Abstract: An output potential level among two first levels is delivered according to an input level among two second levels. The output potential level is delivered at a first node connecting together first and second transistors electrically in series between two second nodes of application of the first levels. A first DC voltage defining a high limit for the control voltage of the first transistor is delivered by a first voltage generator powered by one of the second nodes. A second DC voltage defining a high limit for the control voltage of the second transistor is delivered by a second voltage generator controlled by a value representative of the first voltage and powered between the second nodes.

Abstract: A multiplexer includes an input, an output, and a main switch configured to pass a signal from the input to the output. The multiplexer includes two bootstrap circuits that collectively maintain a constant voltage between terminals of the main switch during alternating phases.

Abstract: In an embodiment a DC to DC conversion circuit includes a DC to DC converter connected to an input path and an output path and a current limiting circuit including a circuit configured to detect when an input or output current of the DC to DC converter exceeds or falls below a current threshold and a controller configured to store a first voltage level of an output voltage of the DC to DC converter in response to the input or output current exceeding the current threshold, to store a second voltage level of the output voltage in response to the input or output current falling below the current threshold and to set a control signal based on the first and second voltage levels.

Abstract: A wireless power receiver includes a rectifier with first and second inputs coupled to first and second terminals of a receiver coil, and having a first output coupled to ground and a second output at which a rectified voltage is produced. A first switch is coupled between the second input and ground, and is controlled by a first gate voltage generated at a first node. A second switch is coupled between the first node and ground, and is controlled by a second gate voltage. The first gate voltage closes the first switch to couple the second input to ground when the rectified voltage is less than a threshold voltage, boosting the rectified voltage. The second gate voltage closes the second switch to cause the second gate voltage to be pulled to ground when the rectified voltage is greater than the threshold voltage, limiting the boosting of the rectified voltage.

Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.

Abstract: A method includes forming a layer made of a first insulating material on a first layer made of a second insulating material that covers a support, defining a waveguide made of the first material in the layer of the first material, covering the waveguide made of the first material with a second layer of the second material, planarizing an upper surface of the second layer of the second material, and forming a single-crystal silicon layer over the second layer.

Abstract: According to an embodiment, a method for testing a triple-voting flop (TVF) is provided. The method includes providing a first and a second scan enable signal by a control circuit to, respectively, a first scan flip-flop and a third scan flip-flop of the TVF; receiving a third scan enable signal at the second scan flip-flop of the TVF; providing a scan input signal to the first scan flip-flop, the second scan flip-flop, and the third scan flip-flop; controlling the first scan enable signal, the second scan enable signal, and the third scan enable signal; receiving, at an output of the TVF, a scan output signal; and determining whether the TVF suffers from a fault based on the scan output signal and the controlling of the first scan enable signal, the second scan enable signal, and the third scan enable signal.

Abstract: A MOSFET device comprising: a structural region, made of a semiconductor material having a first type of conductivity, which extends between a first side and a second side opposite to the first side along an axis; a body region, having a second type of conductivity opposite to the first type, which extends in the structural region starting from the first side; a source region, having the first type of conductivity, which extends in the body region starting from the first side; a gate region, which extends in the structural region starting from the first side, traversing entirely the body region; and a shielding region, having the second type of conductivity, which extends in the structural region between the gate region and the second side. The shielding region is an implanted region self-aligned, in top view, to the gate region.

Abstract: A pulsed signal generator generates a pulsed signal having a pulse width configured to be equal to a given fraction of a pulse width of a reference clock. A reference current source outputs current having a reference magnitude, and a comparison current source outputs current having a magnitude that is a function of the reference magnitude and the given fraction. A comparison circuit compares a total current output by one of the reference current source and the comparison current source during pulses of the reference clock to a total current output by the other of the reference current source and the comparison current source during pulses of the pulsed signal equal in number to the pulses of the reference clock in order to determine whether the pulse width of the pulse signal is less than or equal to the given fraction of the pulse width of the reference clock.

Abstract: In an embodiment a non-volatile memory cell includes a substrate, a first body in the substrate, a second body in the substrate, a first storage transistor having a first conduction region and a second conduction region in the first body, the first and second conduction regions delimiting a first channel region in the first body, a first control gate region in the second body, an insulating region overlying the substrate, a single floating gate region extending on the substrate and embedded in the insulating region, the single floating gate region having a first portion on the first body and a second portion on the second body, the first portion and second portion being connected and electrically coupled, a first selection via extending through the insulating region and electrically coupling the first conduction region with a first conduction node, a second selection via extending through the insulating region and electrically coupling the second conduction region with a second conduction node and a first con

Abstract: In an embodiment a circuit includes a plurality of memory cells, wherein each memory cell includes a phase-change memory storage element coupled in series with a respective current-modulating transistor between a supply voltage node and a reference voltage node, the current-modulating transistors being configured to receive a drive signal at a control terminal and to inject respective programming currents into the respective phase-change memory storage element as a function of the drive signal, a driver circuit configured to produce the drive signal at a common control node, wherein the common control node is coupled to the control terminals of the current-modulating transistors, the drive signal modulating the programming currents to produce SET programming current pulses and RESET programming current pulses and at least one current generator circuit configured to inject a compensation current for the programming currents into the common control node.

