Patents Assigned to STMicroelectronics S.r.l.
  • Patent number: 10267849
    Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 23, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10267869
    Abstract: A MEMS triaxial magnetic sensor device includes a sensing structure having: a substrate; an outer frame, which internally defines a window and is elastically coupled to first anchorages fixed with respect to the substrate by first elastic elements; a mobile structure arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements and carries a conductive path for flow of an electric current; and an elastic arrangement operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and the arrangement of elastic elements, first, second, and third sensing movements in response to Lorentz forces from first, second, and third magnetic-field components, respectively. The first, second, and third sensing movements are distinct and decoupled from one another.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: April 23, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Giacomo Laghi, Giacomo Langfelder, Gabriele Gattere, Alessandro Tocchio, Dario Paci
  • Publication number: 20190113946
    Abstract: A first current proportional to absolute temperature flows in a first current line through a first p-n junction and a second p-n junction arranged in series. A cascaded arrangement of p-n junctions is coupled to the second p-n junction and includes a further p-n junction with a current flowing therethrough that has a third order proportionality on absolute temperature. A differential circuit has a first input coupled to the further p-n junction and a second input coupled to a current mirror from the first p-n junction, with the differential circuit configured to generate a bandgap voltage with a low temperature drift from a sum of first voltage (that is PTAT) derived from the first current and a second voltage (that is PTAT3) derived from the third current.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 18, 2019
    Applicant: STMicroelectronics S.r.l.
    Inventors: Germano NICOLLINI, Stefano POLESEL
  • Publication number: 20190115524
    Abstract: A MEMS piezoelectric device includes a monolithic semiconductor body having first and second main surfaces extending parallel to a horizontal plane formed by first and second horizontal axes. A housing cavity is arranged within the monolithic semiconductor body. A membrane is suspended above the housing cavity at the first main surface. A piezoelectric material layer is arranged above a first surface of the membrane with a proof mass coupled to a second surface, opposite to the first surface, along the vertical axis. An electrode arrangement is provided in contact with the piezoelectric material layer. The proof mass causes deformation of the piezoelectric material layer in response to environmental mechanical vibrations. The proof mass is coupled to the membrane by a connection element arranged, in a central position, between the membrane and the proof mass in the direction of the vertical axis.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 18, 2019
    Applicant: STMicroelectronics S.r.l.
    Inventors: Maria Fortuna BEVILACQUA, Flavio Francesco VILLA, Rossana SCALDAFERRI, Valeria CASUSCELLI, Andrea DI MATTEO, Dino FARALLI
  • Patent number: 10264667
    Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: April 16, 2019
    Assignees: STMicroelectronics, Inc., STMicroelectronics S.R.L., STMicroelectronics International N.V.
    Inventors: Simon Dodd, Joe Scheffelin, Dave Hunt, Steve Bush, Faiz Sherman
  • Patent number: 10262984
    Abstract: An optical integrated circuit device includes an electrically insulating substrate, an optical connection disposed at a boundary of the optical integrated circuit, and a first electrostatic discharge (ESD) protection structure in direct contact with and electrically coupled to the first waveguide. The optical connection includes a first waveguide. The first waveguide is disposed on the electrically insulating substrate and configured to transmit an optical signal. The first ESD protection structure is both electrically non-insulating and substantially optically transparent to the optical signal. An ESD diode including an anode and a cathode is electrically coupled to the first ESD protection structure. A ground connection is electrically coupled to the anode of the ESD diode.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: April 16, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Luca Maggi, Piero Orlandi
  • Publication number: 20190107584
    Abstract: A Hall sensor compensation circuit includes an input node configured for receiving a bias signal for a Hall sensor. A bias node provides to the Hall sensor a compensated bias signal. A compensation network coupled between the input node and the bias node has a gain inversely proportional to Hall mobility, ?n?, wherein the Hall sensing signal is temperature-compensated.
    Type: Application
    Filed: October 2, 2018
    Publication date: April 11, 2019
    Applicant: STMicroelectronics S.r.l.
    Inventors: Roberto Pio BAORDA, Paolo ANGELINI
  • Publication number: 20190107575
    Abstract: A testing architecture for integrated circuits on a wafer includes at least one first circuit of a structure TEG realized in a scribe line providing separation between first and second integrated circuits. At least one pad is shared by a second circuit inside at least one of the first and second integrated circuits and the first circuit. Switching circuitry is coupled to the at least one pad and to the first and second circuits.
    Type: Application
    Filed: December 6, 2018
    Publication date: April 11, 2019
    Applicant: STMicroelectronics S.r.l.
