Patents Assigned to STMICROELECTRONICS (GRENOVLE 2) SAS
  • Patent number: 11946467
    Abstract: Various embodiments provide a device for measuring the flow of fluid inside a tube moved by a peristaltic pump is provided with: a detection electrode arrangement coupled to the tube to detect an electrostatic charge variation originated by the mechanical action of the peristaltic pump on the tube; a signal processing stage, electrically coupled to the detection electrode arrangement to generate an electrical charge variation signal; and a processing unit, coupled to the signal processing stage to receive and process in the frequency domain the electrical charge variation signal to obtain information on the flow of a fluid that flows through the tube based on the analysis of frequency characteristics of the electrical charge variation signal.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 2, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Michele Alessio Dellutri, Fabio Passaniti, Enrico Rosario Alessi
  • Patent number: 11949243
    Abstract: A method implemented by a wireless charging receiver (RX) includes detecting, by the wireless charging RX, that a voltage potential of an output of a rectifier of the wireless charging RX has met a boost mode threshold; placing, by the wireless charging RX, the rectifier into a boost mode; and detecting, by the wireless charging RX, that the voltage potential of the output of the rectifier of the wireless charging RX has met a specified threshold, and based thereon, negotiating, by the wireless charging RX with a wireless charging transmitter (TX), to initiate a power transfer.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: April 2, 2024
    Assignee: STMICROELECTRONICS DESIGN AND APPLICATION S.R.O.
    Inventor: Michal Toula
  • Patent number: 11950511
    Abstract: A device for emitting an ultrasound acoustic wave in a propagation medium, comprising: a package including a base substrate and a cap coupled to the base substrate and defining therewith a chamber in the package; a semiconductor die, coupled to the base substrate in the chamber, comprising a semiconductor body; a micromachined ultrasonic transducer (MUT) integrated at least in part in the semiconductor body and including a cavity in the semiconductor body and a membrane suspended over the cavity; and an actuator, operatively coupled to the membrane, which can be operated for generating a deflection of the membrane. The membrane is designed in such a way that a resonance frequency thereof matches an acoustic resonance frequency that, during operation of the MUT, develops in said chamber of the package.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 2, 2024
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Francesco Procopio, Fabio Quaglia
  • Patent number: 11949025
    Abstract: The vertical-conduction electronic power device is formed by a body of wide band gap semiconductor which has a first conductivity type and has a surface, and is formed by a drift region and by a plurality of surface portions delimited by the surface. The electronic device is further formed by a plurality of first implanted regions having a second conductivity type, which extend into the drift region from the surface, and by a plurality of metal portions, which are arranged on the surface. Each metal portion is in Schottky contact with a respective surface portion of the plurality of surface portions so as to form a plurality of Schottky diodes formed by first Schottky diodes and second Schottky diodes, wherein the first Schottky diodes have, at equilibrium, a Schottky barrier having a height different from that of the second Schottky diodes.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 2, 2024
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Simone RascunĂ¡
  • Patent number: 11948927
    Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: April 2, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Davide Giuseppe Patti, Mario Antonio Aleo
  • Publication number: 20240103873
    Abstract: The disclosure includes a method of authenticating a processor that includes an arithmetic and logic unit. At least one decoded operand of at least a portion of a to-be-executed opcode is received on a first terminal of the arithmetic and logic unit. A signed instruction is received on a second terminal of the arithmetic and logic unit. The signed instruction combines a decoded instruction of the to-be-executed opcode and a previous calculation result of the arithmetic and logic unit.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Applicants: STMICROELECTRONICS (ROUSSET) SAS, PROTON WORLD INTERNATIONAL N.V.
