Abstract: A delay measurement circuit includes a first skew circuit disposed proximate to a first bonding pad configured to receive a first clock signal having a first frequency. The delay measurement circuit includes a second skew circuit disposed proximate to a second bonding pad configured to receive a second clock signal having a second frequency. The first and second skew circuits each have a first mode of operation as zero-delay-return path and a second mode of operation as a synchronized pass path. The delay measurement circuit includes a pair of conductive traces coupled to the first skew circuit, another pair of conductive traces coupled to the second skew circuit, a time-to-digital converter circuit, and a switch circuit configured to selectively couple the time-to-digital converter circuit to the first skew circuit via the pair of conductive traces and the second skew circuit via the other pair of conductive traces.

Abstract: The disclosed technology relates to a ceramic composition and an article formed therefrom. A ceramic article for radio frequency applications is formed of a ceramic material having a chemical formula represented by: Bi1.0+aY2.0?a?x?2yCax+2yFe5?x?yMIVxVyO12 or Bi1.0+aY2.0?a?2yCa2yFe5?y?zVyInzO12. The ceramic material has a composition such that a normalized change in saturation magnetization (?4?Ms), defined as ?4?Ms=[(4?Ms at 20° C.)?(4?Ms at 120° C.)]/(4?Ms at 20° C.), is less than about 0.35.

Abstract: An acoustic wave device comprises a substrate including a piezoelectric material, interdigital transducer (IDT) electrodes disposed on a surface of the substrate, a first dielectric film having a lower surface disposed on the IDT electrodes and the surface of the substrate, first strips formed of a first material having a density greater than a density of the first dielectric film disposed within the first dielectric film over tips of the interdigitated electrode fingers in the edge regions of the IDT electrodes, and second strips formed of a second material having a density greater than the density of the first dielectric film disposed within the first dielectric film in the gap regions of the IDT electrodes, laterally spaced from the first strips in a direction perpendicular to a direction of propagation of a main acoustic wave through the acoustic wave device, and extending only partially over the gap regions.

Abstract: A delay line for radio frequency circuits comprises a piezoelectric substrate, a transmission single phase unidirectional transducer (SPUDT) disposed on the piezoelectric substrate, and a receive SPUDT disposed on the piezoelectric substrate and separated from the transmission SPUDT in a direction of transmission of a main acoustic wave mode utilized by the transmission SPUDT.

Abstract: A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer positioned over a substrate. The acoustic wave device can also include an interdigital transducer electrode positioned over the piezoelectric layer. The acoustic wave device can also include a grounding structure positioned over the piezoelectric layer. The acoustic wave device can also include a conductive layer positioned under the substrate such that the substrate is positioned between the conductive layer and the grounding structure. The acoustic wave device can further include an electrical pathway that electrically connects the conductive layer to the grounding structure.

Abstract: Aspects of this disclosure relate to an acoustic wave filter that includes a series a bulk acoustic wave resonator having a plurality of anti-resonant frequencies that impact a passband of the acoustic wave filter. Related bulk acoustic wave resonators, radio frequency modules, wireless communication devices, and methods of filtering radio frequency signals are disclosed.

Abstract: An acoustic wave device is disclosed. The acoustic wave device includes a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, and an anti-refection layer over a conductive layer of the interdigital transducer electrode. The conductive layer can include aluminum, for example. The anti-reflection layer can include silicon. The anti-reflection layer can be free from a material of the interdigital transducer electrode. The acoustic wave device can further include a temperature compensation layer positioned over the anti-reflection layer in certain embodiments.

Abstract: Aspects of this disclosure relate to an acoustic wave resonator having at least two resonant frequencies. An acoustic wave filter can include series acoustic wave resonators and shunt acoustic wave resonators together arranged to filter a radio frequency signal. A first shunt resonator of the shunt acoustic wave resonators can include an interdigital transducer electrode and have at least a first resonant frequency and a second resonant frequency. Related acoustic wave resonators, multiplexers, wireless devices, and methods are disclosed.

Abstract: Aspects of this disclosure relate to a shielded radio frequency component with an integrated antenna. An antenna can be on a first side of a multi-layer substrate and a radio frequency component can be disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the radio frequency component. Conductive features can be disposed around the radio frequency component and electrically connected to the ground plane. The conductive features and the ground plane can provide shielding for the radio frequency component. In certain embodiments, the conductive features can include bumps, such as solder bumps and/or copper pillars.

