Patents Assigned to STMicroelectronics (Research & Development), Limited
  • SUBSTRATE EMBEDDED TIME OF FLIGHT SENSOR PACKAGING
    Publication number: 20190369246
    Abstract: A method begins with forming a first wiring layer on a substrate, forming a cavity in the substrate, and laminating a bottom side of the substrate so as to cover a bottom side of the cavity. Next, an integrated circuit is placed within the cavity of the substrate, and then a first optically transparent layer is disposed on the top surface of the substrate to cover a top surface of the integrated circuit. The first optically transparent layer has an aperture formed therein exposing at least a portion of the top surface of the integrated circuit. A second wiring layer is disposed on a top surface of the first optically transparent layer in a pattern that does not obstruct light traveling to or from the top surface of the integrated circuit. The integrated circuit is a laser emitting integrated circuit or a reflected light detector.
    Type: Application
    Filed: August 13, 2019
    Publication date: December 5, 2019
    Applicant: STMicroelectronics (Research & Development) Limited
    Inventor: William HALLIDAY
  • Single SPAD array ranging system
    Patent number: 10495736
    Abstract: In one embodiment, an imaging device includes a light-emitting device, a driving circuit, a return single-photon avalanche diode (SPAD) array and readout circuitry. The driving circuit generates a driving signal, and the light-emitting device generates an optical pulse based on the driving signal. The return SPAD array is configured to receive a first portion of the optical pulse that is reflected by an object in an image scene. The readout circuitry receives a signal indicative of the received first portion of the optical pulse, and a signal indicative of the driving signal, and determines a distance between the imaging device and the object based on a difference between a time of receiving the signal indicative of the received first portion of the optical pulse and a time of receiving the signal indicative of the driving signal.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: December 3, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventors: Caixin Zhuang, John Kevin Moore
  • Sensing apparatus having a light sensitive detector field
    Patent number: 10473518
    Abstract: A sensing apparatus includes a sensor and a processor. The sensor includes at least one light sensitive detector. The processor determines a first control value to control a voltage differential across the at least one light sensitive detector, and compares the first control value with a reference value associated with a reference temperature. Based on the comparison, the processor provides adjustment information for adjusting at least one output of the sensing apparatus, and an operating parameter of the sensing apparatus other than the voltage differential.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: November 12, 2019
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventors: Iain Scott, Sam Lee
  • Proximity sensor package having one or more grooves in a module cap
    Patent number: 10473764
    Abstract: A sensor package may include a source configured to emit a signal, a detector configured to receive a first reflection of the signal, and an isolator disposed between the source and the detector, where a surface of the isolator has one or more grooves configured to direct a second reflection of the signal away from the detector.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: November 12, 2019
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventor: Christopher Townsend
  • Wafer level microstructures for an optical lens
    Patent number: 10473834
    Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: November 12, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventors: Kevin Channon, James Peter Drummond Downing, Andy Price
  • Vehicle communications using visible light communications
    Patent number: 10461858
    Abstract: An apparatus has a pixel array arrangement having a number of photosensitive detectors. Processing circuitry is configured to process data captured by at least one pixel of the array to provide image information and detect data on an encoded pulsed light signal. In a specific embodiment, data is captured at a vehicle. Information for the vehicle is determined based on the encoded pulsed light signal.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: October 29, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventors: Jeffrey M. Raynor, Duncan Hall
  • Optical pulse emitter
    Patent number: 10454246
    Abstract: An optical pulse emitter includes a light emitting device having a first node coupled to an intermediate node via a first switch. The intermediate node is coupled to a supply voltage node via a second switch. A capacitor is coupled to the intermediate node. The first, second and third switches are controlled by a control circuit. During a first phase, the second switch is actuated to couple the capacitor to the supply voltage node. During a second phase, the second switch is deactuated and the first switch is actuated to at least partially discharge the capacitor through the light emitting device. During a third phase, discharge current from the capacitor bypasses around the light emitting device.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: October 22, 2019
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) Limited
    Inventors: Nicolas Moeneclaey, Shatabda Saha
  • ELECTRONIC MODULE INCLUDING AN AMBIENT LIGHT SENSOR STACKED OVER A PROXIMITY SENSOR
    Publication number: 20190316959
    Abstract: An electronic module includes an ambient light sensor and a proximity sensor. The ambient light sensor includes an ambient light photodetector. The proximity sensor includes an infrared photoemitter, a reference infrared photodetector and another infrared photodetector. The ambient light sensor is arranged in a stack over the proximity sensor with a position that allows infrared photons transmitted by the infrared photoemitter to be received by the reference infrared photodetector.
