Patents Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION
  • Publication number: 20210112213
    Abstract: The present disclosure relates to an imaging apparatus and an imaging method, a camera module, and an electronic apparatus that are capable of detecting a failure in an imaging device having a structure in which a plurality of substrates are stacked. The timing at which a row drive unit provided in a second substrate outputs a control signal for controlling accumulation and reading of pixel signals in a pixel array provided in a first substrate is compared with the timing at which the control signal output from the row drive unit is detected after passing through the pixel array. Depending on whether or not the timings coincides with each other, a failure is detected. The present disclosure can be applied to an imaging apparatus mounted on a vehicle.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Takumi Oka, Atsushi Suzuki, Naoki Kawazu
  • Publication number: 20210111213
    Abstract: An imaging device including: pixel area and a peripheral area that lies outside the pixel area; light receiving element provided in the pixel area; circuit board provided in the pixel area and the peripheral area, the circuit board including a semiconductor substrate and a multilayer wiring layer, the multilayer wiring layer being provided between the semiconductor substrate and the light receiving element; first wiring line provided in the multilayer wiring layer, the first wiring line being electrically coupled to the light receiving element; a protective member that is opposed to the circuit board, the protective member and the circuit board sandwiching the light receiving element; and an extended wiring section provided between the semiconductor substrate and the protective member in the peripheral area, one end of the extended wiring section being open and another end of the extended wiring section being electrically coupled to the first wiring line.
    Type: Application
    Filed: February 8, 2019
    Publication date: April 15, 2021
    Applicant: Sony SemiConductor Solutions Corporation
    Inventor: Susumu OOKI
  • Patent number: 10978506
    Abstract: A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels includes: a plurality of photoelectric conversion portions; a plurality of transfer gates, each of which is disposed in each of the photoelectric conversion portions to transfer signal charges from the photoelectric conversion portion; and a floating diffusion to which the signal charges are transferred from the plurality of the photoelectric conversion portions by the plurality of the transfer gates, wherein the plurality of the photoelectric conversion portions receive light of the same color to generate the signal charges, and wherein the signal charges transferred from the plurality of the photoelectric conversion portions to the floating diffusion are added to be output as an electrical signal.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: April 13, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Hiroaki Ishiwata
  • Patent number: 10978514
    Abstract: A solid-state imaging device includes: a plurality of pixels each including a first electrode, an organic photoelectric conversion film, and a second electrode in this order on a substrate, the organic photoelectric conversion film including a first inclined surface on a side wall; and a first sealing film formed, on the plurality of pixels, to cover the side wall of the organic photoelectric conversion film and the second electrode.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: April 13, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Masahiro Joei
  • Publication number: 20210104572
    Abstract: There is provided a solid-state imaging device including first, second, and third substrates stacked in this order. The first substrate includes a first semiconductor substrate and a first wiring layer. A pixel unit is formed on the first semiconductor substrate. The second substrate includes a second semiconductor substrate and a second wiring layer. The third substrate includes a third semiconductor substrate and a third wiring layer. A first coupling structure couples two of the first, second, and third substrates to each other includes a via. The via has a structure in which electrically-conductive materials are embedded in one through hole and another through hole, or a structure in which films including electrically-conductive materials are formed on inner walls of the through holes. The one through hole exposes a first wiring line in one of the wiring layers. The other through hole exposes a second wiring line in another wiring layer.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 8, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takatoshi KAMESHIMA, Hideto HASHIGUCHI, Ikue MITSUHASHI, Hiroshi HORIKOSHI, Reijiroh SHOHJI, Minoru ISHIDA, Tadashi IIJIMA, Masaki HANEDA
  • Publication number: 20210104571
    Abstract: There is provided a solid-state imaging device including: a first substrate including a first semiconductor substrate and a first wiring layer, the first semiconductor substrate having a pixel unit with pixels; a second substrate including a second semiconductor substrate and a second wiring layer, the second semiconductor substrate having a circuit with a predetermined function; and a third substrate including a third semiconductor substrate and a third wiring layer, the third semiconductor substrate having a circuit with a predetermined function, the first, second, and third substrates being stacked in this order, the first substrate and the second substrate being bonded together with the first wiring layer and the second wiring layer opposed to each other, a first coupling structure on bonding surfaces of the first substrate and the second substrate, and including an electrode junction structure with electrodes formed on the respective bonding surfaces in direct contact with each other.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 8, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Reijiroh SHOHJI, Masaki HANEDA, Hiroshi HORIKOSHI, Minoru ISHIDA, Takatoshi KAMESHIMA, Ikue MITSUHASHI, Hideto HASHIGUCHI, Tadashi IIJIMA
  • Publication number: 20210104564
    Abstract: A photoelectric converter According to an embodiment of the present disclosure includes: an organic photoelectric conversion section; an inorganic photoelectric conversion section; and an optical filter. The organic photoelectric conversion section includes a first electrode, a second electrode, and an organic photoelectric conversion layer. The first electrode includes one electrode and another electrode. The second electrode is disposed to be opposed to the first electrode. The organic photoelectric conversion layer is disposed between the first electrode and the second electrode and is electrically coupled to the one electrode. The organic photoelectric conversion layer and the other electrode are provided with an insulation layer therebetween. The inorganic photoelectric conversion section has the first electrode disposed between the inorganic photoelectric conversion section and the organic photoelectric conversion section.
