Abstract: The present technology relates to a solid-state imaging element, a solid-state imaging element package, and electronic equipment that can suppress occurrence of flares. The solid-state imaging element includes an effective pixel region and a peripheral circuit region. The effective pixel region includes a plurality of pixels arranged two-dimensionally in a matrix pattern. The peripheral circuit region is provided around the effective pixel region. The effective pixel region has a pixel-to-pixel light-shielding film formed at boundary portions between the pixels. In a region on a substrate where a rib structure is formed within the peripheral circuit region, no light-shielding film is formed in the same layer as the pixel-to-pixel light-shielding film. The present technology is applicable, for example, to a solid-state imaging element package including a cover glass that protects a light-receiving surface of the solid-state imaging element.

Abstract: An electrode structure includes: a plurality of pixel electrodes arranged separately from each other; and a plurality of dielectric layers laminated in a first direction with respect to the plurality of pixel electrodes, in which the plurality of dielectric layers includes: a first dielectric layer that spreads over the plurality of pixel electrodes in a direction intersecting with the first direction; and a second dielectric layer that includes dielectric material having a refractive index higher than that of the first dielectric layer, sandwiches the first dielectric layer together with the plurality of pixel electrodes, and has a slit at a position overlapping space between pixel electrodes adjacent when viewed from the first direction.

Abstract: A communication device includes a communication unit configured to transmit a serial signal group conforming to a serial peripheral interface (SPI) and transmitted from a master in synchronization with a clock to a communication partner device as a batch of data blocks within one frame period of a predetermined communication protocol, or transmit the serial signal group to the communication partner device as a plurality of data blocks divided according to a plurality of frame periods.

Abstract: Solid-state imaging elements are disclosed. In one example, an upstream circuit block generates a predetermined reset level and a plurality of signal levels each corresponding to an exposure amount, and causes capacitive elements, different from each other, to hold them. A selection circuit sequentially performs control to connect the capacitive element in which the reset level is held to a predetermined downstream node, control to disconnect capacitive elements from the downstream node, and control to connect the capacitive element in which any of the plurality of signal levels is held to the downstream node. A downstream reset transistor initializes a level of the downstream node when the capacitive elements are disconnected from the downstream node. A downstream circuit sequentially reads the reset level and the plurality of signal levels via the downstream node.

Abstract: A signal processing device includes an approximate curved surface conversion unit that includes a first stacked autoencoder pretrained on the basis of learning input data constituted by coordinate data acquired for each of multiple elements of an object, and that obtains approximate curved surface data indicating an approximate curved surface of the object in an intermediate layer of the first stacked autoencoder, on the basis of input data constituted by the coordinate data acquired for each of the elements, and a geometric modulation processing unit that includes a second stacked autoencoder having learned by machine learning on the basis of learning input data constituted by the approximate curved surface data and on the basis of training data constituted by a result obtained by coordinate conversion for each of the elements in a geometric modulation process performed for the object, and performs the geometric modulation process.

Abstract: A receiving apparatus includes a packet type determination unit that determines whether or not a TLV packet includes a compressed IP packet, a context information determination unit that determines a context identifier and a context identification header type of the TLV packet determined to include the compressed IP packet, a CID-header storage unit that stores a source IP address assigned to the context identifier, a fixed header information storage unit that stores fixed header information in conformance with an operation specification of a broadcast wave, and a header restoring unit that generates a restored IP packet by decompressing the compressed data in accordance with the TLV packet determined to include the compressed IP packet, the source IP address acquired from the CID-header information storage unit on the basis of the context identifier, and the fixed header information acquired from the fixed header information storage unit.

Abstract: To achieve higher self-resonant frequency and lower parasitic resistance of a variable capacitance circuit whose capacitance value is changeable. The variable capacitance circuit includes a capacitor unit, a reactive element, and a bias circuit. The capacitor unit inside the variable capacitance circuit includes plural semiconductor elements connected in series, the plural semiconductor elements each having a capacitance value based on a bias voltage applied thereto. Further, the reactive element inside the variable capacitance circuit is connected to the capacitor unit. The bias circuit inside the variable capacitance circuit applies a bias voltage to each of the plural semiconductor elements.

Abstract: An abnormality of output laser light is detected for enhancement in safety. A light-source drive device includes a light-source control unit, a light-receiving unit, and an abnormality detection unit. The light-source control unit included in the light-source drive device controls light emission of a light source. The light-receiving unit included in the light-source drive device receives light from the light source through an output part allowing outward output of light of the light source. The abnormality detection unit included in the light-source drive device detects an abnormality of the light output from the output part, on the basis of the received light.

Abstract: An imaging device including: a first semiconductor substrate; a second semiconductor substrate; and a wiring layer. The first semiconductor substrate has a first surface and a second surface and includes a sensor pixel. The second semiconductor substrate has a third surface and a fourth surface and includes a readout circuit that outputs a pixel signal based on an output from the sensor pixel. The second semiconductor substrate is stacked on the first semiconductor substrate with the first surface and the fourth surface opposed to each other. The wiring layer is between the first semiconductor substrate and the second semiconductor substrate and includes a first wiring line and a second wiring line that are electrically coupled to each other. One of the first wiring line and the second wiring line is in an electrically floating state while the other is electrically coupled to a transistor.

