Abstract: A first terminal receives a first DC voltage. A switch selectively couples the first terminal to a second terminal providing an output. A control circuit selectively actuates the switch in response to a comparison of the first DC voltage to a second DC voltage. A low-dropout (LDO) linear voltage regulator, connected between the first and third terminals, operates to provide the second DC voltage from the first DC voltage.

Abstract: An H-bridge circuit includes a supply voltage node, a first pair of transistors and a second pair of transistors. First transistors in each pair have the current paths therethrough included in current flow lines between the supply node and, respectively, a first output node and a second output node. Second transistors in each pair have the current paths therethrough coupled to a third output node and a fourth output node, respectively. The first and third output nodes are mutually isolated from each other and the second and fourth output nodes are mutually isolated from each other. The H-bridge circuit is operable in a selected one of a first, second and third mode.

Abstract: A power supply system includes a voltage application source, and a switched mode power supply having an output coupled to the voltage application source through a first path and through a second path different from the first path. A first node is coupled to the output of the switched mode power supply, the switched mode power supply being configured to couple the first node to the voltage application source through the first path in a first operating mode and through the second path in a different second operating mode. A digital regulator is coupled to the first node. A digital circuit is coupled to an output of the digital regulator. An analog regulator is coupled to the first node and an analog circuit coupled to an output of the analog regulator.

Abstract: The system comprising a slave module and a master module. The master module comprises a master control module (CONTRM). The slave module comprises a determination module (DETER). The determination module (DETER) is configured to determine a value of a physical quantity of the slave module. The determination module (DETER) is configured to receive, from the master control module (CONTRM), a command to start counting and a command to end counting. The determination module (DETER) is configured to determine a number of oscillations, between reception of the command to start counting and reception of the command to end counting, of an oscillating signal of which a frequency depends on the value of the physical quantity.

Abstract: An electronic device includes a first layer with an antenna and a second metal layer that extends over the entire first layer. The second metal layer includes at least one laterally-closed cavity that is located vertically above the antenna. The cavity is filled, at least in part, by a resin material. A first plate supporting a second metal plate extends over the cavity with the second metal plate positioned vertically above the antenna. The first metal plate may be supported by a ledge within the cavity. Alternatively, the second metal plate is embedded in the resin filling the cavity, with the second metal plate positioned vertically above the antenna.

Abstract: A device for regulating a voltage of an electric current supplying an integrated circuit resting on a substrate. The integrated circuit comprises a ground terminal and a power supply terminal able to receive the electric current. The regulation device comprises a first cover covering the integrated circuit, a second cover covering the integrated circuit. The first cover is electrically connected to the power supply terminal of the integrated circuit. The second cover is electrically connected to the ground terminal of the integrated circuit. The first cover and the second cover are connected together by a capacitive connection.

Abstract: A datum is written to a memory, by splitting a binary word, representative of the datum and an error correcting or detecting code, into a first part and a second part. The first part is written at a logical address in a first memory circuit. The second part is written at the logical address in a second memory circuit. The error correcting or detecting code is dependent on both the datum and the logical address.

Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

Abstract: In one embodiment, a waveguide includes an upstream portion, a downstream portion, and an intermediate portion between the upstream portion and the downstream portion. A first band is disposed on an insulating layer, the first band oriented along a first direction. A first lateral strip and a second lateral strip are disposed on either side of the first band, the first lateral strip and the second lateral strip being thinner or interrupted along the intermediate portion.

Abstract: A datum is written to a memory, by splitting a binary word, representative of the datum and an error correcting or detecting code, into a first part and a second part. The first part is written at a logical address in a first memory circuit. The second part is written at the logical address in a second memory circuit. The error correcting or detecting code is dependent on both the datum and the logical address.

Abstract: An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.

Abstract: A method can be used for addressing a slave integrated circuit connected to a bus. The slave integrated circuit has a default address on the bus. The method includes receiving, at the slave integrated circuit, an addressing message conveyed on the bus. The addressing message contains a replacement address. The method also includes replacing the default address within the slave integrated circuit with the replacement address upon receiving the addressing message, restarting the slave integrated circuit, and upon the restarting, assigning the replacement address as a new default address.

Abstract: An integrated circuit includes a secure hardware environment having a first input that receives a key number. A key generation device generates a secret key from the key number and a unique key. A signature generation device generates a signature associated with the key number. A second input of the secure hardware environment receives encrypted binary data. A decryption device operates to decrypt the received encrypted binary data using the secret key. A third input the secure hardware environment receives an authentication signature. An authentication device authorizes use of the secret key to decrypt only if the signature generated by the signature generation device is identical to the authentication signature.

Abstract: A unique hardware key is recorded a secure hardware environment. A first logic circuit of the secure hardware environment is configured to generate a unique derived key from said unique hardware key and at least one piece of information. The at least one piece of information relates to one or more of an execution context and a use of a secret key. The secure hardware environment further includes a first encryption device that performs a symmetric encryption of the secret key using the unique derived key. This symmetric encryption generates an encrypted secret key for use outside of the secure hardware environment.

Abstract: In an embodiment, an image sensor includes: first and second voltage rails; first and second regulators configured to generate first and second regulated voltage at the first and second voltage rails, respectively; and a plurality of pixels coupled to the first and second voltage rails. Each pixel includes: first and second transistor coupled first and second storage capacitor, respectively. A third transistor is coupled between a control terminal of the first transistor and the first or second voltage rails. The third transistor is configured to limit a slew rate of current flowing between the control terminal of the second transistor and the first or second voltage rails to a first slew rate when the image sensor operates in global shutter mode, and to a second slew rate when the image sensor operates in rolling mode, the first slew rate being smaller than the second slew rate.

Abstract: A method of managing the power supply of one or more first elements by a second element of a same first device, includes the steps of: sending, to a second device, a time extension request; evaluating during the time extension a power available from an electromagnetic field radiated by the second device; and adjusting the power supply of the second element and of the first element(s) according to the available power.

Abstract: A sampling circuit includes a metal oxide semiconductor (MOS) transistor that includes a third metallization receiving a reference voltage between a first metallization coupled to a source region of the transistor and a second metallization coupled to a drain region of the transistor.

Abstract: An H-bridge circuit includes a supply voltage node, a first pair of transistors and a second pair of transistors. First transistors in each pair have the current paths therethrough included in current flow lines between the supply node and, respectively, a first output node and a second output node. Second transistors in each pair have the current paths therethrough coupled to a third output node and a fourth output node, respectively. The first and third output nodes are mutually isolated from each other and the second and fourth output nodes are mutually isolated from each other. The H-bridge circuit is operable in a selected one of a first, second and third mode.

Abstract: In an embodiment, a method for protecting an electronic circuit includes: detecting a malfunction of the electronic circuit; executing a plurality of waves of countermeasures without interrupting an operation of the electronic circuit; and triggering a reset of the electronic circuit after executing the plurality of waves of countermeasures. An interval between two waves of countermeasures of the plurality of waves of countermeasures is variable.

Abstract: An electronic device includes a carrier substrate with an electronic IC chip mounted on top of the carrier substrate. An encapsulation block on top of the front face of the carrier substrate embeds the IC chip. The encapsulation block has a through-void for positioning and confinement that extends through the encapsulation block to the top of the carrier substrate. At least one electronic component is positioned within the through-void and mounted to the top of the carrier substrate. Solder bumps or pads are located within the through-void to electrically connect the at least one electronic component to the carrier substrate.