    Inventors: Michael PEETERS, Fabrice MARINET
  • Patent number: 11942882
    Abstract: A method of starting a permanent magnet synchronous motor (PMSM) with field oriented control (FOC) includes: opening a first control loop of the PMSM; setting a first direction for a first current component of the PMSM; aligning a rotor of the PMSM to the first direction; after aligning the rotor, setting a second direction for the first current component, where the second direction is rotated from the first direction by 90 degrees; after setting the second direction, starting the rotor while the first control loop of the PMSM remains open; after starting the rotor, increasing a rotation speed of the rotor by operating the first control loop in a first closed-loop mode; and after increasing the rotation speed of the rotor, controlling the rotation speed of the rotor by operating the first control loop in a second closed-loop mode different from the first closed-loop mode.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 26, 2024
    Assignee: STMICROELECTRONICS (BEIJING) R&D CO. LTD
    Inventor: Na Zhang
  • Patent number: 11943008
    Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: March 26, 2024
    Assignees: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Chia Hao Chen, Nicolas Cordier
  • Patent number: 11942107
    Abstract: The present disclosure is directed to a device and method for detecting presence or absence of human speech. The device and method utilize a low-power accelerometer. The device and method generate an acceleration signal using the accelerometer, filter the acceleration signal with a band pass filter or a high pass filter, determine at least one calculation of the filtered acceleration signal, detect a presence or absence of a voice based on the at least one calculation, and output a detection signal that indicates the presence or absence of the voice. The device and method are well suited for portable audio devices, such as true wireless stereo headphones, that have a limited power supply.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: March 26, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Stefano Paolo Rivolta, Federico Rizzardini, Lorenzo Bracco, Roberto Mura
  • Publication number: 20240096412
    Abstract: In a non-volatile memory device, a memory sector is provided. The memory sector includes a plurality of tiles arranged horizontally. Each tile includes a plurality of memory cells arranged in horizontal word lines and vertical bit lines. A pre-decoder is configured to receive a set of encoded address signals to produce pre-decoding signals. A central row decoder is arranged in line with the plurality of tiles, receives the pre-decoding signals and produces level-shifted pull-up and pull-down driving signals for driving the word lines. First buffer circuits are arranged on a first side of each tile. Each of the first buffer circuits is coupled to a respective word line, receives a level-shifted pull-up driving signal and a level-shifted pull-down driving signal, and selectively pulls up or pulls down the respective word line as a function of the values of the received signals.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 21, 2024
    Applicants: STMICROELECTRONICS S.r.l., STMICROELECTRONICS (ALPS) SAS
    Inventors: Antonino CONTE, Agatino Massimo MACCARRONE, Francesco TOMAIUOLO, Thomas JOUANNEAU, Vincenzo RUSSO
  • Publication number: 20240090800
    Abstract: The present disclosure is directed to a wearable electronic device, such as a watch, that includes one or more optical sensors. In order to determine accuracy of measurements by the optical sensors, the device detects whether or not the optical sensors are in physical contact with the user's skin. The device detects a level of contact between the user's skin and the optical sensors based on electrostatic charge variation measurements, and generates a contact reliability index (CRI) based on the level of contact. Operation of the optical sensors are adjusted based on the CRI.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Stefano Paolo RIVOLTA, Roberto MURA
  • Publication number: 20240096759
    Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 21, 2024
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Cristina SOMMA, Fulvio Vittorio FONTANA
  • Publication number: 20240095023
    Abstract: An integrated circuit includes a memory and processing circuitry. The memory stores an Elementary File Test (EFT) file including a record storing information to update a target elementary file (TGF) in a file system of the EFT. The stored information includes a file path identifier identifying a position of the TGF in the file system of the EFT file, which is a concatenation of a parent file identifier followed by an identifier of the TGF, a first length indicator of a first type of data, the data of the first type, a second length indicator to indicate a length of a second type of data, and the data of the second type. The processing circuitry, in operation, identifies the TGF based on the file path identifier and updates the content of the TGF to include the first data and one or more instances of the second data.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 21, 2024
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Maria CHICHIERCHIA, Mario ALGHIRI
  • Patent number: 11933810
    Abstract: The present disclosure is directed to a detection structure for a vertical-axis resonant accelerometer. The detection structure includes an inertial mass suspended above a substrate and having a window provided therewithin and traversing it throughout a thickness thereof. The inertial mass is coupled to a main anchorage, arranged in the window and integral with the substrate, through a first and a second anchoring elastic element of a torsional type. The detection structure also includes at least a first resonant element having longitudinal extension, coupled between the first elastic element and a first constraint element arranged in the window. The first constraint element is suspended above the substrate, to which it is fixedly coupled through a first auxiliary anchoring element which extends below the first resonant element with longitudinal extension and is integrally coupled between the first constraint element and the main anchorage.
