Abstract: The present disclosure relates to an electronic device comprising: at least one universal integrated circuit card or at least one secure element and at least one power supply circuit for said card or secure element, said power supply circuit being connected to at least a first power supply voltage source of the electronic device and comprising a voltage detector adapted to determine whether said first voltage source provides a first power supply voltage different from a reference voltage; and at least one near field communication module adapted to enter an active mode whenever said voltage detector determines that said first supply voltage is different from the reference voltage.

Abstract: The present disclosure relates to a method for powering an electronic device. The electronic device includes at least one universal integrated circuit card or at least one secure element; at least one power supply circuit for said card or secure element; and at least one near field communication module. When the near field communication module changes from a standby or inactive state to an active state, the following successive operations are performed: —the components and circuits of said electronic device are started; —programs of the electronic device and said secure card or element are started at the same time.

Abstract: A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.

Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

Abstract: In accordance with an embodiment, an electronic device includes: an interrupt controller having an input for receiving a controller clock signal, and an output, the interrupt controller configured to deliver an output interrupt signal on the output when the controller clock signal is active, and a control circuit comprising, an input interface for receiving at least one interrupt signal from at least one item of equipment external to the device, a clock input for receiving an external clock signal, and a first controller connected to the input interface and to the clock input, the first controller configured to automatically generate the controller clock signal from the external clock signal from when the at least one interrupt signal is asserted until a delivery of a corresponding output interrupt signal.

Abstract: An embodiment of the present disclosure relates to an electronic circuit including a first switch coupling a first node of the circuit to an input/output terminal of the circuit; a second switch coupling the first node to a second node of application of a fixed potential; and a high-pass filter having an input coupled to the terminal and an output coupled to a control terminal of the second switch.

Abstract: A support substrate has a mounting face and a connection face opposite to the mounting face. An electronic chip is mounted to the mounting face and a matrix of connectors is mounted to the connection face. The support substrate includes an interconnection structure formed by a pair of conductive interconnection tracks that electrically connect the electronic chip to the matrix of connectors and circulate differential signals. The two interconnection tracks of the pair of conductive interconnection tracks extend facing each other at different depths of the support substrate. An isolation structure in the support substrate laterally isolates the pair of conductive interconnection tracks. Isolation plates above and below the pair of conductive interconnection tracks provide further isolation.

Abstract: The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.

Abstract: An electronic circuit includes a switch coupled between an input terminal intended to receive a first voltage and an output terminal coupled to a decoupling capacitor and intended to also be coupled to a load. A comparison stage is configured to compare the first voltage and a second voltage that is present at the output terminal. A first adjustment stage is configured to limit a positive inrush current flowing between the input terminal and the output terminal and a second adjustment stage is configured to limit a negative inrush current flowing between the output terminal and the input terminal. A control circuit is configured to activate either the first adjustment stage or the second adjustment stage as a function of a result of the comparison.

Abstract: A package includes an upper level mounted to a lower level. The upper level includes a stack formed by insulating layers and conductive elements and includes a first conductive track of an antenna. A plastic element rests on the stack. A first cavity is defined in the plastic element. A second conductive track of the antenna is located on a wall of the plastic element (for example, in or adjacent to the first cavity). A second cavity is also defined in the plastic element surrounding the first cavity. A third conductive track of the antenna is located on a wall of the plastic element (for example, in the second cavity). A third cavity is delimited between the upper and lower levels and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna.

Abstract: A datum is written to a memory, by splitting a binary word, representative of the datum and an error correcting or detecting code, into a first part and a second part. The first part is written at a logical address in a first memory circuit. The second part is written at the logical address in a second memory circuit. The error correcting or detecting code is dependent on both the datum and the logical address.

Abstract: In an embodiment, an SMPS comprises a half-bridge, and a driver configured to drive the half-bridge based on a PWM signal. The SMPS further comprising a first circuit coupled between the output of the driver and a control terminal of a high-side transistor of the half-bridge, wherein the first circuit is configured to maintain the first transistor on when the PWM signal has a duty cycle that is substantially 100%.

Abstract: An optical package includes a substrate made of a first material having an upper surface and a lower surface. The substrate further includes at least one cavity opening onto an upper surface of the substrate. Electrical connection vias extend through the substrate. An electronic integrated circuit chip is mounted on the upper surface of the substrate in a position so as to cover the at least one cavity. The electronic integrated circuit chip includes an integrated optical sensor. Each cavity is filled with a second material having a thermal conductivity greater than the thermal conductivity of the first material. The electrical connection vias are arranged on either side of each cavity and between two cavities.

Abstract: The present disclosure relates to a method for controlling a device comprising an oscillation circuit, configured to provide a clock signal to a radio frequency circuit, and an antenna, in which the enabling of the passage of the signal from the circuit to the antenna is delayed with respect to an instant from which a power amplifier of the circuit is enabled.

Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.

Abstract: A device for controlling a first voltage with a second voltage includes a first terminal of application of the second voltage and a second terminal for supplying the first voltage. A comparator has a first input terminal connected to the first terminal and has a second input terminal receiving information representative of the first voltage. At least one first current source of programmable intensity is connected to the second input terminal of the comparator.

Abstract: The integrated circuit includes a first node intended to be biased at a first voltage, a second node intended to be biased at a second voltage and having a non-negligible capacitive coupling with the first node. A power supply management device comprises a voltage booster configured to boost a power supply voltage and comprising boost stages configured to generate intermediate voltages on intermediate nodes. A compatibility detection circuit is configured to detect compatibility between the second voltage and one of the intermediate voltages, and, if the second voltage is compatible with an intermediate voltage, to couple the at least one second node to the compatible intermediate node.

Abstract: A band-gap circuit for generating a bandgap reference signal includes a first bipolar transistor and a second bipolar transistor of a same type among PNP and NPN types. The first and second bipolar transistors are configured to generate a current varying proportionally with the temperature. A capacitor is connected between a base and an emitter of one or both of the first and second bipolar transistors.

Abstract: A method for controlling a signal envelope shape of modulation pulses in a driver of a wireless transmitter includes supplying a first voltage to the driver during a non-modulated state, supplying a second voltage configurable by a configurable modulation index value to the driver during a modulated state, switching between the non-modulated state and the modulated state comprising setting the modulation index value to configure the second voltage level at the same level as the first voltage and then switching between supplying the first voltage to the driver and supplying the second voltage to the driver, and filtering to a limited bandwidth the variations of the second voltage resulting from configuring the modulation index value.

Abstract: A first terminal receives a first DC voltage. A switch selectively couples the first terminal to a second terminal providing an output. A control circuit selectively actuates the switch in response to a comparison of the first DC voltage to a second DC voltage. A low-dropout (LDO) linear voltage regulator, connected between the first and third terminals, operates to provide the second DC voltage from the first DC voltage.