Abstract: A switching converter converts an input signal to a regulated output signal using a switch and a transformer with a primary winding and a secondary winding. A wake up management circuit receives a transformer demagnetization signal and forces by wake up pulses the switch on when the switching converter operates in a burst mode. Sampled values of the transformer demagnetization signal are received. A setting circuit sets a first peak value of the current of the primary winding. A comparison circuit compare the sampled values with a voltage threshold and the preceding sampled value. In response thereto, the first peak value of the primary winding current is either maintained or a new peak value is set.

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

Abstract: A converter includes an inductor configured to receive an input signal and output configured to supply an electrical load with an output signal. The converter operates to charge the inductor until a maximum pre-set current value is reached during a first operating condition in which the electrical load is not supplied. Next, the converter actively supplies the electrical load by partially discharging the inductor during a first time interval of a second operating condition. Then, the converter passively supplies the electrical load by the residual charge of the inductor during a second time interval, subsequent to the first time interval, of the second operating condition, by discharging the inductor completely.

Abstract: An apparatus includes first and second oscillator circuits. A transformer has a primary winding coupling the first oscillator circuit to the second oscillator circuit and a secondary winding. A first outgoing communications circuit is coupled to the second oscillator circuit and drives an amplitude modulated data signal thereto. A first incoming communications circuit is coupled to the primary winding of the transformer. A second outgoing communications circuit is coupled to the secondary winding drives an amplitude modulated data signal thereto. A second incoming communications circuit is coupled to the secondary winding. The secondary winding is magnetically coupled with the primary winding so the secondary winding receives an output power and an incoming data transmission based upon the amplitude modulated data signal, and so the primary winding receives an incoming high speed data transmission based upon the amplitude modulated data signal.

Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.

Abstract: Capacitance sensing circuits and methods are provided. The capacitance sensing circuit includes a capacitance-to-voltage converter configured to receive a signal from a capacitance to be sensed and to provide an output signal representative of the capacitance, an output chopper configured to convert the output signal of the capacitance-to-voltage converter to a sensed voltage representative of the capacitance to be sensed, an analog accumulator configured to accumulate sensed voltages during an accumulation period of NA sensing cycles and to provide an accumulated analog value, an amplifier configured to amplify the accumulated analog value, and an analog-to-digital converter configured to convert the amplified accumulated analog value to a digital value representative of the capacitance to be sensed. The analog accumulator may include a low pass filter having a frequency response to filter wideband noise.

Abstract: A method of predicting the orbit of a satellite of a satellite positioning system, including: associating first and second types of satellites with first and second models of celestial mechanics forces, respectively; storing first ephemerides data of a satellite, associated to first time intervals and second ephemerides data associated to second time intervals. Further, the method comprises: calculating reference satellite positions based on the first ephemerides data; estimating first and second satellite positions in the first time intervals by using the second ephemerides data and the first and second forces models, respectively; determining first and second estimate errors by comparing the reference positions with the first and second positions, respectively; and detecting the type of satellite between the first and second types by an analysis of the first and second errors.

Abstract: An electronic device includes a chip with an integrated electronic component and a terminal made of a first metal material. The device further includes a lead made of a second metal material different from the first metal material. A bonding wire made of a selected one of the first and second metal materials has opposite ends coupled with the terminal and the lead. An interface element having a first layer made of a selected one of the first and second metal materials and a second layer made of an unselected one of the first and second metal materials has the first layer coupled with the bonding wire and the second layer coupled with a component, wherein the component is ether the terminal or the lead.

Abstract: A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Abstract: A multi-level shifter includes a first branch having first and second transistors coupled between a higher voltage terminal and a lower voltage terminal. The multi-level shifter comprises a second branch, in parallel with the first branch, having: a third transistor, coupled between said higher voltage reference terminal and an output node, a fourth switching transistor coupled between said output node and said lower voltage terminal. Said third and fourth transistors have respective control terminals controlled by drain terminals of said first and second transistors, respectively. The shifter includes a bidirectional battery coupled between said drain terminals of said first and second transistors to supply first and second voltages having the same magnitude and different polarities. Said fourth transistor is controlled according to the first voltage when said first transistor is turned on and said third transistor is controlled according to the second voltage when said second transistor is turned on.

