Abstract: An authentication method of a first module by a second module includes the steps of generating a first random datum by the second module to be sent to the first module, generating a first number by the first module starting from the first datum and by way of a private key, and generating a second number by the second module to be compared with the first number, so as to authenticate the first module. The step of generating the second number is performed starting from public parameters and is independent of the step of generating the first number.

Abstract: A capacitive humidity sensor includes a first electrode, a humidity sensitive dielectric layer, and a second electrode. The humidity sensitive dielectric layer is between the first and the second electrodes. The humidity sensitive dielectric layer is etched at selected regions to form hollow regions between the first and second electrodes.

Abstract: A method of testing integrated circuits, including establishing at least a first physical communication channel between a test equipment and an integrated circuit under test by having at least a first probe of the test equipment contacting a corresponding physical contact terminal of the integrated circuit under test; having the test equipment and the integrated circuit under test exchange, over said first physical communication channel, at least two signals selected from the group including at least two test stimuli and at least two test response signals, wherein said at least two signals are exchanged by means of at least one modulated carrier wave modulated by the at least two signals.

Abstract: A spark plug, including an insulator embedding a first metallic electrode axially extending therethrough from a high voltage outer end terminal to the center of the inner end of the insulator from which it protrudes; a metallic ground electrode isolated from the first electrode and having an extended inner termination facing toward the first electrode extending from the insulator tip for defining therebetween a spark gap, a resistive element connected to the ground electrode such that upon mounting the spark plug in an internal combustion engine, the ground electrode electrically connects to the engine body through the resistive element; and to a second outer termination of the ground electrode, adapted to constitute an accessible sensing terminal.

Abstract: There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.

Abstract: A semiconductor structure including a high-voltage transistor; voltage dropping circuitry, at least part of which is overlapping the high-voltage transistor; at least one intermediate contact point to the voltage dropping circuitry, connected to at least one intermediate position between a first and a second end of the voltage dropping circuitry; and at least one external connection connecting the at least one intermediate contact point to outside of the semiconductor structure.

Abstract: An embodiment of a method for reducing chroma noise in digital image data and of a corresponding image processor. Chrominance components are subjected to low-pass filtering. The strength of the low-pass filtering is modulated in accordance with the dynamic range of the luminance signal and the dynamic range of each of the two chrominance signals in order to avoid color bleeding at image-object edges. Moreover, the low-pass filtering is selectively applied to pixels with similar luminance and chrominance values only. A combination of down-sampling and up-sampling units is employed so that comparatively small filter kernels may be used for removing chroma noise with low spatial frequency.

Abstract: An integrated control circuit of a switch is described, which is adapted to open or close a current path; said integrated circuit includes a comparator to compare a first signal with a second signal representative of the current flowing through said current path. The comparator outputs a third variable signal between a low logic level and a high logic level according to whether said second signal is lower than said first signal or vice versa; the integrated circuit has a driver to generate a signal to drive said switch in response to the third signal, and is configured to detect a spike on the leading edge of said second signal and to blank said third signal for a first blanking time period which depends on a turn-on delay of said switch and a second blanking period which depends on the duration of said spike on the leading edge of said second signal.

Abstract: A sensing device includes a first current mirror configured to mirror a current flowing through a thermistor, a second current mirror configured to mirror a current flowing through a reference resistor a comparator configured to compare voltages on the thermistor and the resistor, and a counter configured to generate a control signal representative of a temperature difference based on the comparison. The control signal controls a mirroring ratio of the second current mirror. The sensing device may be employed to generate a droop current of a voltage regulator.

Abstract: A thin film amorphous silicon solar cell may have front contact between a hydrogenated amorphous silicon layer and a transparent conductive oxide layer. The cell may include a layer of a refractory metal, chosen among the group composed of molybdenum, tungsten, tantalum and titanium, of thickness adapted to ensure a light transmittance of at least 80%, interposed therebetween, before growing by PECVD a hydrogenated amorphous silicon p-i-n light absorption layer over it. A refractory metal layer of just about 1 nm thickness may effectively shield the oxide from the reactive plasma, thereby preventing a diffused defect when forming the p.i.n. layer that would favor recombination of light-generated charge carriers.

Abstract: A passive bond pad condition sense structure may be configured to be electrically stimulated and tested for detecting an anomalous or altered electrical characteristic caused by stress or aging of the bond pad capacitively coupled to it. The related bond pad condition testing or monitoring system may include relatively simple stimulating and sensing circuits that may be wholly embedded in the integrated circuit device.

