used as a radiation source; and a specific surface area calculated from moisture adsorption at 298 K is 6.5 m2/g or less.
Abstract: A photosensitive film of the present invention includes a carrier film having a first surface whose surface roughness is 0.1 to 0.4 ?m, and a photosensitive layer formed on the first surface, in which a haze of the carrier film is 30 to 65%, and a spectral haze at a wavelength of 405 nm of the carrier film, as measured by providing a transparent resin layer in which a difference between a refractive index of the transparent resin layer and a refractive index of the photosensitive layer is within ±0.02 on the first surface, is 0.1 to 9.0%.
Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.
Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.
Abstract: The lead-free glass composition contains vanadium oxide, tellurium oxide, alkali metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO2. A content of the alkali metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide R2O (R: alkali metal element).
Abstract: A method of recovering a decomposition product of a thermosetting resin cured product, the method includes a step of contacting an object to be treated, that contains a thermosetting resin cured product, with a treatment liquid containing an alkali metal compound and an alcohol solvent, to decompose and dissolve the thermosetting resin cured product; a step of mixing the treatment liquid, in which a decomposition product of the thermosetting resin cured product is dissolved, and an acidic aqueous solution to separate the mixture into an aqueous layer and an organic layer containing the decomposition product; and a step of recovering the organic layer.
Abstract: A laminate, comprising an intermediate layer and a covering material A and a covering material B that are disposed on respective sides of the intermediate layer, the covering material A being disposed with an orientation direction at an angle of 20° or less with respect to an orientation direction of the covering material B.
Abstract: Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.
Abstract: A lithium ion secondary battery includes a positive electrode containing a spinel-type lithium-nickel-manganese composite oxide as a positive electrode active material; a negative electrode containing, as a negative electrode active material, an active material in which introduction and release of lithium ions take place at a potential of 1.2 V or higher relative to a lithium potential; a separator inserted between the positive electrode and the negative electrode; and an electrolytic solution, wherein a capacity ratio of a negative electrode capacity of the negative electrode to a positive electrode capacity of the positive electrode (negative electrode capacity/positive electrode capacity) is 1 or lower, and the electrolytic solution contains dimethyl carbonate as a non-aqueous solvent at a content ratio of higher than 70% by volume with respect to a total amount of the non-aqueous solvent.
Abstract: An adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator and (d) a filler.
Abstract: A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.