Abstract: A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane.

Abstract: An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips.

Abstract: A packaged MEMS transducer device comprising: a die, including: a semiconductor body having a front side and a back side, opposite to one another in a first direction, at least one cavity extending through the semiconductor body between the front side and the back side, and at least one membrane extending on the front side at least partially suspended over the cavity; and a package designed to house the die on an inner surface thereof. The transducer device moreover includes a sealing layer extending on the back side of the semiconductor body for sealing the cavity, and includes a paste layer extending between the sealing layer and the inner surface of the package for firmly coupling the die to the package.

Abstract: A system, such as a System-on-Chip includes an interface component or PLUG which generates transactions over an IP block, such as an interconnect serving one or more clients via virtual channels. The client or clients are mapped onto the virtual channels via client/virtual channel mappings. The virtual channels are provided as a first set of virtual channels in the interface component which cooperate with a second set of virtual channels in the IP block. First and second client/virtual channel mappings for the first set of virtual channels and the second set of virtual channels are provided. The first and second client/virtual channel mappings are separately programmable and mutually decoupled from one another.

Abstract: An embodiment for encoding digital images includes: partitioning the images into image blocks, subjecting the image blocks to transform into the frequency domain, and, possibly after thresholding resulting in lossy encoding, subjecting the image blocks transformed into the frequency domain to variable length coding to produce compressed encoded image blocks. Transform into the frequency domain may be, e.g., via wavelet transform, such as Haar wavelet transform, and variable length coding may be via Exponential-Golomb codes. An embodiment may also be adapted for transferring picture data over a bus in a system such as, e.g., a System-on-Chip (SoC) by generating compressed encoded image blocks for transfer over the bus and decoding compressed encoded image blocks transferred over the bus.

Abstract: A z-axis micro-electro-mechanical detection structure, having a substrate defining a plane and a suspended mass carried by two anchorage elements. The suspended mass includes a translating mass, suspended over the substrate, mobile in a transverse direction to the plane and arranged between the anchorage elements and two tilting masses, each of which is supported by the anchorage elements through respective elastic anchorage elements so as to be able to rotate with respect to respective oscillation axes. The oscillation axes are parallel to each other to enable a translation movement of the translating mass. Fixed electrodes face at a distance the tilting masses or the translating mass so as to be able to detect displacement of the suspended mass as a result of external forces. Elastic supporting elements are arranged between the translating mass and the tilting masses to enable relative rotation between the translating mass and the tilting masses.

Abstract: Applicant has recognized and appreciated the desirability of powering an actuator using power drawn from one or both of an energy storage device and a spindle motor. In some embodiments, following a loss of external power to a hard disk drive, the hard disk drive (or one or more components thereof) determines whether to provide the actuator with power drawn from the spindle motor or to provide the actuator with power drawn from the spindle motor and from the energy storage device. In some embodiments, the hard disk drive (or the component(s) thereof) may additionally or alternatively determine whether to charge the energy storage device using power drawn from the spindle motor. In some embodiments, the drive may make the determinations based on an amount of power that the actuator is to consume at a time and an amount of power that the spindle motor can provide at the time.

Abstract: An integrated magnetic sensor formed by a semiconductor chip having a surface and accommodating a magnetic via and a sensing coil. The magnetic via is formed by a cylindrical layer of ferromagnetic material that extends perpendicular to the surface of the first chip and has in cross-section an annular shape of a circular or elliptical or curvilinear type. The sensing coil surrounds the magnetic via at a distance and is connected to an electronic circuit.

Abstract: An embodiment of a motor controller includes first and second supply nodes, a motor-coil node, an isolator, a motor driver, and a motor position signal generator. The isolator is coupled between the first and second supply nodes, and the motor driver is coupled to the second supply node and to the motor-coil node. The motor position signal generator is coupled to the isolator and is operable to generate, in response to the isolator, a motor-position signal that is related to a position of a motor having at least one coil coupled to the motor-coil node. By generating the motor-position signal in response to the isolator, the motor controller or another circuit may determine the at-rest or low-speed position of a motor without using an external coil-current-sense circuit.