    Inventor: Alberto PAGANI
  • Patent number: 10257917
    Abstract: The power supply device comprises a supply transistor commanded by a command signal and providing electric power to a lighting module, and a driving means configured to selectively generate, depending on an instruction signal representative of the structure of said at least one lighting module, a first command signal able to command the supply transistor into an ohmic regime, a second command signal able to command the supply transistor into a pulse width modulation regime involving an alternation of ohmic regimes and blocked regimes, and a third command signal able to command the supply transistor into a saturated regime.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: April 9, 2019
    Assignees: STMicroelectronics (Alps) SAS, STMicroelectronics S.r.l., STMicroelectronics Application GmbH
    Inventors: Philippe Sirito-Olivier, Giovanni Luca Torrisi, Manuel Gaertner, Fritz Burkhardt
  • Patent number: 10257617
    Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: April 9, 2019
    Assignees: STMicroelectronics S.R.L., Omron Corporation
    Inventors: Takashi Kasai, Shobu Sato, Yuki Uchida, Igino Padovani, Filippo David, Sebastiano Conti
  • Patent number: 10254355
    Abstract: A magnetic field sensor includes a die and a current generator in the die. The current generator generates a driving current. A Lorentz force transducer is also formed in the die and coupled to the current generator to obtain measurements of a magnetic field based upon the Lorentz force. The magnetic field has a resonance frequency and the current generator drives the Lorentz force sensor with the driving current having a non-zero frequency different from the resonance frequency.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: April 9, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Giacomo Langfelder, Alessandro Tocchio, Dario Paci
  • Patent number: 10256356
    Abstract: Solar thin film modules are provided with reduced lateral dimensions of isolation trenches and contact trenches, which provide for a series connection of the individual solar cells. To this end lithography and etch techniques are applied to pattern the individual material layers, thereby reducing parasitic shunt leakages compared to conventional laser scribing techniques. In particular, there may be series connected solar cells formed on a flexible substrate material that are highly efficient in indoor applications.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: April 9, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Marina Foti, Noemi Graziana Sparta′, Salvatore Lombardo, Silvestra DiMarco, Sebastiano Ravesi, Cosimo Gerardi
  • Patent number: 10254338
    Abstract: A semiconductor device, for example an integrated circuit such as a microcontroller (MCU) or a digital signal processor (DSP), includes a semiconductor die coupled with a power supply line, a debug module coupled with the semiconductor die to exchange semiconductor die debug command and data signals with the semiconductor die, and a modem coupled with the power supply line. The debug module is arranged to convey the semiconductor die debug command and data signals over the power supply line.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 9, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Nicolas Bernard Grossier, Lorenzo Guerrieri, Giuseppe Livio Gobbato, Daniele Zerbini, Martina Cordoni, Pasqualina Fragneto
  • Patent number: 10254332
    Abstract: A for positioning a miniaturized piece includes a positioning structure that forms a first cavity designed to receive with play the miniaturized piece and a second cavity communicating with the first cavity. At least one electrical-contact terminal is provided facing the second cavity and is electrically coupleable to an electronic testing device designed to carry out an electrical test on the miniaturized piece. An actuator device causes a vibration of the positioning structure such that the vibration translates the miniaturized piece towards the second cavity until it penetrates at least in part into the second cavity.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 9, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Fabiano Frigoli, Giuseppe Ballotta, Massimo Greppi, Luca Giuseppe Falorni, Paolo Aranzulla
  • Patent number: 10255973
    Abstract: An embodiment memory device includes a memory array having a plurality of bit lines, a low-voltage connection path configured to connect, in an operational phase of the device, an access terminal to a selected local bit line of the plurality of bit lines, and a high-voltage connection path configured to connect, in the operational phase of the device, the access terminal to the selected local bit line, in parallel with the low-voltage connection path.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 9, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Davide Manfre, Cesare Torti, Fabio Enrico Carlo Disegni
  • Patent number: 10250150
    Abstract: A driving module of a resonant converter receives an enabling signal and a voltage across a switch of a secondary side, and generates a control signal for first and second switches of the secondary side. The driving module cyclically controls switches of a primary full-bridge switching stage and both switches of the secondary side. After a fixed time, the driving module turns off the low-side switch and turns on the high-side switch, waits for a rising edge of the enabling signal, waits for zero current in the secondary side switches, turns off the first switch via the control signal after a variable delay relative to the rising edge of the enabling signal, keeps the second switch on, waits for zero voltage across the first switch, switches back on the first switch via the control signal when the voltage measured across the first switch drops below a variable threshold.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: April 2, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Roberto Cardu, Massimiliano Picca, Lorenzo Trevisan, Cristian Porta
  • Patent number: 10250163
    Abstract: An inverse electrowetting harvesting and scavenging circuit includes a first substrate having first and second surfaces. An electrode is formed proximate the first surface and includes an insulating layer covering a surface of the electrode. An electromechanical systems device includes a moveable mass extending over the first surface of the first substrate that may be displaced relative to the first substrate in three dimensions responsive to external forces applied to the moveable mass. The movable mass includes a moveable electrode and a conductive fluid is positioned between the insulating layer of the electrode and the movable electrode.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: April 2, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventors: Sara Loi, Alberto Pagani
  • Patent number: 10250301
    Abstract: Disclosed herein is an article including a garment, with a network formed on the garment. The network includes a main node with a main wired antenna, and at least one intermediate node with an intermediate wired antenna to be magnetically coupled to a respective device for that intermediate node. An electrical line electrically couples the main node to the at least one intermediate node. At least one electronic device is magnetically coupled to the intermediate wired antenna. A power supply unit is magnetically coupled to the main node via the main wired antenna thereof.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: April 2, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Alberto Pagani
  • Patent number: 10250233
    Abstract: A semiconductor substrate includes a first portion and a second portion. The first portion of the substrate has a first deformation-stress sensor capable of supplying a first stress signal. The second portion of the substrate has a second deformation-stress sensor capable of supplying a second stress signal. The first stress signal and second stress signal are processed by a circuit to produce a compensation signal. The compensation signal is applied in feedback to one of the first and second stress signals to compensate for variations induced in said one of the first and second stress signals by stresses in the semiconductor substrate.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: April 2, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Giuseppe Scilla
  • Patent number: 10250172
    Abstract: An apparatus for detecting a position of a rotor of a DC motor with N phases having a plurality of windings. The apparatus includes circuitry to couple at least two of the windings between a supply voltage and a reference voltage according to a first current path and allow the current stored in the two windings to be discharged through a second current path. The circuitry is configured to force the at least two windings at a short circuit condition in the second current path. The apparatus also includes a measurement circuit configured to measure the time period of discharging the current stored in the two windings and a rotor position detector for detecting the rotor position based on the measured time period.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: April 2, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Michele Boscolo Berto