Abstract: A radiation-hard electronic device including a package structure, a semiconductor chip in a cavity within the package structure, an integrated circuit in the semiconductor chip, and structures for protection from radiation for protecting the integrated circuit from ionizing radiation. The structures for protection from radiation include a protective layer of gel, which occupies at least in part the cavity and coats the semiconductor chip.

Abstract: A device includes an interface and Time Division Multiple Access (TDMA) Medium Access Control (MAC) circuitry coupled to the interface. The TDMA MAC circuitry detects a beacon in a frame having a defined frame duration and determines a frame compensation value based on a start time of the frame, a reference start time of the frame, and a number of elapsed frames. A current frame duration value is determined based on the frame compensation value and the defined frame duration.

Abstract: A sensing element integrated in a semiconductor material chip has a sensing diode of a junction type configured to be reverse biased so that its junction capacitance is sensitive to the local temperature. A reading stage is coupled to the sensing element for detecting variations of the junction capacitance of the sensing diode and outputting a reading acquisition signal proportional to the local temperature of the sensing diode. The sensing diode has a cathode terminal coupled to a biasing node and an anode terminal coupled to a first input of the reading stage. The biasing node receives a voltage positive with respect to the first input of the reading stage for keeping the sensing diode reverse biased.

Abstract: A positioning apparatus includes: a reference device configured to provide a measured current motion angle of a vehicle; an inertial sensor configured to provide a current input angular rate of the vehicle and associated with at least one inertial sensor behavior parameter dependent on inertial sensor temperature; a temperature sensor configured to provide an input temperature variation of the inertial sensor on a time interval; and a digital estimator configured to recursively computing an estimated current motion angle of the vehicle and at least one previously estimated inertial sensor behavior parameter as function of: the measured current motion angle, a previously estimated motion angle, the current input angular rate, and the input temperature variation.

Abstract: In accordance with an embodiment, a memory includes: a memory element, a sense amplifier circuit configured to sense a difference during a sense operation between a sense current passing through the memory element and a reference current, and a margin current branch coupled in parallel with the memory element and configured to selectively add a margin current to the sense current.

Abstract: An integrated transformer includes a primary winding and a secondary winding each having a spiral planar arrangement coils. A dielectric portion of dielectric material is interposed between the primary winding and the secondary winding. A field plate winding is electrically coupled with the primary winding. The field plate winding includes at least one field plate coil having a first lateral extension greater than a second lateral extension of a primary outer coil of the primary winding. The field plate coil is superimposed in plan view to the primary outer coil of the primary winding.

Abstract: A substrate for mounting a semiconductor device includes an insulating layer having first and second opposed surfaces defining a thickness. First and second electrically conductive lands are included in the insulating layer. The first electrically conductive lands extend through the whole thickness of the insulating layer and are exposed on both the first and second opposed surfaces. The second electrically conductive lands have a thickness less than the thickness of the insulating layer and are exposed only at the first surface. Electrically conductive lines at the first surface of the insulating layer couple certain ones of the first electrically conductive lands with certain ones of the second electrically conductive lands. The semiconductor device is mounted to the first surface of the insulating layer. Wire bonding may be used to electrically coupling the semiconductor device to certain ones of the first and second lands.

Abstract: Systems and methods for switching on and off a power amplifier including a signal input receiving an input signal and a signal output providing an output signal. The power amplifier includes a control input receiving a gain control signal indicating a requested gain and a control input receiving a mute control signal indicating whether the signal output should be switched on or switched off. A control unit determines whether the signal output of the power amplifier should be switched on and/or off, and if switched on receives data identifying a switch-on ramp and if switched off receives data identifying a switch-off ramp. The control unit generates the mute control signal to switch on the signal output of the power amplifier on or off, and generates the gain control signal as a function of the data identifying the switch-on or switch-off ramp to thereby increase or decrease the gain control signal.

Abstract: A MEMS device includes a fixed structure and suspended structure including an internal structure and a first arm and a second arm. Each arm has a first end fixed to the fixed structure and a second end fixed to the internal structure. The ends are angularly arranged at a distance apart. Piezoelectric actuators mounted to the arms are driven so as to cause deformation of the arm and produce a rotation of the internal structure. In a resting condition, each of the first and second arms has a respective elongated portion with a respective concavity. The internal structure extends in part within the concavities of the elongated portions of the first and second arms.

Abstract: A rectifier cell includes a first cell branch and a second cell branch that extend in parallel between two opposite nodes receiving an a.c. signal. The first cell branch includes a first pair of transistors arranged with their current paths cascaded, with a first intermediate point in-between. The second cell branch includes a second pair of transistors arranged with their current paths cascaded, with a second intermediate point in-between. Each of the pairs of transistors includes a first transistor with a control terminal coupled to one of the two opposite nodes and a second transistor with a control terminal coupled to the other of the two opposite nodes. The bulks of the transistors receive voltages in order to vary the transistor threshold voltage by bringing the threshold voltage to a first value during forward conduction and to a second value during reverse conduction.