    Type: Application
    Filed: December 10, 2018
    Publication date: April 8, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Nobuhiro KAWAI, Hirokazu SHIBUTA
  • Patent number: 10971412
    Abstract: A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a plurality of light-emitting elements (12) arranged in a matrix on the wiring substrate; and a plurality of drive ICs (13) that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines (16) on a mounting surface whre the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: April 6, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Akiyoshi Aoyagi, Ken Kikuchi, Katsuhiro Tomoda
  • Patent number: 10971193
    Abstract: Provided is a base unit including a base unit chassis that supports a spindle motor, a heat dissipation member that dissipates heat generated from a stator of the spindle motor to a non-disk mounting side of the base unit chassis, and a bearing housing that suppresses heat transfer from a stator core to a bearing of the spindle motor.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 6, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Takeshi Kaneko
  • Patent number: 10972057
    Abstract: This technology relates to a single-phase differential conversion circuit for improving the linearity of input/output characteristics, a signal processing method for use with the circuit, and a reception apparatus. The single-phase differential conversion circuit includes a first source-grounded amplifier and a second source-grounded amplifier. Each of the amplifiers includes a transconductance amplifier section including a transistor for converting an AC component of input potential to a current, a diode load section including a transistor in a diode connection configured as a first load, and a large-signal distortion compensation circuit configured as a second load connected in parallel with the first load. The transistors of the first source-grounded amplifier are each a P-type MOS transistor, and the transistors of the second source-grounded amplifier are each an N-type MOS transistor. This technology is applied advantageously to a reception apparatus for receiving TV signals, for example.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: April 6, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Naoto Yoshikawa
  • Patent number: 10971197
    Abstract: To provide a control circuit capable of reliably generating a reference potential while suppressing increase in power consumption and cost. Provided is a control circuit that performs control to separate from a sense amplifier a second reference element set to a predetermined resistance state, which is different from a first reference element set to a predetermined resistance state and connected to the sense amplifier in generating a reference potential used for data read through the sense amplifier from a memory cell.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: April 6, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Hiroyuki Tezuka
  • Publication number: 20210099622
    Abstract: A camera lens attaching portion 30 is fitted into an opening provided in a vehicle window 20. A lens of a camera 40 is attached to a lens attaching surface 31a of the camera lens attaching portion 30. A surface opposed to the lens attaching surface 31a is a window surface 31b. The window surface 31b is an inclined surface different from a window surface 22 of the vehicle window 20. Furthermore, the window surface 31b may be an inclined surface same as the window surface 22 of the vehicle window 20. The camera 40 images outside of the vehicle through the camera lens attaching portion 30 with an angle of view set within the window surface 31b of the camera lens attaching portion 30. It is possible to prevent reflection of a reflected image generated on a vehicle inner side of the vehicle window.
