Abstract: One or more first signals and one or more second signals, wherein the second signal(s) are slowly varying or low frequency signals in comparison with the first signals and are converted from analog to digital by sampling the first signals and the second signals to produce samples thereof for analog-to-digital conversion, subjecting the samples of the first signals to conversion to digital at a certain conversion rate, subjecting the samples of the second signal to conversion to digital by segments so that these segments are subjected to conversion to digital along with the samples of the first signals at the respective conversion rate, and reconstructing digital converted samples of the second signal from the segments subjected to conversion to digital.

Abstract: An electrostatically actuated oscillating structure includes a first stator subregion, a second stator subregion, a first rotor subregion and a second rotor subregion. Torsional elastic elements mounted to the first and second rotor subregions define an axis of rotation. A mobile element is coupled to the torsional elastic elements. The stator subregions are electrostatically coupled to respective regions of actuation on the mobile element. The stator subregions exhibit an element of structural asymmetry such that the electrostatic coupling surface between the first stator subregion and the first actuation region differs from the electrostatic coupling surface between the second stator subregion and the second actuation region.

Abstract: It is described an integrated gas sensor device comprising a silicon substrate and an oxide layer on the silicon substrate, as well as a working electrode, a counter electrode and a reference electrode, on the oxide layer, the working electrode and the counter electrode having respective active area exposed to an environmental air through at least a plurality of first openings and a plurality of second openings in the oxide layer in correspondence of the working electrode and of the counter electrode, further comprising an electrolyte layer portion and a hydrogel layer portion on the electrolyte layer portion, the electrolyte and hydrogel layer portions having a same size, suitable to cover at least the working, counter and reference electrodes, the hydrogel layer portion acting as a “quasi solid state” water reservoir.

Abstract: A fluid ejection device, comprising: a first semiconductor body including an actuator, which is operatively coupled to a chamber for containing the fluid and is configured to cause ejection of the fluid; and a channel for inlet of the fluid, which extends in a first direction and has a section having a first dimension; and a second semiconductor body, which is coupled to the first semiconductor body and has an ejection nozzle configured to expel the fluid. The second semiconductor body further comprises a first restriction channel, which is fluidically coupled to the inlet channel, extends in a second direction orthogonal to the first direction and has a respective section with a second dimension smaller than the first dimension so as to form a restriction between the inlet channel and the chamber.

Abstract: A switching device including: a body of semiconductor material, which has a first conductivity type and is delimited by a front surface; a contact layer of a first conductive material, which extends in contact with the front surface; and a plurality of buried regions, which have a second conductivity type and are arranged within the semiconductor body, at a distance from the contact layer.

Abstract: An integrated MEMS structure includes a driving assembly anchored to a substrate and actuated with a driving movement. A pair of sensing masses suspended above the substrate and coupled to the driving assembly via elastic elements is fixed in the driving movement and performs a movement along a first direction of detection, in response to an external stress. A coupling assembly couples the pair of sensing masses mechanically to couple the vibration modes. The coupling assembly is formed by a rigid element, which connects the sensing masses and has a point of constraint in an intermediate position between the sensing masses, and elastic coupling elements for coupling the rigid element to the sensing masses to present a first stiffness to a movement in phase-opposition and a second stiffness, greater than the first, to a movement in phase, of the sensing masses along the direction of detection.

Abstract: A battery charger includes an input supply terminal configured to receive a supply signal and a battery terminal configured to be connected to a battery. A supply switching circuit is arranged between the battery terminal and the input supply terminal. A control device generates a control signal to control operation of the supply switching circuit. A fuel gauge device provide a digital estimation of a voltage signal across the battery. A correction device modifies the control signal in response to the digital estimation of the voltage signal across the battery if that digital estimation is outside of a value range between two thresholds.

Abstract: A control device controls a switching circuit for a converter. The switching circuit comprises a half-bridge having a high-side transistor and a low-side transistor. The control device comprises a controller configured to control turning on and turning off said two transistors, so that a square-wave voltage is applied to the transformer primary. The controller is configured to start switching the half-bridge by turning on the low-side transistor. The control device comprises a first timer configure to initially turn on the low-side transistor for a duration given by a first time period useful for pre-charging a bootstrap capacitor couplable to the middle point of the half-bridge, and a second timer configured to keep the low-side transistor and the high-side transistor turned off for a second time period immediately following the first time period and having a longer duration than the first time period.

Abstract: A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.