Abstract: A method detects current-limit events indicating a maximum current threshold of a switching converter has been reached, A compensation voltage is adjusted in response to the detected current-limit events, where the compensation voltage defines a duty cycle of the switching converter. A time for which no current-limit events have been detected is sensed, and the value of the compensation voltage adjusted in response to the detected time reaching a time step threshold.

Abstract: A micro-electro-mechanical actuator device includes a fixed structure and a mobile structure. The mobile structure includes a first deformable band, a second deformable band, and a third deformable band, both of which extend on opposite sides of the first deformable band, each of which carries a piezoelectric actuator. In a working condition, in which the second and third piezoelectrics are biased, the second and third deformable bands are subjected to a negative bending, while the first deformable band is subjected to a positive bending. There are thus generated two translations that add together, causing a displacement of the first deformable band greater than the one that may be obtained by a single membrane of an equal base area.

Abstract: A digital filter with a pipeline structure includes processing structures timed by respective clock signals. Each processing structure in turn is formed by a number of processing modules for processing input samples. A phase generator aligns the processing modules with the input samples so that each input sample is processed by a respective one of the processing modules. An up-sampling buffer and a down-sampling buffer are used when the processing structures operate at different clock frequencies (thus implementing different clock domains) so as to convert signal samples between the clock domains for processing in the processing structures.

Abstract: A dual-input, single-output low-dropout voltage regulator circuit includes: a first supply terminal, a second supply terminal and an output terminal, and first and second transistors having current paths coupled respectively between the first and second terminal and the output terminal. First and second drive circuit blocks are coupled respectively to the first and second supply terminals and drive the control terminals of the first and second transistors to provide a regulated voltage at the output terminal from the voltage on the first supply terminal and the second supply terminal. An input circuit block is sensitive to the voltage at the output terminal and is coupled to the first and second drive circuit blocks and configured to activate the second transistor to provide regulated voltage at the output terminal from the second terminal as a result of the voltage at the output terminal becoming lower than a desired value.

Abstract: Methods are directed to forming an electronic semiconductor device that includes a body having a first side and a second side opposite to one another and including a first structural region facing the second side, and a second structural region extending over the first structural region and facing the first side. A body region extends in the second structural region at the first side. A source region extends inside the body region and a lightly-doped drain region faces the first side of the body. A gate electrode is formed over the body region. A trench dielectric region extends through the second structural region in a first trench conductive region immediately adjacent to the trench dielectric region. A second trench conductive region is in electrical contact with the body region and source region. An electrical contact on the body is in electrical contact with the drain region through the first structural region.

Abstract: A sense structure may include sense amplifiers each having measuring and reference terminals for receiving a measuring and a reference current, respectively, output circuitry for providing an output voltage based upon the measuring and reference currents, and voltage regulating circuitry in cascade configuration for regulating a voltage at the measuring and reference terminals. The regulating circuitry may include measuring and regulating transistors and a reference regulating transistor having a first conduction terminal coupled with the measuring terminal and with the reference terminal, respectively, a second conduction terminal coupled with the output circuitry and a control terminal coupled with a biasing terminal. Biasing circuitry is for providing a biasing voltage to the biasing terminal, and common regulating circuitry is for regulating the biasing voltage. Each sense amplifier may also include local regulating circuitry for regulating the biasing voltage applied to the biasing terminal.

Abstract: In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment. To this end, a sacrificial mass of material that may evaporate/sublimate is dispensed on the sensitive region; the packaging mass is molded on the sacrificial mass; a through hole is formed in the packaging mass to extend as far as the sacrificial mass; the sacrificial mass is evaporated/sublimated through the hole.

Abstract: A control unit for a switching converter has an inductor element coupled to an input and a switch element coupled to the inductor element. The control unit generates a command signal with a switching period to control the switching of the switch element and to determine a first time period where an inductor current is flowing in the inductor element for storing energy and a second time period where energy is transferred to a load. The second time period has an end portion where the inductor current drops to zero. The control unit determines the duration of the first time period based on a comparison between a sensing voltage, indicative of the peak value of the inductor current, and a reference voltage. A pre-distortion stage pre-distorts the reference voltage in order to compensate for a corresponding distortion on an input current of the converter compared to a desired sinusoidal characteristic.

Abstract: Power and data are transmitted via a transformer including primary side and secondary side. A primary side signal is generated by coupling a first oscillator signal modulated with a data signal with a second oscillator signal that is selectively switched on and off. At the secondary side a secondary signal is generated. A demodulator demodulates the secondary signal to recover the data signal. A rectifier processes the secondary signal to recover a power supply signal controlled by switching on and off the second oscillator.

Abstract: A method for forming an electronic device includes embedding an integrated circuit die in a package including substrate of thermally conductive material with front and back surfaces and a through-hole. The die is sunk in the through-hole. A first insulating material layer covers the die front surface and the package front surface with first windows for accessing die terminals. Package terminals and package track are arranged on the first insulating layer. A second insulating material layer covers the first insulating layer and the package tracks with second windows for accessing the package terminals.