Abstract: A set of configuration memory locations store configuration data for a microcontroller unit. A hardware monitoring module is coupled by an interconnection bus to the configuration memory locations. The hardware monitoring module reads from an instruction memory a command including an address of a target memory location in the set of configuration memory locations. Data is read from the target memory location corresponding to the address read and a checksum value is computed as a function of the data that is read from the target memory location. The computed checksum value is then compared to a respective expected checksum value stored in a checksum storage unit. An alarm signal is triggered in response to a mismatch detected between the computed checksum value and the respective expected checksum value.

Abstract: A semiconductor MOS device having an epitaxial layer with a first conductivity type formed by a drain region and by a drift region. The drift region accommodates a plurality of first columns with a second conductivity type and a plurality of second columns with the first conductivity type, the first and second columns alternating with each other and extending on the drain region. Insulated gate regions are each arranged on top of a respective second column; body regions having the second conductivity type extend above and at a distance from a respective first column, thus improving the output capacitance Cds of the device, for use in high efficiency RF applications.

Abstract: A single photon avalanche diode (SPAD) pixel circuit includes a SPAD, a clamping transistor coupled to the anode of the SPAD, and readout circuitry. The clamping transistor limits the anode voltage to a threshold below the readout circuitry's maximum operating voltage. In one embodiment, quenching and enabling transistors are implemented using single-layer gate oxide technology, while the clamping transistor uses extended drain technology. A regulation circuit generates a voltage clamp control signal for an array of pixels. Another embodiment utilizes a stacked chip design with the SPAD and a cathode-side quenching element on one chip, and the clamping transistor and readout circuitry on another. This incorporates a parasitic capacitance from deep trench isolation. Additional biasing transistors may be used for fine-tuning the clamped anode voltage.

Abstract: An image sensor includes a pixel array where each pixel is formed in a portion of a substrate electrically insulated from other portions of the substrate. Each pixel includes a photodetector; a transfer transistor; and a readout circuit comprising one or a plurality of transistors. The transistors of the readout circuit are formed inside and on top of at least one well of the portion. The reading from the photodetector of a pixel of a current row uses at least one transistor of the readout circuit of a pixel of at least one previous row, the well of the pixel of the previous row being biased with a first voltage greater than a second bias voltage of the well of the pixel of the current row.

Abstract: An integrated circuit includes a polysilicon region that is doped with a dopant. A portion of the polysilicon region is converted to a polyoxide region which includes un-oxidized dopant ions. A stack of layers overlies over the polyoxide region. The stack of layers includes: a first ozone-assisted sub-atmospheric pressure thermal chemical vapor deposition (O3 SACVD) TEOS layer; and a second O3 SACVD TEOS layer; wherein the first and second O3 SACVD TEOS layers are separated from each other by a dielectric region. A thermally annealing is performed at a temperature which induces outgassing of passivation atoms from the first and second O3 SACVD TEOS layers to migrate to passivate interface charges due to the presence of un-oxidized dopant ions in the polyoxide region.

Abstract: Test method of a vibrational MEMS structure wherein, a direct, variable modification voltage is applied to a resonance modification test structure having non-rectilinear electrodes, modifying the resonance frequency of the movable mass and the driving frequency. During the test, the movable mass is verified about stability and, if not stable, the vibrational MEMS structure is rejected.

Abstract: A pixel includes a photosensitive circuit, a sense node, a first transistor and a first capacitor. A first electrode of the first capacitor is connected to a control terminal of the first transistor. A second electrode of the first capacitor is to a node of application of a first control signal.

Abstract: A calibration method of a temperature sensor is provided. The temperature sensor having a current source and a ring oscillator generating a square pulse signal with a temperature-dependent square pulse frequency. The acquisition of a first square pulse frequency measurement at a first temperature from the square pulse signal forms a first measurement point. A second square pulse frequency measurement at a second temperature from the second square pulse signal forms a second measurement point. The determination of the relation data being representative of an affine relation between square pulse frequency measurements and temperatures. The affine relation being defined by a used proportionality coefficient modified with respect to a measured proportionality coefficient of a measured affine relation linking the first measurement point and the second measurement point.

Abstract: In an embodiment an integrated device includes a first physical unclonable function module configured to generate an initial data group and management module configured to generate an output data group from at least the initial data group, authorize only D successive deliveries of the output data group on a first output interface of the device, D being a non-zero positive integer, and prevent any new generation of the output data group.