Abstract: A bandgap voltage reference circuit includes a current generation stage configured to generate a proportional to absolute temperature (PTAT) current and a complementary to absolute temperature (CTAT) current and to generate a reference current by combining the PTAT and CTAT currents. An output stage is coupled to the current generation stage and configured to combine the PTAT current and the CTAT current to generate a bandgap voltage reference. A curvature correction circuit is configured to generate a curvature correction current that mirrors the reference current generated from the PTAT and CTAT currents. The curvature correction current has a ratio relative to the reference current given by a current ratio parameter having value that is less than one, equal to one, or greater than one. In this way the value of the current ratio parameter can be varied to cancel a non-linear dependence on temperature of the bandgap voltage reference, thereby providing a curvature-compensated bandgap voltage reference.

Abstract: A method of manufacturing double-sided semiconductor die by performing a first plurality of processes to a first side of a wafer and performing a second plurality of processes to a second side of the wafer, thereby forming at least a first semiconductor device on the first side of the wafer and at least a second semiconductor device on the second side of the wafer. The wafer may be cut to form a plurality of die having at least one semiconductor device on each side.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of high-aspect-ratio leads, each coupled at a first end to a contact pad of the package, and at a second end to a semiconductor die mounted to the die paddle. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and leads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and leads, and to thin a portion of each of the leads. Back surfaces of the leads remain exposed at a back face of the body. The thinned portions of the leads are covered with a dielectric. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of leads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A system and method for optimizing power distribution in a closed system. In an electronic device, one may apply a plurality of driving algorithms for components that provide different variations functionality. Thus, each component may be operated according to one of several different algorithms depending on the level and manner of functionality needed. In this manner, the overall system may be optimized for any number of operating modes such that each component may conserve electrical power usage while still providing the needed functionality for specific components during each operating mode. Such an optimization assessment may be a function of an economic model applied to the system whereby functionality and components are assigned specific values and costs based on the required functionality for any given task. Thus, the amount of power available may be allocated in an efficient manner based on a cost-benefit analysis.

Abstract: System and method for virtualization of computing elements. A hypervisor provides virtualization of one or more peripherals for one or more computing elements. The hypervisor may further allow separate instances of an operating system to be suspended on one computing element to allow another application to be processed by replacing the state information of the computing element. The suspended instance may be resumed on the same or a different computing element.

Abstract: Disclosed is a programmable pulse width discriminator circuit operable to receive a set of parameters from a user and indicate when an input signal satisfies conditions set by the user-defined parameters. The input signal is sampled by the pulse width discriminator circuit to detect a desired state of the input signal. The user may set the parameters such that the pulse width discriminator indicates the condition wherein the number of consecutive samples for which the input signal is the desired state is (i) greater than a first threshold value, (ii) less than a second threshold value, or (iii) between the first and second threshold values. In these embodiments, the user sets the first and second threshold values and selects which set of conditions are indicated by the output of the circuit.

Abstract: Motion estimation systems and methods are disclosed. An apparatus may include a processing unit to acquire video images and to arrange the video images into a plurality of sequential video frames, and a motion estimation unit that receives the sequential video frames and determines a set of repetitive pattern neighbor candidate vectors for repetitive pattern content in a first frame. The set of repetitive pattern neighbor candidate vectors may be reduced by sorting the set to eliminate spurious repetitive pattern neighbor candidate vectors. The reduced set may be provided to a second adjacent frame. A method may include acquiring a plurality of sequential video frames having a repetitive pattern content, and determining a set of repetitive pattern neighbor candidate vectors for the repetitive pattern content in a first frame of the sequential video frames. The set of repetitive pattern neighbor candidate vectors may be sorted by determining at least one spurious repetitive pattern neighbor candidate vector.

Abstract: A leadless semiconductor package includes a package body on a leadframe that includes a die paddle and a plurality of bond pads, none of which extend as far as a lateral face of the body. During manufacture of the package, molding compound is deposited over a face of the leadframe on which the die paddle and bond pads are positioned. After the molding compound is cured, a back side of the leadframe is etched to isolate the die paddle and bond pads, back surfaces of which remain exposed at a back face of the body. During manufacture of the leadframe, a parent substrate is etched to define the die paddle and a plurality of bond pads on one side of the substrate and a plurality of cavities on the opposite face.

Abstract: A system and method for optimal allocation of bandwidth in a multichannel transmission channel. In an embodiment, a system may allocate a specific amount of bandwidth in the transmission channel in order to maximize the value of the data that is transmitted on a per-channel basis. Typically, a transmission channel has enough bandwidth to accommodate the minimum bandwidth for all data across all channels. The excess bandwidth may be allocated in an optimal manner so as to provide additional bandwidth for the most valuable channels. The maximum allocation of bandwidth is a point in which allocating additional bandwidth to a channel does not yield any additional value. Such an allocation may be accomplished using an iterative analysis of the available bandwidth and a microeconomic-based analysis of the subjective value of each channel.

