Abstract: Disclosed herein is a method of operating an electronic device. The method includes activating a first sensing device, and determining a first probabilistic context of the electronic device relative to its surroundings. The method includes outputting the first probabilistic context, and determining a confidence measure of the first probabilistic context. Where the confidence measure of the first probabilistic context is below a threshold, the method includes activating a second sensing device, determining a second probabilistic context of the electronic device relative to its surroundings. outputting the second probabilistic context, and determining a confidence measure of the second probabilistic context. Where the confidence measure of the second probabilistic context is above the threshold, the second sensing device is deactivated and the method returns to determining the first probabilistic context.

Abstract: Disclosed herein is a touch screen controller including a driver circuit applying a drive signal to a drive line of a capacitive touch sensing panel. The driver circuit is powered by an accurate supply voltage. A driver supply circuit receives an input supply voltage and outputs the accurate supply voltage. The driver supply circuit includes a clocked comparator comparing a divided version of the accurate supply voltage to a reference voltage and outputting a comparison signal based thereupon. A voltage control circuit (e.g. a charge pump circuit) generates the accurate supply voltage in response to the comparison signal. The clocked comparator and voltage control circuit are both clocked by a driver supply circuit clock.

Abstract: A capacitive touch matrix has first conductive row elements spaced apart from one another, and first row interconnection circuitry electrically connects the first conductive row elements. Second conductive row elements are spaced apart from one another, and second row interconnection circuitry electrically connects the second conductive row elements. First conductive column elements are positioned between two adjacent ones of the first conductive row elements, the first conductive column elements being spaced apart from one another. Second conductive column elements are positioned in a same column as the first conductive column elements and between the two adjacent ones of the first conductive row elements, the second conductive column elements being spaced apart from one another. First column interconnection circuitry electrically connects each first conductive column element, and second column interconnection circuitry electrically connects each conductive column element.

Abstract: An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass through. The optical element is inserted into the encapsulation cover by overmolding into a through-passage of the frontal wall. A front face of the optical element is set back with respect to a front face of the frontal wall. The process for fabricating the encapsulation cover includes forming a stack of a sacrificial spacer on top of an optical element, with the stack placed into a cavity of a mold.

Abstract: Disclosed herein is an electronic device including an IO node, with a receiver coupled to receive input from the IO node. A transmitter driver has a first n-channel DMOS with a source coupled to the IO node. A pass gate circuit decouples the IO node from the receiver based upon presence of a negative voltage at the IO node and couples the IO node to the receiver based upon lack of presence of the negative voltage at the IO node. A transmit protection circuit applies the negative voltage from the IO node to the gate and bulk of the first n-channel DMOS based upon the presence of the negative voltage at the IO node.

Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

Abstract: An electronic device includes a power management circuit generating output for a plurality of voltage monitors that each detect whether voltages received from a test apparatus are at least a different minimum threshold. The power management circuit also generates a test enable signal indicative of whether the test apparatus is supplying the minimum required voltages to the electronic device. A control circuit receives the output for the plurality of voltage monitors and the test enable signal and generates at least one control signal as a function of the output for the plurality of voltage monitors and the test enable signal. An output circuit receives the at least one control signal and generates an interface control signal that selectively enables or disables interface with analog intellectual property packages within the electronic device, in response to the at least one control signal.

Abstract: A method and near field communications (NFC) system for sensing at least one of an environmental condition or a composition of media in a proximity of the NFC system are provided. In the method and system, a first antenna irradiates an electromagnetic field during a sensor mode. A second antenna detects the electromagnetic field and outputs a voltage representative of the detected electromagnetic field. An NFC controller receives a signal representative of the voltage. The NFC controller determines at least one of the environmental condition or the composition of media based on an association stored in memory between the voltage and the at least one of the environmental condition or the composition of media.

Abstract: A method of contactless communication can be performed between an object and a reader using active load modulation. A synchronization process is performed between a first carrier signal transmitted by the reader and having a reference frequency, and a second carrier signal extracted from an output signal of a controlled oscillator of a digital phase-locked loop of the object. In the synchronization process, as long as a locking of the loop has not been detected, the frequency of the output signal of the oscillator is latched on a frequency that is a multiple of the reference frequency. Once the locking has been detected, the latching continues while controlling the oscillator with a second control signal generated from a second value obtained.

