Abstract: A wafer carrier for polishing or planarizing semiconductor workpieces or wafers includes a pressure plate, an upper housing, and a lower housing. The pressure plate is configured to hold a wafer to be polished or planarized against a polishing pad, and further configured to rotate about the lower housing of the wafer carrier to rotate the wafer during the polishing or planarizing process. The wafer carrier includes an electric direct drive motor, with the stators of the motor disposed in the lower housing and the rotors of the motor disposed in the pressure plate, to rotate the pressure plate about the lower housing. Accordingly, when electric power is supplied to the stators of the direct drive motor, in response to the magnetic flux generated by the stators, the rotors of the motor rotate the pressure plate.

Abstract: Components of chemical, mechanical, polishing apparatus with components resistant to chemical attack by chemical slurries used in the polishing of semiconductor wafers. Among the components that are improved to enhance resistance to chemical attack are the polishing platen, pad conditioning end effectors, various subassemblies, housings for instrumentation, carrier rinse station surfaces, and other components that come into contact with a slurry. The coating compositions are preferably tightly adherent to the underlying substrate, and may be applied by a wide range of techniques. Especially useful are coatings such as tungsten carbide, tungsten nitride, amorphous diamond like carbon, and other such inert wear resistant coatings.

Abstract: A tilt mechanism for periodically tilting a cassette configured to hold a plurality of wafers or workpieces such that the wafers or workpieces become gravity-loaded against a rear portion of the cassette. The tilt mechanism is mounted entirely above a worktable of a CMP or other processing machine and comprises a housing which houses a circular cam having a spiral groove formed therein. A tilt arm is pivotally mounted to the housing and extends vertically between a lower end which is adjacent the cam and an upper end which is fixed to a platform supporting a cassette holding a plurality of workpieces. A cam follower is attached to the lower end of the arm and projects into the groove. Rotary motion of the cam effects pivotal movement of the tilt arm which, in turn, effects tilting of the support platform and the cassette.

Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.

Abstract: A set of supports are advantageously disposed on a top plate having a polishing surface useful for polishing workpieces, thereby applying substantially uniform pressure to the top plate. In a preferred embodiment, the supports are non-isosceles triangular elements distributed evenly at 45 degree increments around a ring-shaped top plate. This structure effectively compensates for radial stress variations arising from non-optimum positioning of support points with respect to the inner and outer diameters of the polishing surface.

Abstract: A polishing apparatus for semiconductor wafers includes an index table with multiple wafer positions, with different surface treatment arrangements for each position. With each index motion of the table, the table is sequentially loaded and unloaded while wafers carried at the remaining stations of the index table are moved for a subsequent surface treatment step. Progress of the surface treatment at each position is monitored and, optionally, subsequent surface treatment steps may be modified to achieve a desired final condition of the substrate being processed.

Abstract: Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated and hydrogen enriched by passing the aqueous rinse solution and a treatment fluid through an osmotic membrane degasifier. In the preferred embodiment, only a single component, forming gas, is employed to provide both functions of oxygen removal and hydrogen injection.

Abstract: A wafer carrier includes a porous media layer through which a pressurized fluid is injected. The porous media layer introduces lateral dispersion into the pressurized flow, thereby assuring a uniform pressure at the exit surface of the porous media layer, as when the porous media layer is located adjacent the wafer being polished. Alternatively, an inflatable bladder may be introduced between the porous media layer and the wafer, again with pressure being maintained uniform by the porous media layer.

Abstract: Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.

Abstract: The present invention provides an apparatus for cleaning semiconductor workpieces following a Chemical Mechanical Planarization ("CMP") procedure. Initially, a workpiece is scrubbed to remove some of the slurry material and other contaminants on the surfaces of the workpiece. Next, the workpiece is transported into a chemical-etch cleaning station wherein the workpiece is positioned horizontally such that both the upper and lower surfaces are substantially exposed. The workpiece then is immersed in a cleaning solution which is moved around the various surfaces of the workpiece. The workpiece is immersed in the cleaning solution for a sufficient length of time to remove an appropriate layer of oxide, thereby removing contaminants and smoothing micro scratches from the surfaces of the workpiece.