    Type: Grant
    Filed: September 8, 2022
    Date of Patent: March 19, 2024
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Valentina Zega, Gabriele Gattere, Attilio Alberto Frangi, Andrea Opreni, Manuel Riani
  • Patent number: 11935818
    Abstract: A method of producing electronic components including at least one circuit having coupled therewith electrical connections including metallic wire bondable surfaces encased in a packaging, the method including bonding stud bumps, in particular copper stud bumps, at determined areas of said wire bondable surfaces.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: March 19, 2024
    Assignee: STMICROELECTRONICS S.r.l.
    Inventor: Fabio Marchisi
  • Patent number: 11935884
    Abstract: Overvoltage protection circuits are provided. In some embodiments, an overvoltage protection circuit includes a first diode made of a first semiconductor material having a bandgap width greater than that of silicon. A second diode is included and is electrically cross-coupled with the first diode. The second diode is made of a second semiconductor material different from the first semiconductor material.
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: March 19, 2024
    Assignees: STMICROELECTRONICS S.r.l., STMICROELECTRONICS (TOURS) SAS
    Inventors: Jean-Michel Simonnet, Sophie Ngo, Simone Rascuna'
  • Patent number: 11934529
    Abstract: A method includes protecting a boot sequence of a processing device by incrementing a counting value generated by a monotonic counter, then a first time period after the beginning of the boot sequence, comparing, by the protection circuit, the counting value with a first reference value, and, if the counting value is smaller than the first reference value, changing, by the protection circuit, the counting value to the first reference value.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: March 19, 2024
    Assignee: STMICROELECTRONICS (GRAND OUEST) SAS
    Inventor: Franck Albesa
  • Publication number: 20240086152
    Abstract: A device includes a multiplier, an accumulator and a floating point adder. The multiplier generates a product of a first factor having a sign bit and exponent bits and a second factor having a sign bit and exponent bits. The multiplier includes a sign multiplier and a subtractor. The sign multiplier generates a product of the sign bit of the first factor and the sign bit of the second factor. The subtractor subtracts the exponent bits of the first factor from the exponent bits of the second factor. The accumulator stores a current accumulation value. The floating-point adder is coupled to the multiplier and to the accumulator, and, in operation, the adder generates an updated accumulation value based a sum of the product and the current accumulation value, and stores the updated accumulation value in the accumulator. The first factor may be a weight of a neural network.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 14, 2024
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Luca GANDOLFI, Ugo GAROZZO
  • Publication number: 20240085960
    Abstract: The present disclosure is directed to a device and method for lid angle detection that is accurate even if the device is activated in an upright position. While the device is in a sleep state, first and second sensor units measure acceleration and angular velocity, and calculate orientations of respective lid components based on the acceleration and angular velocity measurements. Upon the device exiting the sleep state, a processor estimates the lid angle using the calculated orientations, sets the estimated lid angle as an initial lid angle, and updates the initial lid angle using, for example, two accelerometers; two accelerometers and two gyroscopes; two accelerometers and two magnetometers; or two accelerometers, two gyroscopes, and two magnetometers.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Federico RIZZARDINI, Lorenzo BRACCO
  • Publication number: 20240088012
    Abstract: The present disclosure is directed to embodiments of a conductive structure on a conductive layer, which may be a conductive damascene layer of a semiconductor device or package. The conductive damascene layer may be within a substrate of the semiconductor device or package. A crevice is present between one or more sidewalls of the conductive structure and one or more sidewalls of one or more insulating layers on the substrate and extends to a surface of the conductive layer. A sealing layer is formed in the crevice that seals the conductive layer from moisture and contaminants external to the semiconductor device or package that may enter the crevice. In other words, the sealing layer stops the moisture and contaminants from reaching the conductive layer such that the conductive layer does not corrode due to exposure to the moisture and contaminants.
    Type: Application
    Filed: September 9, 2022
    Publication date: March 14, 2024
    Applicant: STMICROELECTRONICS S.r.l.
    Inventors: Francesca MILANESI, Paolo COLPANI