Abstract: An electronic device comprising circuitry, the circuitry comprising a mix driver (MVD) for providing a modulation In signal to pixels of a time of flight pixel chip (P500), and at least one Save and Share current circuitry (51, S2) connected to the mix driver (MVD), wherein the Save and Share circuitry (S1, S2) is configured to save charge provided by a power supply (VDD) in a capacitor (CS1, CS2) and to share the saved charge to the pixels of the time of flight pixel chip (P500). A logic chip (L500) comprises an input (l_in) and a buffer block (CLT500), where a modulation signal (GDA) is supplied to the input (1_in) and is delivered to the pixel chip (P500) via the buffer block (CLT500). Capacitors (CS1, CS2) help the mix driver (MVD) with the charging and discharging, respectively, of the pixel units in the pixel chip (P500). Frequencies used for the modulation signal (GDA) may be in the range of several tens of MHz to several hundreds of MHz.

Abstract: A solid-state imaging device with high versatility having a cavity-less CSP structure capable of reducing the occurrence of flare and also being applied to chip size reduction, a method for manufacturing a cover glass, and an electronic apparatus. A solid-state imaging device includes: a sensor substrate in which a plurality of pixels is arranged; a semiconductor substrate having an upper surface on which the sensor substrate is mounted, the semiconductor substrate being configured to connect an electric signal converted by the pixel to a bump or an external connection terminal disposed on a lower surface; a microlens array disposed on an upper surface of the sensor substrate; a resin disposed on an upper surface of the microlens array; and a cover glass bonded to the microlens array via the resin and having a moth-eye structure on a surface of the cover glass.

Abstract: A light emitting device includes a substrate and a light emitting body. The light emitting body includes a plurality of light emitting elements and an insulating body in which the plurality of light emitting elements is embedded except for a light emitting surface of the plurality of light emitting elements. The plurality of light emitting elements is formed from a singulated compound semiconductor layer and is arranged in a row direction and a column direction. The substrate includes a drive circuit, a first terminal, and a second terminal and is joined to the light emitting body. The drive circuit drives the plurality of light emitting elements. The first terminal and the second terminal electrically couple the drive circuit and the plurality of light emitting elements to each other.

Abstract: A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.

Abstract: An imaging device of an embodiment of the disclosure includes: a semiconductor substrate in which multiple sensor pixels are arranged in array, the semiconductor substrate having a first surface serving as a light incident surface and a second surface opposed thereto; a photoelectric conversion section provided on a side of the first surface inside the semiconductor substrate and generating electric charge corresponding to a light reception amount by photoelectric conversion; a charge-holding section provided on a side of the second surface inside the semiconductor substrate and holding the electric charge transferred from the photoelectric conversion section; a first light-blocking section extending in an in-plane direction of the semiconductor substrate between the photoelectric conversion section and the charge-holding section; and a light-condensing optical system provided on the side of the first surface and condensing incident light on a substantial geometric center of the first light-blocking section i

Abstract: A solid-state imaging element having an array of light receiving pixels is disclosed. A light receiving pixel includes a pair of photoelectric conversion units, a first separation region, and a second separation region. The pair of photoelectric conversion units is disposed adjacent to each other and has a shared floating diffusion (FD). The first separation region surrounds the pair of photoelectric conversion units. The second separation region is disposed between the pair of photoelectric conversion units. The first separation region has a rectangular shape in plan view and extends from a surface on the opposite side to a light incident surface of the semiconductor layer toward the light incident surface. The second separation region is disposed along a diagonal line of the first separation region extends from the surface on the opposite side to the light incident surface of the semiconductor layer toward the light incident surface.

Abstract: A pixel substrate includes a photoelectric conversion element. The photoelectric conversion element includes a doped region and a substrate region. The doped region and the substrate region form a pn junction. A pixel circuit is electrically connected to a first supply line and the photoelectric conversion element. A protection circuit is configured to short-circuit the first supply line and the substrate region when a voltage difference between the first supply line and the substrate region falls below a negative threshold voltage.

Abstract: The present disclosure generally pertains to time-of-flight data generation circuitry, configured to: acquire a time-of-flight (ToF) data stream using a ToF camera; acquire a brightness change event data stream using an event-based vision sensor (EVS), camera; correlate the time-of-flight data stream with the brightness change event data stream in time with each other for generating at least one time-of-flight data frame; and generate the at least one time-of-flight data frame based on the correlation.

Abstract: A light receiving element and a ranging system is provided which achieve improvement of pixel characteristics while allowing variation in a breakdown voltage of an SPAD. The light receiving element includes a pixel array in which a plurality of pixels is arranged in a matrix, and a pixel driving unit configured to control respective pixels of the pixel array to be active pixels or non-active pixels. The pixel includes an SPAD, a transistor connected to the SPAD in series, an inverter configured to output a detection signal indicating incidence of a photon on the SPAD, a first transistor which is switched on or off in accordance with control of the pixels to be the active pixels or the non-active pixels, and a second transistor connected to the first transistor in series.

Abstract: The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.

Abstract: Provided is an information processing apparatus that creates map information on the basis of sensor information obtained by an on-vehicle sensor. The information processing apparatus includes a creation section that creates a map of a surrounding area of a mobile body on the basis of sensor information acquired by one or more sensors mounted on the mobile body, a request section that issues an information request to an external apparatus on the basis of a state of the map created by the creation section, and a merge section that merges information acquired by the request section from the external apparatus with the created map. The request section issues an information request to the external apparatus on the basis of a condition of a dead angle included in the map created by the creation section.