Abstract: An adaptive semiconductor memory device is used for being inserted into a host for storage. The semiconductor memory device comprises a non-volatile memory and a switch. The switch can be a logical switch or a physical switch that controls the semiconductor memory device to be in compliance with either a first specification version or a second specification version of the semiconductor memory device. The second specification version in comparison with the first specification version is used for higher capacity applications.

Abstract: A method of wear leveling for a non-volatile memory is disclosed. A non-volatile memory is divided into windows and gaps, with each gap between two adjacent windows. The windows comprise physical blocks mapped to logical addresses, and the gaps comprise physical blocks not mapped to logical addresses. The windows are shifted through the non-volatile memory in which the mapping to the physical blocks in the window to be shifted is changed to the physical blocks in the gap.

Abstract: A non-volatile memory device, and a method for accessing the non-volatile memory device are provided. The non-volatile memory device is connected to a host via a bus. The non-volatile memory device comprises an MCU. By independently processing the particular commands using only the auxiliary circuit, the MCU can cease to operate, thus saving power. By setting the bus into power saving mode when the non-volatile memory device is busy, the host and the non-volatile memory device would not communicate mutually, thus, saving power.

Abstract: A memory structure in a semiconductor substrate essentially comprises a first conductive line, two conductive blocks, two first dielectric spacers, a first dielectric layer, and a second conductive line. The first conductive line, e.g., a polysilicon line, is formed above the semiconductor substrate, and the two conductive blocks composed of polysilicon, for example, are formed at the two sides of the first conductive line and insulated from the first conductive line with the two first dielectric spacers. The first dielectric layer, such as an oxide/nitride/oxide (ONO) layer, is formed on the two second conductive blocks and above the first conductive line, and the second conductive line is formed on the first dielectric layer and is substantially perpendicular to the two doping regions. Accordingly, the stack of the conductive block, the first dielectric layer, and the second conductive line form a floating gate structure which can store charges.

Abstract: A programming method for programming stored bits in floating gates of a flash memory cell or selected flash memory cells of a flash memory array is utilized for applying SSI injection on said flash memory cell or said selected flash memory cells of a flash memory array is disclosed. Constant charges at the drain regions of said flash memory cell or said selected flash memory cells of the flash memory array is implemented with a capacitor and a related switch for suppressing variant injected-charges-related properties in applying the SSI injection. A constant biasing current, which may be implemented with a constant current source or a current mirror equipped with a constant current source, is applied on source regions of said flash memory cell or said selected flash memory cells of the flash memory array for enhancing the suppression of said variant biasing properties.

Abstract: A non-volatile memory system and a method for reading data therefrom are provided. The data comprises a first sub-data and a second sub-data. The non-volatile memory system comprises a first storage unit and a second storage unit, adapted for storing the two sub-data respectively. The first storage unit reads a first command from the controller, and stores the first sub-data temporarily as the first temporary sub-data according to the first command. The second storage unit reads a second command from the controller, and stores the second sub-data temporarily as the second temporary sub-data according to the second command. The first temporary sub-data is read from the first storage unit. Then, the first storage unit reads a third command from the controller. The second temporary sub-data is also read from the second storage unit while reading the third command. The time for reading data from the non-volatile memory system is reduced.

Abstract: A read method for multiple-value information in a semiconductor memory such as a nonvolatile semiconductor memory is introduced. The method includes obtaining a first data from a selected multiple-value memory cell by applying a first voltage to a control gate of the selected multiple-value memory cell. A second data from the selected multiple-value memory cell is obtained by applying a second voltage to the control gate of the selected multiple-value memory cell. A first bit of the plurality of bits stored in the selected multiple-value memory cell is then obtained by performing a predetermined calculation on the first data and the second data. A second bit of the plurality of bits is obtained from the selected multiple-value memory cell by applying a third voltage to the control gate of the selected multiple-value memory cell.