Abstract: Disclosed is a deglitcher circuit having a programmable hysteresis. The deglitcher samples a received input signal, wherein the input signal may include one or more glitches. Responsive to a change in state of the sampled input signal, the deglitcher counts the number of samples of the changed state of the input signal. The count value increments with each sampled changed state, and decrements with each sampled original state of the input signal. When the count value reaches a threshold, the state of the output signal is changed. The output signal of the disclosed deglitcher circuit provides an accurate, glitch-free reconstruction of the sampled input signal. Additionally, the disclosed deglitcher circuit reduces the number of memory elements required for a given number of samples of the input signal, thereby allowing for a larger number of samples to be taken without necessarily having to increase the memory elements required by the deglitcher.

Abstract: A method of manufacturing a modular semiconductor subassembly: providing at least one semiconductor subassembly having a modular sidewall element of modular dimensions and a semiconductor substrate base element coupled to the modular sidewall element that has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element. If a modular package protective cover is to be used: providing the modular package protective cover configured to accommodate the semiconductor subassembly in accordance with a modular design; securing the semiconductor subassembly in the modular package protective cover to create a modular package assembly; and mounting the modular package assembly to a core, with a base side of the semiconductor substrate base element in contact with the core; otherwise: mounting the at semiconductor subassembly to the core, with the base side of the semiconductor substrate base element in contact with the core.

Abstract: One or more digital video frames are interpolated using motion compensated temporal interpolation (MCTI). The quality of motion vectors corresponding to object motion between the two adjacent second video frames is detected. An average of forward motion vectors and an average of backward motion vectors representing motion of the object are compared by calculating the absolute value difference of the averaged forward and backward motion vectors to detect the quality of the motion vectors and a control signal is generated corresponding to the detected quality. Customized Image segmentation based on a first mode of image processing, a second mode of image processing or a combination of the first and second modes of image processing is then performed based on the detected accuracy to generate the interpolated frame.

Abstract: A shadow hardware system and method is provided. The shadow hardware system provides an interface between an access device and shadowed devices. Shadowed devices are devices that the shadow hardware system provides an interface to the access device although the shadowed device may not actually be present or available to the access device, such as implementing a disk drive as flash memory. The access device, such as a host processor, issues requests to a disk drive and the shadow hardware system converts the requests to requests suitable for the flash memory. A shadow remapper redirects the requests to shadow registers and notifies the shadow controller of the pending request. The shadow controller accesses the shadow registers and modifies the registers (if necessary) before forwarding the registers to the actual hardware devices. Any suitable device may be shadowed.

Abstract: A method of manufacturing microstructures, such as MEMS or NEMS devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on one or more surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure. The process may be self-aligning.

Abstract: Multiple virtual MAC addresses may be added to WGA devices that may have different traffic streams to another device that requires different services, thus creating distinct MAC and device level implications. Beamforming training can be done at the device level for all virtual MAC addresses. Wakeup, doze, and ATIM power save can be done at the device level depending on the frames received. Authentication, deauthentication, association, and deassociation can be done variously at both levels. Further MSDUs can be aggregated for the multiple MAC addresses.

Abstract: An appropriate motion vector to assign to a pixel in a digital video frame is performed by a comparison of motion vectors of particular surrounding pixels. Direction of at least one of color transition or color brightness transition in the digital video frame is detected to detect direction of object boundaries in the digital video frame. The particular surrounding pixels are selected and grouped (filtered) according to the detected object boundary direction at each pixel. A comparison of the motion vectors of the surrounding pixels then provides information on which group of pixels to assign a current pixel being processed based in part on how close the motion vectors of the surrounding groups match a group pixels to which the pixel being processed belongs.

Abstract: Apparatus and methods for wireless data transmission in a multimedia network are disclosed. Disclosed is a network having a source coupled to a sink using a virtual channel that includes a wireless communication channel. A source end of the system provides a packetizing data stream having a stream of payloads such that each payload is associated with its respective originating source stream. The system configured to encode the packetized data stream for wireless transport. A non-wireless source end of the system receives quality of service information from downstream. Thereby enabling adjustments to the source content and packetized data streams.

Abstract: A method and apparatus for recovering a content signal from media stream protected by a digital rights management (DRM) system. A content access device includes a network interface configured to receive the protected media stream from a remote content provider via a network and a plurality of distinct DRM components corresponding to DRM systems supported by the content access device. A content extraction unit is operable to select a DRM component of the plurality of DRM components and execute the selected DRM component to recover a content signal from the protected media stream. When a search engine is used to discover available content, a list of references to available content is presented to the user, the presentation being dependent upon whether or not the content is protected by a DRM system supported by the content access device.

Abstract: A semiconductor subassembly, a modular sidewall element having modular dimensions that accommodates placement of the semiconductor subassembly in a modular layout and a semiconductor substrate base element coupled to the modular sidewall element. The semiconductor substrate base element has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element and the semiconductor substrate base element configured to form a base of the semiconductor subassembly.

Abstract: A method of designing a desired modular assembly: determining a package outline of a modular package assembly; determining seating plane and overall package length characteristics; calculating minimum package height of the modular package assembly; designing the dimensions and the configuration of semiconductor subassemblies by receiving semiconductor subassembly user input design data at the design tool, each semiconductor subassembly of the one or more semiconductor subassemblies comprising a modular sidewall element and a semiconductor substrate base element coupled to the modular sidewall element, the semiconductor substrate base element having at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element and the semiconductor substrate base element configured to form a base of the semiconductor subassembly; and incorporating the configuration and dimensions of the modular package assembly and the one or more semiconductor subassemblies int