    Type: Application
    Filed: December 18, 2018
    Publication date: April 1, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventor: Hiroshi Ichiki
  • Patent number: 10962645
    Abstract: The present disclosure relates to a reception apparatus, a reception method, a transmission apparatus, a transmission method, and a communication system capable of identifying ID information from an image captured with gated imaging. A reception apparatus of a first aspect of the present disclosure includes: a gated imaging unit that emits pulsed light to a subject existing at any given distance, and performs gated imaging by receiving reflection light of the pulsed light from the subject by controlling exposure timing on the basis of a time it takes for the emitted pulsed light to reciprocate the any given distance; and an identification unit that identifies ID information transmitted as an optical signal by a transmission apparatus existing in an imaging direction of the gated imaging on the basis of a plurality of time-series images obtained by cyclic gated imaging with the gated imaging unit.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: March 30, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Mitsuharu Ohki
  • Patent number: 10965893
    Abstract: The present technology relates to a solid-state imaging device that can improve imaging quality by reducing variation in the voltage of a charge retention unit, a method of driving the solid-state imaging device, and an electronic apparatus. A first photoelectric conversion unit generates and accumulates signal charge by receiving light that has entered a pixel, and photoelectrically converting the light. A first charge retention unit retains the generated signal charge. A first output transistor outputs the signal charge in the first charge retention unit as a pixel signal, when the pixel is selected by the first select transistor. A first voltage control transistor controls the voltage of the output end of the first output transistor. The present technology can be applied to pixels in solid-state imaging devices, for example.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: March 30, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Fumihiko Koga
  • Patent number: 10964045
    Abstract: It is desired to provide technology that enables automatic measurement of the size of a subject with a reduced number of frames of images required, relaxed restrictions on the coverage and light projection, and no limitation on the shape of the subject. Provided is an information processing device including: a depth information acquiring unit configured to acquire depth information; a data conversion unit configured to convert the depth information into three-dimensional data; a subject extraction unit configured to extract a subject area where a subject is present on the basis of the three-dimensional data; and a size measurement unit configured to measure a size of the subject on the basis of the subject area, in which the size measurement unit detects six planes circumscribing the subject area and measures the size of the subject on the basis of the six planes.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: March 30, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroaki Ono, Tomonori Masuno, Shun Li
  • Patent number: 10962747
    Abstract: The maximum principal ray incident angle to an image surface is reduced in an image pickup device provided with an image pickup element. The image pickup device includes an image pickup lens, the image pickup element, and a cover glass. In the image pickup device, the cover glass is stuck on the image pickup element without containing air between them. In addition, in the image pickup device, the maximum incident angle of principal rays from the image pickup lens, to the cover glass is larger than 35 degrees. Furthermore, in the image pickup device, the refractive angle of the cover glass is at least 5 degrees smaller than the maximum incident angle.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: March 30, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Tomohiko Baba
  • Patent number: 10964366
    Abstract: There is provided a magnetic memory that can suppress the increase in manufacturing costs while recording multivalued information in one memory cell, the memory including first and second tunnel junction elements each having a laminated structure including a reference layer with a fixed magnetization direction, a recording layer with a reversible magnetization direction, and an insulating layer sandwiched between the reference layer and the recording layer, a first selection transistor electrically connected to first ends of the first and second tunnel junction elements, a first wire electrically connected to a second end of the first tunnel junction element, and a second wire electrically connected to a second end of the second tunnel junction element.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: March 30, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroyuki Ohmori, Masanori Hosomi, Yutaka Higo, Hiroyuki Uchida, Naoki Hase, Yo Sato
  • Patent number: 10965022
    Abstract: [Object] To provide a high-frequency module and a communication device, each of which includes a non-directional antenna and is suitable for transmission/reception of a radio wave in a high frequency band. [Solution] A high-frequency module including: an antenna portion provided to project from a board; an antenna element at least a part of which is provided on the antenna portion; a transmission line formed on a same surface as the antenna element and including a same material as the antenna element; and a high-frequency element mounted on a surface of the board on which the transmission line is formed.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: March 30, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masahiro Sato, Takashi Kawamura
  • Patent number: 10964604
    Abstract: To provide a magnetic storage element, a magnetic storage device, and an electronic device which store multi-value information with a simpler structure.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: March 30, 2021
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroyuki Uchida, Masanori Hosomi, Hiroyuki Ohmori, Kazuhiro Bessho, Yutaka Higo, Yo Sato, Naoki Hase
  • Patent number: 10964737
    Abstract: A photoelectric conversion device includes: a light absorption layer that has a light entrance surface and a compound semiconductor material; a first electrode provided for each of the pixels, in opposed relation to an opposite surface to the light entrance surface; a first semiconductor layer of a first conductive type, with a bandgap energy larger than bandgap energy of the light absorption layer and that is provided between the light absorption layer and the first electrode; a second semiconductor layer of a second conductive type, with a bandgap energy larger than the bandgap energy of the light absorption layer and that is provided between the first semiconductor layer and the light absorption layer; and a first diffusion region of the second conductive type, in which the first diffusion region is provided between adjacent ones of the pixels and across the second semiconductor layer and the light absorption layer.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: March 30, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Hideki Minari, Shunsuke Maruyama