Abstract: A switching circuit comprises a first filter, a second filter and a plurality of switches. The first filter is configured to filter a first frequency band, a second frequency band that is adjacent to the first frequency band and a gap band between the first frequency band and the second frequency band. The second filter is configured to filter the second frequency band. The plurality of switches is configured to route signals from an antenna through one of the first filter and second filter.

Abstract: An acoustic wave element is disclosed. The acoustic wave element can include a piezoelectric layer that includes aluminum nitride. The acoustic wave element can also include a diamond like carbon layer. The acoustic wave element can further include an interdigital transducer electrode that is positioned on the piezoelectric layer. The piezoelectric layer is positioned between the interdigital transducer electrode and the diamond like carbon layer. The acoustic wave element is configured to generate a Lamb wave having a wavelength of ?.

Abstract: A switch assembly for a radio frequency signal and corresponding radio frequency module and wireless device is disclosed. An example switch assembly comprises a first node coupled to an input of the switch assembly, a second node coupled to an output of the switch assembly, a first control node, and a common node; a first switch having a first plurality of transistors coupled between the first and second nodes, each transistor of the first plurality of transistors having a gate, a drain, and a source, each gate of the first plurality of transistors being coupled to the common node; a common resistor coupled between the first control node and the common node; and a second switch coupled between the first control node and the common node in parallel to the common resistor, the second switch configured to selectively bypass the common resistor.

Abstract: Distributed radio frequency (RF) communication systems for automotive are disclosed herein. In certain embodiments, an RF communication system for an automobile includes an RF module located close to an antenna to satisfy a specified output power with small insertion loss. Additionally, the baseband processor is placed remotely from the RF module in a different area of the automobile to provide a lower temperature environment. Additionally, the RF module communicates with the baseband processor in a digital format eliminating the need for higher cost cabling (for instance, due to higher noise immunity arising from using digital signaling) and using digital transfer cabling, which can already be present in the automobile for other purposes. The RF module can include an RF front-end (RFFE) and a transceiver used for providing frequency conversion, for instance, between RF and baseband.

Abstract: Apparatus and methods for beamforming communication systems with sensor aided beam management are provided. In certain embodiments, a beamforming communication system includes an antenna array including a plurality of antenna elements. The beamforming communication system further includes a plurality of signal conditioning circuits operatively associated with the antenna elements, one or more sensors that generate sensor data, and a beam management circuit that controls the signal conditioning circuits to manage beamforming. The beam management circuit provides beam management based on the sensor data.

Abstract: Devices and methods related to unpowered switching module. A switching module can include a first input terminal, a second input terminal, and an output terminal. The output terminal can be configured to output a radio-frequency (RF) component of an input signal received on the first input terminal or the second input terminal in response to the input signal including a positive direct-current (DC) voltage.

Abstract: A gate driver includes a variable strength driver circuit that provides an output signal to drive a high power device. The gate driver receives an update request from a host controller during an operating mode in which switching operations occur and updates one or more operating parameters associated with driving the high power device. The operating parameters including turn-on parameters, turn-off parameters, and soft shutdown parameters. The variable strength driver circuit uses the turn-on parameters for turn-on phases for the output signal, uses the turn-off parameters for turn-off phases for the output signal, and uses the soft shutdown parameters for soft shutdown phases for the output signal. The update request adjusts current, voltage, and/or time for one or more phases of the turn-on, turn-off and/or soft shutdown parameters.

Abstract: A front-end module may include an acoustic wave filter with a first and second interdigital transducer electrode, and a low noise amplifier (LNA) that converts a differential input to a single-ended output with respect to ground. The first interdigital transducer electrode may be single-ended with a first input bus bar configured to receive an input signal and a second input bus bar connected to ground. The second interdigital transducer electrode may be differential with a first output bus bar connected to a first output terminal and a second output bus bar connected to a second output terminal. The LNA may have a differential input connected to the acoustic wave filter, a first input transistor that receives a first signal from the first output terminal of the acoustic wave filter, and a second input transistor that receives a second signal from the second output terminal of the acoustic wave filter.

Abstract: Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.