Abstract: An integrated circuit system-on-chip (SOC) includes a semiconductor substrate, a plurality of components made up of transistors formed in the substrate, and a plurality of interconnection lines providing electrical connectivity among the components. Use of a channel-less design eliminates interconnection channels on the top surface of the chip. Instead, interconnection lines are abutted to one another in a top layer of metallization, thus preserving 5-10% of chip real estate. Clock buffers that are typically positioned along interconnection channels between components are instead located within regions of the substrate that contain the components. Design rules for channel-less integrated circuits permit feed-through interconnections and exclude multi-fanout interconnections.

Abstract: A testing architecture for integrated circuits on a wafer includes at least one first circuit of a structure test element group (TEG) realized in a scribe line providing separation between first and second integrated circuits. At least one pad is shared by a second circuit inside at least one of the first and second integrated circuits and the first circuit. Switching circuitry is coupled to the at least one pad and to the first and second circuits.

Abstract: An amplification interface includes an input terminal receiving a sensor current and an output terminal supplying an output voltage. An analog integrator is connected to the input terminal and supplies the output voltage. A current generator is connected to the input of the analog integrator and generates a compensation current based on a drive signal. A control circuit generates the drive signal for the current generator based on a control signal representing an offset in the sensor current supplied by the sensor. The current generator generates, based on the driving signal, a positive or negative current. The control circuit determines a first duration and a second duration as a function of the control signal representing the offset in the sensor current, during the measurement interval, and sets the driving signal to a first logic value for the first duration and to a second logic value for the second duration.

Abstract: A MOSFET has a current conduction path between source and drain terminals. A gate terminal of the MOSFET receives an input signal to facilitate current conduction in the current conduction path as a result of a gate-to-source voltage reaching a threshold voltage. A body terminal of the MOSFET is coupled to body voltage control circuitry that is sensitive to the voltage at the gate terminal of the MOSFET. The body voltage control circuitry responds to a reduction in the voltage at the gate terminal of the MOSFET by increasing the body voltage of the MOSFET at the body terminal of the MOSFET. As a result, there is reduction in the threshold voltage. The circuit configuration is applicable to amplifier circuits, comparator circuits and current mirror circuits.

Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.

Abstract: A high-to-low voltage interface circuit includes a differential circuit stage with a differential amplifier circuit having inverting and non-inverting inputs coupled to first and second input pads as well as a differential output having first and second output nodes. A pair of bias amplifier stages sensitive to the common mode voltage of the differential amplifier circuit are arranged in first and second current mirror paths from the first and second input pads to the inverting/non-inverting inputs of the differential amplifier circuit, respectively. The bias amplifier stages are configured to maintain the first input pad and the second input pad of the differential circuit stage at the common mode voltage.

Abstract: An amplification interface includes a drain of a first FET connected to a first node, a drain of a second FET connected to a second node, and sources of the first and second FETs connected to a third node. First and second bias-current generators are connected to the first and second nodes. A third FET is connected between the third node and a reference voltage. A regulation circuit drives the gate of the third FET to regulate the common mode of the voltage at the first node and the voltage at the second node to a desired value. A current generator applies a correction current to the first and/or second node. A differential current integrator has a first and second inputs connected to the second and first nodes. The integrator supplies a voltage representing the integral of the difference between the currents received at the second and first inputs.

Abstract: A first terminal receives a first DC voltage. A switch selectively couples the first terminal to a second terminal providing an output. A control circuit selectively actuates the switch in response to a comparison of the first DC voltage to a second DC voltage. A low-dropout (LDO) linear voltage regulator, connected between the first and third terminals, operates to provide the second DC voltage from the first DC voltage.

Abstract: A vertical power component includes a semiconductor substrate, a first electrode in contact with a lower surface of the substrate, and a second electrode in contact with an upper surface of the substrate. The vertical component is mounted to a metal connection plate via a metal spacer. The metal spacer includes a lower surface soldered to the metal connection plate and an upper surface soldered to the first electrode of the vertical power component. The metal spacer is made of a same metal as the metal connection plate. A surface are of the metal spacer mounted to the first electrode is smaller than a surface area of the first electrode.

Abstract: An apparatus is for testing a device to be supplied with power via USB Power Delivery (USB-PD). The apparatus includes at least one USB Type-C connector configured to be connected to the device to be supplied with power to be tested, the at least one USB Type-C connector including a power supply terminal. Processing circuitry of the apparatus is configured to verify that a voltage at the power supply terminal is lower than a first threshold, verify a role of the device, generate requests representative of power supply configurations supported by the role of the device, and verify compatibility of the power supply configurations supported by the device with standardized power supply configurations.

Abstract: An apparatus is adapted to test a power supply device of the USB-PD type which includes at least one USB Type-C connector. The USB Type-C connector is intended to be connected to the power supply device to be tested. The device is separate from the apparatus.