Abstract: A method of forming semiconductor devices, such as capacitive type MEMS acoustic transducers, in a semiconductor includes forming a mask layer on a back surface of the semiconductor wafer and removing first etch portions of the mask layer and scribe trench portions of the mask layer. Each scribe trench portion is positioned in the mask layer to define a corresponding scribe boundary of a plurality of the semiconductor devices being formed in the semiconductor wafer. Etching the semiconductor wafer through the first etch portions and the scribe trench portions may be done simultaneously to form external back chambers and scribe trenches, respectively, in the semiconductor wafer. The semiconductor wafer is then cut along cutting lines in the scribe trenches to singulate individual MEMS acoustic transducers. The etching through the first and second etch portions and the scribe trench portions are dry etching of the semiconductor substrate in one embodiment.

Abstract: A bi-synchronous electronic device may include a FIFO memory circuit configured to store data, and a first digital circuit coupled to the FIFO memory circuit and configured to operate based upon a first clock signal and a write pointer, write a data burst to the FIFO memory circuit, thereby causing a jump in the write pointer to a new position, and write a burst indicator associated with the new position in the FIFO memory circuit. The bi-synchronous electronic device may include a second digital circuit coupled to the FIFO memory circuit and configured to operate based upon a second clock signal different from the first clock signal, read from the FIFO memory circuit based upon a read pointer, and synchronize the read pointer to the write pointer based upon the burst indicator.

Abstract: An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer.

Abstract: To apply an anti-wetting coating to a substrate of a semiconductor material, a method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material.

Abstract: A digital-to-analog converter (DAC) may include a conversion block providing a first analog value. The DAC may also include an amplification block for receiving the first analog value and providing a second analog value amplified by an amplification factor. The amplification block may include a first input terminal for receiving the first analog value, a second input terminal, and an output terminal for providing the second analog value. The amplification block may also include a first capacitive element and a second capacitive element. The first and second capacitive elements may determine the amplification factor. The amplification block may further include a control unit for recovering a charge at a first terminal of the second capacitive element, and based thereon, the second analog value.

Abstract: An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer.

Abstract: A boost-type converter circuit includes a pair of converter switches that are alternatively switchable on and off. An inductor is coupled to the intermediate point between the converter switches. A driver module controls switching on and off of the converter switches in respond to a comparator output signal. A reference signal line provides to the comparator a reference signal, and an output feedback line provides to the comparator an output feedback signal. These signals are compared to each other to generate the comparator output signal for controlling the driver module. A low-pass filter network is coupled to the inductor and configured to provide a ripple current which is a low-pass filtered replica of the current through the inductor. An injector circuit injects the ripple current into the reference signal line coupled to the comparator.

Abstract: An electronic communications device includes a body of semiconductor material with an integrated electronic circuit, an inductive element, and a capacitive element. The capacitive element is formed by a first electrode and a second electrode positioned between the inductive element and the integrated electronic circuit. Tuning of the device circuitry is accomplished by energizing the inductive/capacitive elements, determining resonance frequency, and using a laser trimming operation to alter the structure of one or more of the first electrode, second electrode or inductive element and change the resonance frequency.

Abstract: A tensile stress measurement device is to be attached to an object to be measured. The tensile stress measurement device may include an IC having a semiconductor substrate and tensile stress detection circuitry, the semiconductor substrate having opposing first and second attachment areas. The tensile stress measurement device may include a first attachment plate coupled to the first attachment area and extending outwardly to be attached to the object to be measured, and a second attachment plate coupled to the second attachment area and extending outwardly to be attached to the object to be measured. The tensile stress detection circuitry may be configured to detect a tensile stress imparted on the first and second attachment plates when attached to the object to be measured.

Abstract: A MEMS sensor has at least a movable element designed to oscillate at an oscillation frequency, and an integrated measuring system coupled to the movable element to provide a measure of the oscillation frequency. The measuring system has a light source to emit a light beam towards the movable element and a light detector to receive the light beam reflected back from the movable element, including a semiconductor photodiode array. In particular, the light detector is an integrated photomultiplier having an array of single photon avalanche diodes.

Abstract: An electronic circuit drives a plurality of LED strings connected in series. The electronic circuit includes a regulation module corresponding to each LED string, with the regulation module connected to the cathode terminal of the corresponding LED string. Each regulation module is further coupled to receive a reference voltage in phase with a rectified a.c. voltage. The regulation modules execute in turn and in sequence a current-regulation phase as a function of a trend of the reference voltage. Each regulation module, when executing the current-regulation phase, functions to regulate the current that flows in the corresponding LED string and in any previous LED strings in the series connection so that the regulated current is proportional to the reference voltage.