Abstract: The present invention provides methods and apparatus for optimizing the removal of thin film layers during planarization of a semiconductor wafer to achieve global uniformity of the entire semiconductor surface while further achieving the planarity within an individual die structure. A wafer polishing system suitably comprises a wafer polishing apparatus, a controller and a wafer polishing recipe. The wafer polishing recipe may be comprised of various operational parameters utilized for controlling the operation of the polishing apparatus.

Abstract: In a polishing machine for simultaneous double-sided polishing of workpieces between upper and lower polish tables, the upper polish table has a hollow center telescopically receiving in a drive hub supported from below. The upper polish plate is suspended by a lifting rod from a double-ended main lifting cylinder having upper and lower ends secured to a frame extending from the lower polish table.

Abstract: A wafer carrier for polishing or planarizing semiconductor workpieces or wafers includes a pressure plate configured to hold a wafer to be polished or to be planarized against a polishing pad, and is further configured to rotate the wafer during the polishing or planarizing process. A retaining ring for holding the wafer is mounted about the periphery of the pressure plate. The retaining ring slides vertically and independently relative to the pressure plate. A polishing pad load ring is also slideably mounted about the periphery of the retaining ring. The pad load ring is biased against the polishing pad, and slides vertically and independently of the pressure plate and the wafer retaining ring. In operation, the wafer carrier is moved across the polishing pad, which is sufficiently compliant to cause wave deformation of the surface of the pad.

Abstract: An apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-hole in a polish pad, a light source, a fiber optic cable, a light sensor, and a computer. A pad assembly includes the polish pad, a pad backer, and a pad backing plate. The pad backer includes a pinhole and a canal that holds the fiber optic cable. The pad backer holds the polish pad so that the through-hole is coincident with the pinhole opening. A wafer chuck holds a semiconductor wafer so that the surface to be polished is against the polish pad. The light source provides light within a predetermined bandwidth. The fiber optic cable propagates the light through the through-hole opening to illuminate the surface as the pad assembly orbits and the chuck rotates. The light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal.

Abstract: A carrier assembly includes an internal pressurized fluid circuit applying positioning forces to a ring extension. Also included is an internal diaphragm having a flexible portion providing gimbal action for the carrier assembly. The pressure between the diaphragm and a pressure plate changes the surface curvature of the pressure plate in a controlled manner. An automatic ring extension is also provided.

Abstract: In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

Abstract: An improved gear or pin cleaning assembly for polishing or grinding machines having a rotating plate is presented. One or more nozzle members are positioned within the rotating plate and a source of fluid, such as deionized water, is connected to the nozzle or nozzles to emit a pressurized stream of fluid which rinses off the gear assembly as the plate rotates. The rotating plate may contain a channel for delivering the fluid from the exterior or interior of the plate to the nozzle(s).

Abstract: A carrier for semiconductor wafers to be polished comprises a backing pad vulcanized to a pressure plate. The backing pad is formed of a rubber material such as neoprene, SBR or natural rubber. An adhesive film of a thermosetting, thermally reactive material forms an integral bond between the backing pad and pressure plate. The backing pad, adhesive film and pressure plate together comprise a nearly ideally elastic assembly. The exposed face of the backing pad is profiled to a desired profile without effecting crumbling of the rubber material.

Abstract: A ring extension is provided for use with a semiconductor wafer carrier. The ring extension has a radially inner surface, the lower portion of which contacts a peripheral edge of a wafer to confine the wafer during a polishing operation. A recess or groove is formed in the inner surface and a passageway extending through the ring extension provides pressure relief to prevent slurry build up.

Abstract: A polishing system and a method of control of the same enabling reliable transfer of the workpieces into and out of the system while maintaining the precision of polishing of the workpieces. Provision is made of a polishing apparatus 1, a first transfer apparatus 2, a second transfer apparatus 3, and a control apparatus 4. In the polishing apparatus 1, workpieces W held in m number of holding holes 14 formed in n number of carriers 14 are polished on their two surfaces by a lower platen 10 and an upper platen 19. The control apparatus 4 finds the revolution angle of the carriers 14 when the workpieces reach the desired thickness, makes the carriers revolve until the revolution angle of a whole multiple of 360.degree./n closest to the revolution angle found, and then makes the polishing apparatus 1 stop.