Abstract: Solar thin film modules are provided with reduced lateral dimensions of isolation trenches and contact trenches, which provide for a series connection of the individual solar cells. To this end lithography and etch techniques are applied to pattern the individual material layers, thereby reducing parasitic shunt leakages compared to conventional laser scribing techniques. In particular, there may be series connected solar cells formed on a flexible substrate material that are highly efficient in indoor applications.

Abstract: A method of manufacturing an electronic device on a plastic substrate includes: providing a carrier as a rigid support for the electronic device; providing a metallic layer on the carrier; forming the plastic substrate on the metallic layer, the metallic layer guaranteeing a temporary bonding of the plastic substrate to the carrier; forming the electronic device on the plastic substrate; and releasing the carrier from the plastic substrate. Releasing the carrier comprises immersing the electronic device bonded to the carrier in a oxygenated water solution that breaks the bonds between the plastic substrate and the metallic layer.

Abstract: An analyzer for biochemical analyses includes a seat for receiving a recipient. A first light source and a second light source illuminate the recipient with a luminous radiation, respectively, in a first excitation band and in a second excitation band, including a first excitation wavelength and a second excitation wavelength of fluorophores of a first type and of a second type. A first image sensor and a second image sensor are oriented so as to receive light emitted by fluorophores contained in the recipient and are, respectively, provided with a first detection filter and a second detection filter, having, respectively, a first detection passband and a second detection passband, including, respectively, a first emission wavelength and a second emission wavelength of the fluorophores of the first type and of the second type.

Abstract: A semiconductor device may have a thickness, such that the semiconductor devices are not flexible, and may be bonded and electrically coupled on a flexible substrate. After this bonding, the semiconductor device may be thinned so as to be rendered flexible.

Abstract: The present invention concerns an audio amplifier circuit designed to provide an output signal to an audio transducer, said audio amplifier circuit comprising an audio power amplifier designed to receive an audio signal and designed to generate said output signal, a sensor designed to detect an audible sound having at least one noise component, to generate a detected signal. The audio amplifier circuit also includes a processing block configured to receive said detected signal at its input and to generate an off signal at its output, the latter being located at the input of said audio power amplifier. The processing block processes the detected signal according to said input signal to identify said noise component of said detected signal to generate a reference signal. The processing block generates the off signal when the value of said input signal is lower than the value of said reference signal.

Abstract: An analog-to-digital converter device may include an input multiplexer circuit having analog input terminals configured to receive a respective plurality of analog input signals. The input multiplexer circuit may be responsive to a first select input. The device may also include a trigger multiplexer circuit having input terminals configured to receive respective triggering signals. The trigger multiplexer circuit may be responsive to a second select input. Analog-to-digital converter circuitry may be configured to convert the selected analog signal into a digital signal. A sequence arbiter may be coupled to the first and second select inputs and may have input terminals configured to receive a respective plurality of conversion sequence configuration signals. The sequence arbiter may be configured to manage each conversion sequence of the analog-to-digital converter circuitry based upon the relative conversion sequence configuration signal received, and control the conversion sequences.

Abstract: The trimming circuit includes a plurality of trimmable resistances that may be coupled among them, each resistance being connected in parallel to a respective fuse. The trimming circuit allows burning any number of fuses according to a fixed trimming sequence using only one or two dedicated pins because it includes an input diode-connected transistor and a plurality of trimming transistors of different sectional area, each connected to force current throughout a respective one of the shunt fuses and coupled to the input diode-connected transistor such to mirror the current flowing therethrough. The fuses of the trimming circuit may be burnt by applying a trimming voltage to the diode-connected input transistor with a voltage generator connected between a dedicated pin of the circuit and a terminal at a reference potential, such to force a current therethrough as long as the mirrored currents flowing throughout the fuses burn them.

Abstract: A method of performing a cryptographic operation including: receiving a plurality of binary input values; splitting the binary input values into a plurality of non-binary digits of base r, where r is an integer greater than 2 and not equal to a power of 2; and performing, by a cryptographic block on each of the plurality of non-binary digits, a different modulo r operation to generate at least one output digit) of base r.

Abstract: A biasing circuit may include an input configured to receive a supply voltage, a value of which is higher than a limit voltage. The biasing circuit may also include a control stage configured to generate first and second control signals with mutually complementary values, equal alternatively to a first value, in a first half-period of a clock signal, or to a second value, in a second half-period of the clock signal. The first and second values may be a function of the supply and limit voltages. The biasing circuit may also include a biasing stage configured to generate a biasing voltage as a function of the values of the first and second control signals. The first and second control signals may control transfer transistors for transferring the supply voltage to respective outputs, while the biasing voltage may be for controlling protection transistors to reduce overvoltages on the transfer transistors.