    Type: Application
    Filed: April 8, 2019
    Publication date: October 17, 2019
    Applicants: STMicroelectronics (Research & Development) Limited, STMicroelectronics (Grenoble 2) SAS
    Inventors: William HALLIDAY, Eric SAUGIER, Roy DUFFY
  • Ranging apparatus
    Patent number: 10436581
    Abstract: A distance sensing apparatus includes a light source configured to emit polarized light. A light sensitive detector detects light emitted by said light source and reflected from a target. The light sensitive detector is configured to substantially prevent polarized light reflected from a target with a relatively high reflectance from being detected.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: October 8, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventors: Sam Lee, John Kevin Moore, Francescopaolo Mattioli Della Rocca
  • Photonics device
    Patent number: 10436881
    Abstract: A method may include generating, within a device, separate and discrete wavelengths, and generating light intensity profiles based on an interaction between the separate and discrete wavelengths and a multi-wavelength diffractive optic element. The method may include detecting an object from light reflected from the object using the light intensity profiles. The light intensity profiles may include a shorter range light intensity profile and a longer range light intensity profile, each light intensity profile having different energy per solid angle patterns.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: October 8, 2019
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventors: James Peter Drummond Downing, Adam Caley
  • Substrate embedded time of flight sensor packaging
    Patent number: 10422877
    Abstract: Disclosed herein is an electronic device having a substrate, and an integrated circuit disposed within the substrate and having a top surface. The integrated circuit may be a laser emitting integrated circuit or a reflected light detector. A first interconnect layer is formed on the top surface of the substrate. A first optically transparent layer is formed on the top surface of the substrate and covering the top surface of the integrated circuit. A second interconnect layer is formed on a top surface of the first optically transparent layer. The second interconnect layer is patterned so as to not obstruct light traveling to or from the top surface of the integrated circuit through the first optically transparent layer.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: September 24, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventor: William Halliday
  • STACKED WAFER ARRANGEMENT FOR GLOBAL SHUTTER PIXELS UTILIZING CAPACITIVE DEEP TRENCH ISOLATIONS
    Publication number: 20190288023
    Abstract: Described herein is an electronic device that includes a first integrated circuit die having formed therein at least one photodiode and readout circuitry to convert charge generated by the at least one photodiode to a read voltage and to selectively output the read voltage. A second integrated circuit die is in a stacked arrangement with the first integrated circuit die and has formed therein storage circuitry to selectively transfer the read voltage to at least one storage capacitor for storage as a stored voltage and to selectively transfer the stored voltage to an output. The at least one storage capacitor is formed from a capacitive deep trench isolation. There is an interconnect between the first and second integrated circuit dies for coupling the readout circuitry to the storage circuitry.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 19, 2019
    Applicant: STMicroelectronics (Research & Development) Limited
    Inventor: Jeffrey M. Raynor
  • Ranging device read-out circuit
    Patent number: 10416294
    Abstract: A ranging device includes an array of photon detection devices that receive an optical signal reflected by an object in an image scene and first and second logic devices to respectively combine the outputs of first and second pluralities of the photon detection devices. First and second counter circuits are respectively coupled an output of the first and second logic devices and generate first and second count values respectively by counting the photon detection events generated by the first and second pluralities of photon detection devices. A range estimation circuit estimates the range of the object by estimating the timing of one or more pulses of said optical signal based on the first and second count values.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: September 17, 2019
    Assignees: STMicroelectronics (Research & Development) Limited, STMicroelectronics (Genoble 2) SAS
    Inventors: Pascal Mellot, Stuart McLeod, Marc Drader
  • Near ultraviolet photocell
    Patent number: 10418402
    Abstract: In an embodiment, an image sensor includes a semiconductor substrate, an epitaxial layer disposed over the semiconductor substrate, a first heavily doped region disposed in the epitaxial layer, and a shallow trench isolation region disposed in the epitaxial layer and surrounding the first heavily doped region. The semiconductor substrate and the epitaxial layer are of a first doping type and the semiconductor substrate is coupled to a reference potential node. The first heavily doped region is of a second doping type opposite to the first doping type. The epitaxial layer, the first heavily doped region, and the shallow trench isolation region are part of a p-n junction photodiode configured to operate in the near ultraviolet region.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 17, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventor: Jeffrey M. Raynor
  • ENCAPSULATING COVER FOR AN ELECTRONIC PACKAGE AND FABRICATING PROCESS
    Publication number: 20190280130
    Abstract: Encapsulating cover for an electronic package is formed by a cover body having a front wall and, positioned around a through-passage, a mounting face that includes a bearing surface. A mounting face of an optical element bears against the bearing surface. The mounting face includes at least one local void that is set back with respect to the bearing surface to provide a space between the mounting face of the optical element and the bottom of the local void. The local void extends beyond an edge of the optical element. A drop of fastening adhesive extends locally into said local void and has a portion that is covered by the optical element and an uncovered portion that is located beyond the edge of the optical element.