Abstract: A method for reading a memory array is disclosed. The method includes turning on the column of select gates; preprogramming a first right floating gate to a high threshold and a first left floating gate coupled to a same first word line as the first right floating gate to a low threshold; charging a voltage of the right data line to a first predetermined value; charging a voltage of the first word line to a second predetermined value which is between the high threshold of the first right floating gate and the low threshold of the first left floating gate; charging a voltage of a second word line coupled to a second right floating gate to a third predetermined value; and comparing a current of the left data line with a fourth predetermined value.

Abstract: A memory structure formed between two doping regions in a semiconductor substrate includes two conductive blocks functioning as floating gates formed at two sides of a first conductive line functioning as a select gat and insulated from the first conductive line with two first dielectric spacers therebetween, wherein the two conductive blocks each have a raised top and raised parts of sides relative to the top of the first conductive line. A first dielectric layer is formed on the tops and the parts of the sides of the two conductive blocks. A second conductive line functioning as a word line is formed on the first dielectric layer, wherein the second conductive line has a part deposited between the two conductive blocks and is substantially perpendicular to the first conductive line and two doping region functioning as bit lines.

Abstract: A flash memory includes: a plurality of switches; a global bit line; and a plurality of memory blocks, each containing a plurality of local bit lines, and a plurality of memory units coupled to the plurality of local bit lines respectively. A first switch couples a first local bit line to the global bit line; a second switch couples a second local bit line to the global bit line; a third switch couples the first local bit line to a first voltage source; and a fourth switch couples the second local bit line to a second voltage source.

Abstract: A method for erasing data of a flash memory is disclosed. The flash memory includes a plurality of memory cells coupled to a word line, where each of the memory cells has a substrate, an isolated carrier storage layer, and a control gate coupled to the word line. And the method includes: coupling the substrate to a first voltage to increase a voltage level of the substrate; before erasing data, floating the control gate to make a voltage level of the control gate increase with the voltage level of the substrate; and coupling the control gate to a second voltage via the word line to discharge charges on the isolated carrier storage layer for erasing data.

Abstract: A vertical split gate memory cell of silicon-oxide-nitride-oxide-silicon (SONOS) type formed in a trench of a semiconductor substrate includes a first doping region, a second doping region, a conductive line, a conductive plug, a first insulating layer and a second insulating layer, wherein the conductive line and conductive plug serve as a select gate and a control gate of the vertical split gate memory cell, respectively. The first doping region of a first conductive type is underneath the bottom of the trench, whereas the second doping region of the first conductive type is beside the top of the trench. The conductive line serving as the select gate is formed in the bottom of the trench and in operation relation to the first doping region. The first insulating layer is between the conductive line and the first doping region for insulation. The conductive plug is formed above the conductive line, and insulated from the conductive line by the second insulating layer.

Abstract: An operation method for a non-volatile memory structure formed between two doping regions serving as bit lines in a semiconductor substrate, the non-volatile memory structure comprising a first conductive line serving as a select gate and being formed above the semiconductor substrate, two conductive blocks serving as floating gates and being formed at the two sides of the first conductive line and insulated from the first conductive line with two first dielectric spacers therebetween, a first dielectric layer formed on the two second conductive blocks, a second conductive line serving as a word line and being formed on the first dielectric layer and substantially perpendicular to the two doping regions.

Abstract: A method for programming a split gate memory cell comprises the following steps. First, a split gate memory cell formed on a semiconductor substrate of a first conductive type, e.g., p-type, is provided. The split gate memory cell has two bitlines of a second conductive type, e.g., n-type, a select gate, a floating gate, a wordline and a dielectric layer deposited between the floating gate and the semiconductor substrate, wherein the select gate and floating gate are transversely disposed between the two bitlines, the wordline is above the select gate and floating gate. Second, a positive voltage is applied to the wordline so as to turn on the floating gate, and a negative voltage is applied to the bitline next to the floating gate, whereby a bias voltage across the tunnel dielectric layer is generated for programming, that is, the so called F-N programming.