Abstract: Aspects of this disclosure relate to an acoustic wave filter that includes a shunt a bulk acoustic wave resonator having a plurality of resonant frequencies that impact a passband of the acoustic wave filter. Related bulk acoustic wave resonators, radio frequency modules, wireless communication devices, and methods of filtering radio frequency signals are disclosed.

Abstract: Aspects of this disclosure relate to an acoustic wave filter configured to filter a radio frequency signal and a loop circuit coupled to the acoustic wave filter. The loop circuit is configured to generate an anti-phase signal to a target signal at a particular frequency. The loop circuit includes a Lamb wave element. Related radio frequency modules and wireless communication devices are disclosed.

Abstract: Systems and methods for diplexer circuits with leakage cancellation are provided. In one aspect, a diplexer circuit including first and second radio frequency transceiver terminals and a first antenna terminal, and first and second parallel communication paths extending between the first radio frequency transceiver terminal and the first antenna terminal, and third and fourth parallel communication paths extending between the second radio frequency transceiver terminal and the first antenna terminal. The circuit also includes a first phase shifter configured to apply a first phase shift to a first radio frequency transmit signal on the first communication path, a second phase shifter configured to apply a second phase shift to a second radio frequency on the second communication path, and a third phase shifter configured to apply a third phase shift to the first radio frequency transmit signal on the third communication path.

Abstract: Aspects of this disclosure relate to multiplexers with that include an acoustic wave resonator. The acoustic wave filter includes a plurality of acoustic wave resonators of a first type and a shunt acoustic wave resonator of a second type. The shunt acoustic wave resonator of the second type has lower second harmonic distortion than the acoustic wave resonators of the first type. The shunt acoustic wave resonator of the second type has a resonant frequency in a passband of another filter of the multiplexer. Related radio frequency modules, wireless communication devices, and methods are also disclosed.

Abstract: A baseline difference is determined between a slave line card time stamp corresponding to a slave line card frame sync signal and a master line card time stamp corresponding to a master line card frame sync signal. The slave line card generates subsequent slave line card time stamps for subsequent slave line card frame sync signals and the master line card generates subsequent master line card time stamps for subsequent master line card frame sync signals. Current differences are determined between subsequent slave line card time stamps and the subsequent master line card time stamps and the current differences are compared to the baseline difference. When a mismatch difference occurs (current difference differs from the baseline difference), the mismatch difference causes a phase-locked loop in the master line card to be adjusted or an offset to be provided to the master line card time of day counter.

Abstract: Aspects of this disclosure relate to a multiplexer with an acoustic assisted trap circuit. The multiplexer includes an acoustic wave filter with an acoustic wave resonator and an impedance network that together provide a trap for a harmonic associated with another acoustic wave filter of the multiplexer. The acoustic wave filter can have an edge of a passband that is farther from the harmonic than other acoustic filters of the multiplexer.

Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.

Abstract: Mobile devices with dual conversion of multiple frequency bands using a shared intermediate frequency are provided. In certain embodiments, a mobile device includes a frequency range two (FR2) front end system configured to upconvert a first intermediate frequency (IF) transmit signal to generate a first radio frequency (RF) transmit signal of a first frequency band in FR2 of 5G, and to upconvert a second IF transmit signal to generate a second RF transmit signal of a second frequency band in FR2. The mobile device further includes a transceiver configured to generate the first IF transmit signal and the second IF transmit signal on a common intermediate frequency.

Abstract: Filter modules having a wider passband are provided herein. In certain embodiments, the filter module comprises an input node; an output node; a filter disposed along a signal path extending from the input node to the output node; a strip line configured to generate an inductance between the filter and a ground such to increase a bandwidth of a passband of the filter module, the single strip line disposed on multiple layers, each of the multiple layers defined by a plurality of pulse-shaped) portions of the strip line disposed on a plane.

Abstract: The disclosed technology generally relates dielectric materials and methods of forming the same, and more particularly to a combination of co-fireable dielectric materials that can be attached to each other without the use of adhesives. In an aspect, a composite article comprises a magnetic portion comprising a nickel zinc ferrite. The composite article additionally comprises a non-magnetic portion contacting the magnetic portion, the non-magnetic portion comprising a spinel-structured oxide comprising Mg2-xAl2xTi1-xO4 and having a dielectric constant between about 7 and 14, wherein 0<x?1.