    Type: Application
    Filed: March 7, 2019
    Publication date: September 12, 2019
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Research & Development) Limited
    Inventors: Karine SAXOD, Nicolas MASTROMAURO, Colin CAMPBELL
  • Deep trench isolation (DTI) bounded single photon avalanche diode (SPAD) on a silicon on insulator (SOI) substrate
    Patent number: 10388816
    Abstract: A semiconductor on insulator substrate includes a semiconductor support layer, a buried insulating layer over the semiconductor support layer and an epitaxial semiconductor layer over the buried insulating layer. A deep trench isolation penetrates completely through the epitaxial semiconductor layer to the buried insulating layer to electrically insulate a first region of the epitaxial semiconductor layer from a second region of the epitaxial semiconductor layer. A single photon avalanche diode (SPAD) includes an anode formed by the first region of the epitaxial semiconductor layer and a cathode formed by a well located within the first region of the epitaxial semiconductor layer. An ancillary circuit for the SPAD is located in the second region of the epitaxial semiconductor layer and electrically coupled to the SPAD.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: August 20, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventor: Bruce Rae
  • Charge storage cell and method of manufacturing a charge storage cell
    Patent number: 10347680
    Abstract: A charge storage cell includes a semiconductor region having charge carriers of a first conductivity type, a first deep trench isolation structure, and a charge storage region located adjacent to the first deep trench isolation structure. The charge storage region has charge carriers of a second conductivity type different to the first conductivity type and extends along substantially all of the first deep trench isolation structure. A second deep trench isolation structure is located adjacent to the charge storage region and opposite the first deep trench isolation structure.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: July 9, 2019
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventor: Laurence Stark
  • Devices and methods for transmitting and receiving in an optical communications system
    Patent number: 10333626
    Abstract: An embodiment device includes an optical source configured to generate an optical carrier including an optical pulse train; and a modulator configured to modulate an amplitude of the optical pulse train, based on data generated by a data source, to produce a modulated optical signal.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: June 25, 2019
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventors: Neale Dutton, Denise Lee, Graeme Storm
  • Single photon avalanche diode (SPAD) array including distributed or tree for readout
    Patent number: 10332930
    Abstract: A device includes an array of single photon avalanche diodes (SPADs) and a plurality of pulse shapers. Each of the SPADs are electrically coupled to a respective SPAD quench circuit. Each of the pulse shapers have an input electrically coupled to an output of a respective SPAD quench circuit.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: June 25, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventors: Bruce Rae, Ivan Ivanov
  • Secure communications using SPAD ToF systems
    Patent number: 10313356
    Abstract: A ToF SPAD based range detecting module is configurable for operation in a first mode to make a distance determination relative to an object within a field of view. The ToF SPAD based range detecting module is further configurable for operation in a second mode to engage in bi-directional data communication with another apparatus within the field of view.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: June 4, 2019
    Assignee: STMicroelectronics (Research & Development) Limited
    Inventor: Jeffrey M. Raynor