Abstract: An operation method for a memory structure formed between two doping regions serving as bit lines in a semiconductor substrate, the memory structure comprising a first conductive line serving as a select gate and being formed above the semiconductor substrate, two conductive blocks serving as floating gates and being formed at the two sides of the first conductive line and insulated from the first conductive line with two first dielectric spacers therebetween, a first dielectric layer formed on the two second conductive blocks, a selected second conductive line serving as a word line and being formed on the first dielectric layer and substantially perpendicular to the two doping regions, and a plurality of unselected second conductive lines parallel to the selected second conductive line; wherein reading the programmed status of one of the conductive blocks comprising the step of putting a bias voltage on the doping region next to the other conductive block so that the depletion region is created across the o

Abstract: A vertical split gate memory formed in a trench of a semiconductor substrate comprises a first doping region, a second doping region, a conductive line, a conductive spacer and a conductive plug, wherein the conductive line, conductive spacer and conductive plug serve as a select gate, a floating gate and a control gate of the vertical split gate memory cell, respectively. The first doping region of a first conductive type is underneath the bottom of the trench, whereas the second doping region of the first conductive type is beside the top of the trench. The conductive line serving as the select gate is formed at the bottom of the trench and in operation relation to the first doping region. The conductive spacer is formed beside the sidewall of the trench and above the conductive line. The conductive plug is insulated from the conductive spacer and the conductive line and in operation relation to the conductive spacer.

Abstract: A memory structure in a semiconductor substrate essentially comprises a first conductive line, two conductive blocks, two first dielectric spacers, a first dielectric layer, and a second conductive line. The first conductive line, e.g., a polysilicon line, is formed above the semiconductor substrate, and the two conductive blocks composed of polysilicon, for example, are formed at the two sides of the first conductive line and insulated from the first conductive line with the two first dielectric spacers. The first dielectric layer, such as an oxide/nitride/oxide (ONO) layer, is formed on the two second conductive blocks and above the first conductive line, and the second conductive line is formed on the first dielectric layer and is substantially perpendicular to the two doping regions. Accordingly, the stack of the conductive block, the first dielectric layer, and the second conductive line form a floating gate structure which can store charges.

Abstract: A memory structure comprises two bit lines, a first gate dielectric, a second gate dielectric, at least one first gate, a second gate and a third gate, a first dielectric spacer and a second dielectric spacer, where the two bit lines are formed in the semiconductor substrate, the first gate dielectric, and the second gate dielectric are between the two bit lines, in which at least one of the first and second gate dielectrics includes a silicon nitride. For instance, a first gate dielectric is made of ONO, whereas the second gate dielectric is composed of silicon oxide. The first gate is formed above the first gate dielectric, the second gate is formed above the second gate dielectric and is substantially perpendicular to the first gate, and the third gate is substantially parallel to the second gate. The second gate is insulated from the first gate by the first dielectric spacer, whereas the second gate is insulated from the third gate by the second dielectric spacer.

Abstract: An ONO formation method comprises the following procedures. First, a bottom oxide layer is formed on a silicon substrate, and then a silicon-rich nitride layer is deposited on the bottom oxide layer. Then, an oxidation process is performed to react with silicon atoms in the silicon-rich nitride layer, so as to form a top oxide layer. Alternatively, the silicon-rich layer can be replaced with a combination of a nitride layer and a polysilicon layer. The oxidation process can consume the polysilicon layer into the top oxide layer, and proper oxygen is introduced into the nitride layer.

Abstract: A memory structure includes a floating gate and a nitride gate dielectric on a semiconductor substrate, wherein the floating gate and nitride gate dielectric function as two memory cells. In addition to the floating gate and nitride gate dielectric, the memory structure further comprises two bitlines and a select gate. The two bitlines are formed in the semiconductor substrate, the floating gate and the select gate are formed above the semiconductor substrate and transversely disposed between the two bitlines, and the nitride gate dielectric is formed between the select gate and the semiconductor substrate.