Abstract: Power amplifiers with adaptive bias for envelope tracking applications are provided herein. In certain embodiments, an envelope tracking system includes a power amplifier that amplifies a radio frequency (RF) signal and that receives power from a power amplifier supply voltage, and an envelope tracker that controls a voltage level of the power amplifier supply voltage based on an envelope of the RF signal. The power amplifier includes a current mirror having an input that receives a reference current, an output electrically connected to the power amplifier supply voltage, and a node that outputs a gate bias voltage. The power amplifier further includes a field-effect transistor that amplifies the radio frequency signal and a first depletion-mode transistor having a gate connected to the node of the current mirror and a source connected to a gate of the field-effect transistor.

Abstract: An acoustic wave filter component can include an acoustic wave device including a multi-layer piezoelectric substrate. The multi-layer piezoelectric substrate can include at least a support substrate and a piezoelectric layer. The acoustic wave device can include an interdigital transducer electrode on the piezoelectric layer. An additional layer can be located over the interdigital transducer electrode. The acoustic wave filter component can also include a bulk acoustic wave resonator supported by the additional layer. The acoustic wave device can be a boundary wave resonator, and one or more boundary wave resonators may be provided in a stacked arrangement, with the bulk acoustic wave resonator in the top layer of the stacked arrangement. The acoustic wave device can also be a temperature-compensated surface acoustic wave device.

Abstract: Antenna arrays with separate resonances and termination networks for multiple millimeter wave frequency bands are provided herein. In certain embodiments, an antenna array includes a first antenna element that receives the first radio frequency transmit signal at an input. The first antenna element has a first resonant mode and a second resonant mode. The antenna array further includes a first termination network connected to the input of the first antenna element and a second termination network connected to the input of the first antenna element.

Abstract: Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed.

Abstract: Multi-level envelope tracking systems are provided. In certain embodiments, an envelope tracking system includes a first power amplifier that amplifies a first radio frequency (RF) signal and receives power from a first power amplifier supply voltage, a second power amplifier that amplifies a second RF signal and receives power from a second power amplifier supply voltage, and an envelope tracker including a first modulator that controls the first power amplifier supply voltage based on a plurality of regulated voltages and a first envelope signal corresponding to an envelope of the first RF signal, a second modulator that controls the second power amplifier supply voltage based on the regulated voltages and a second envelope signal corresponding to an envelope of the second RF signal, and a switching point adaptation circuit that controls a voltage level of at least one of the regulated voltages based on a radio frequency power level.

Abstract: Power amplifier systems with non-linear antenna impedance for load compensation are provided. In certain embodiments, a method of power amplification in a mobile device is provided. The method includes generating a radio frequency input signal using a transceiver, amplifying the radio frequency input signal to generate a radio frequency output signal using a power amplifier, and transmitting the radio frequency output signal using an antenna, including compensating the power amplifier for a change in output load in response to a change in signal power using a non-linear impedance versus output power characteristic of the antenna.

Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.

Abstract: Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.

Abstract: Reconfigurable antenna systems integrated with a metal case are provided herein. In certain embodiments, user equipment (UE) for a cellular network includes a metal case and an antenna system for transmitting and/or receiving wireless signals. The antenna system includes a tuning conductor formed in the metal case, a patch antenna element that is spaced apart from the tuning conductor, and a switch electrically connected in series between the tuning conductor and a ground voltage. The switch electrically connects the tuning conductor to the ground voltage in an on state and electrically disconnects the tuning conductor from the ground voltage in an off state.

Abstract: A radio frequency signal coupler includes an input port, an output port, a main transmission line coupled between the input port and the output port, and a coupled transmission line electromagnetically coupled to the main transmission line. The coupled transmission line includes a first transmission line, a second transmission line, and a switch configured to couple the first and second transmission lines during a first mode of operation and to decouple the first and second transmission lines during a second mode of operation. The radio frequency couple can be used in a front end module of a communications device, such as a mobile phone.

Abstract: Antenna arrays with multiple feeds and varying pitch are disclosed. In certain embodiments, a radio frequency (RF) module includes a module substrate, a semiconductor die attached to the module substrate, and an antenna array attached to the module substrate. The semiconductor die includes a plurality of power amplifiers configured to amplify a corresponding plurality of RF signals to generate a plurality of amplified RF signals. The antenna array is configured to receive the plurality of amplified RF signals from the plurality of power amplifiers, and includes a plurality of antenna elements arranged with a varying pitch. Each of the plurality of antenna elements includes two or more signal feeds.